EP0835524A1 - Cooling unit with pin elements - Google Patents
Cooling unit with pin elementsInfo
- Publication number
- EP0835524A1 EP0835524A1 EP97900948A EP97900948A EP0835524A1 EP 0835524 A1 EP0835524 A1 EP 0835524A1 EP 97900948 A EP97900948 A EP 97900948A EP 97900948 A EP97900948 A EP 97900948A EP 0835524 A1 EP0835524 A1 EP 0835524A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- kuhlkoφer
- pins
- cooling
- pin
- kühlkoφer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 57
- 239000002826 coolant Substances 0.000 claims abstract description 39
- 239000012212 insulator Substances 0.000 claims abstract description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 239000012777 electrically insulating material Substances 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000565 sealant Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920002449 FKM Polymers 0.000 description 1
- 229920013648 Perbunan Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- HAPOVYFOVVWLRS-UHFFFAOYSA-N ethosuximide Chemical compound CCC1(C)CC(=O)NC1=O HAPOVYFOVVWLRS-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a cooling element according to the preamble of claim 1
- the problem with such an arrangement is that the heat dissipation of any components on the outer surfaces of the cooler body is inhomogeneous.
- the flow path is short-circuited between the coolant inlet and coolant outlet. Hot zones therefore form on the outer surfaces.
- the heat resistance of the arrangement in DE 40 17 749 also has a high level Heat resistance of approx. 30 K / kW, which leads to overheating of the coolant
- the object of the invention is therefore to provide a cooling element with a pin arrangement which improves the flow conditions in the cooling element
- the local density of the pegs is chosen so that in the interior of the cooling element there is an essentially homogeneous flow resistance. Em short-circuiting of the flow path of the cooling medium is prevented, and the cooling medium flows evenly around the pegs
- the pegs attached to at least one inner surface have a tapering shape, the respective contact surface of a peg with an inner surface of the cooling body having the largest cross section of the peg. The thermal resistance of the arrangement is thus reduced
- the pins (5. 5 1 ) are arranged along the flow path with an opening angle of 40 ° to 60 °
- the Kuhlko ⁇ er invention is characterized by the flow-favorable design of the cones and by a high degree of fullness with cones in the Kuhlko ⁇ e ⁇ nnern
- the pins at least cohesively attached to the inner surface have a tapering shape, the respective contact surface of a pin with the inner surface of the cooling body having the largest cross-sectional area of the pin. The thermal resistance of the arrangement is thus reduced
- Fig 1 b eme top view of the inside of a cooler body with unevenly distributed cones
- FIG. 2 eme top view of the inside of another embodiment emer
- FIG. 3a shows a side view of a cooling body with consecutive pegs in longitudinal section
- FIG. 3b shows a view of another embodiment of a cooling body with consecutive pegs in longitudinal section.
- 4 shows the structure of a multi-part cooling body
- FIG. 5 shows a clamp for connecting the parts of a multi-part cooling body
- FIG. 1 a shows the side view of a cooling body 1 according to the invention with an upper and a lower part 2 and 2 '.
- the connections for coolant inlet 3 and coolant outlet 4 are indicated.
- the connections 3 and 4 can be arranged on opposite sides or on the same side.
- the two parts 2 and 2 'smd connected to each other and can eg be glued, sintered, screwed or clamped or connected to one another via an intermediate piece.
- the cooling body is, for example, suitable for liquid cooling media, but can also be used for gaseous cooling media
- a top view of the inner surface of the cooler body 2 of the cooler body 1 is shown, the wall being shown schematically by a circle.
- a large number of pins 5 are arranged on the inner surface of the cooler body part 2.
- the pins 5 are separated by channels 6 and are uneven Distributed over the inner surface of the Kuhlko ⁇ erteil 2
- the degree of fullness of the pin 5 in the area of the imaginary shortest connecting line 7 between the coolant inlet 3 and coolant outlet 4 is high, removed ge ⁇ ng, so that the flow resistance over the O
- the area with the higher cone density is at least as wide as the smaller the diameter of the cooling water inlet and outlet 3 and 4
- the resultant Narrow channel width is advantageous for the flow rate of the cooling medium.
- the arrangement has a narrow thermal resistance of only 20 K / kW
- the degree of fullness varies from 1 1 (cavity to volume fraction of material) to 2 1.
- the advantage then lies in the fact that for such a full degree, the manufacture of the tools for producing such a cooling body. e.g. by pressing and sintering ceramics, it is still simple. Any rejects by breaking out pins 5. 5 'or channels 6 are avoided.
- the flow rate is then 10 1 / ⁇ un large enough for the usual coolant flow rates for sufficient heat removal, but still small enough not to damage the Kuhlko ⁇ er 1 abrasively
- the degree of fullness can be achieved by omitting or adding pins 5. 5 ' or by enlarging or reducing pins 5, 5' or channels 6 or changing the pin size or channel size with unchanged channels 6 or pins 5, 5 * . that the maximum flow rate of the coolant along the channels 6 in each channel is not more than 50%, especially not more than 30%. is below or above the mean flow rate maximum
- the pins can have any shape per se. However, it turns out that a special base area of the pins 5, 5 'is particularly advantageous
- the middle part 2 is hollow and has connections 3 and 4 for the coolant. It is particularly advantageous if this middle part consists of metal (aluminum or copper or other cost-effective materials) or plastic. While ceramic bodies connect the coolant lines is technically complex This is considerably simplified in the arrangement according to the invention.
- the connections such as commercially available flange connections or sockets, can be attached, for example, by means of screw threads on the central part 2 "or connected to this by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19600164 | 1996-01-04 | ||
DE19600166 | 1996-01-04 | ||
DE1996100166 DE19600166A1 (en) | 1996-01-04 | 1996-01-04 | Cooling body |
DE1996100164 DE19600164A1 (en) | 1996-01-04 | 1996-01-04 | Cooling body |
PCT/EP1997/000002 WO1997025741A1 (en) | 1996-01-04 | 1997-01-02 | Cooling unit with pin elements |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0835524A1 true EP0835524A1 (en) | 1998-04-15 |
Family
ID=26021879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP97900948A Withdrawn EP0835524A1 (en) | 1996-01-04 | 1997-01-02 | Cooling unit with pin elements |
Country Status (4)
Country | Link |
---|---|
US (1) | US6039114A (en) |
EP (1) | EP0835524A1 (en) |
JP (1) | JP3090954B2 (en) |
WO (1) | WO1997025741A1 (en) |
Families Citing this family (73)
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US6230791B1 (en) | 1999-08-30 | 2001-05-15 | Electric Boat Corporation | Heat transfer cold plate arrangement |
US6729383B1 (en) * | 1999-12-16 | 2004-05-04 | The United States Of America As Represented By The Secretary Of The Navy | Fluid-cooled heat sink with turbulence-enhancing support pins |
US6796370B1 (en) * | 2000-11-03 | 2004-09-28 | Cray Inc. | Semiconductor circular and radial flow cooler |
US6578626B1 (en) * | 2000-11-21 | 2003-06-17 | Thermal Corp. | Liquid cooled heat exchanger with enhanced flow |
DE10102621B4 (en) * | 2001-01-20 | 2006-05-24 | Conti Temic Microelectronic Gmbh | power module |
DE10125636B4 (en) * | 2001-05-25 | 2004-03-25 | Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto | Cooler for electrical and / or electronic components |
JP3882994B2 (en) * | 2001-12-27 | 2007-02-21 | アイシン・エィ・ダブリュ株式会社 | Motor control unit cooling device |
US6679315B2 (en) * | 2002-01-14 | 2004-01-20 | Marconi Communications, Inc. | Small scale chip cooler assembly |
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DE4202024A1 (en) * | 1992-01-25 | 1993-07-29 | Abb Patent Gmbh | Insulated cooling box convecting lost heat from semiconductor components esp. in electric rail vehicle - has electrically insulating inner housing, highly impermeable to water vapour in annular edge region, and water-vapour permeable electrical seals |
DE4322933A1 (en) * | 1993-07-09 | 1995-01-12 | Abb Patent Gmbh | Liquid-cooling body with hydraulic coolant connection |
-
1997
- 1997-01-02 EP EP97900948A patent/EP0835524A1/en not_active Withdrawn
- 1997-01-02 JP JP09524831A patent/JP3090954B2/en not_active Expired - Fee Related
- 1997-01-02 WO PCT/EP1997/000002 patent/WO1997025741A1/en not_active Application Discontinuation
- 1997-01-02 US US08/894,988 patent/US6039114A/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
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See references of WO9725741A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP3090954B2 (en) | 2000-09-25 |
JPH11506873A (en) | 1999-06-15 |
WO1997025741A1 (en) | 1997-07-17 |
US6039114A (en) | 2000-03-21 |
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