EP0790625A3 - PTC-Element - Google Patents

PTC-Element Download PDF

Info

Publication number
EP0790625A3
EP0790625A3 EP97300947A EP97300947A EP0790625A3 EP 0790625 A3 EP0790625 A3 EP 0790625A3 EP 97300947 A EP97300947 A EP 97300947A EP 97300947 A EP97300947 A EP 97300947A EP 0790625 A3 EP0790625 A3 EP 0790625A3
Authority
EP
European Patent Office
Prior art keywords
electrodes
ptc
pair
insulating layers
printed board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97300947A
Other languages
English (en)
French (fr)
Other versions
EP0790625A2 (de
Inventor
Shoichi Daito Comm. Apparatus Co. Ltd. Sugaya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daito Communication Apparatus Co Ltd
Daito Tsushinki KK
Original Assignee
Daito Communication Apparatus Co Ltd
Daito Tsushinki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daito Communication Apparatus Co Ltd, Daito Tsushinki KK filed Critical Daito Communication Apparatus Co Ltd
Publication of EP0790625A2 publication Critical patent/EP0790625A2/de
Publication of EP0790625A3 publication Critical patent/EP0790625A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/028—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Conductive Materials (AREA)
EP97300947A 1996-02-13 1997-02-13 PTC-Element Withdrawn EP0790625A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2570296A JPH09219302A (ja) 1996-02-13 1996-02-13 Ｐｔｃ素子
JP25702/96 1996-02-13

Publications (2)

Publication Number Publication Date
EP0790625A2 EP0790625A2 (de) 1997-08-20
EP0790625A3 true EP0790625A3 (de) 1998-07-29

Family

ID=12173129

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97300947A Withdrawn EP0790625A3 (de) 1996-02-13 1997-02-13 PTC-Element

Country Status (2)

Country Link
EP (1) EP0790625A3 (de)
JP (1) JPH09219302A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6582647B1 (en) 1998-10-01 2003-06-24 Littelfuse, Inc. Method for heat treating PTC devices
US6628498B2 (en) 2000-08-28 2003-09-30 Steven J. Whitney Integrated electrostatic discharge and overcurrent device
US6640420B1 (en) 1999-09-14 2003-11-04 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU3292397A (en) * 1996-05-30 1998-01-05 Littelfuse, Inc. Ptc circuit protection device
US6020808A (en) * 1997-09-03 2000-02-01 Bourns Multifuse (Hong Kong) Ltd. Multilayer conductive polymer positive temperature coefficent device
JP3991436B2 (ja) * 1998-04-09 2007-10-17 松下電器産業株式会社 チップ形ｐｔｃサーミスタ
US6606023B2 (en) * 1998-04-14 2003-08-12 Tyco Electronics Corporation Electrical devices
TW487742B (en) 1999-05-10 2002-05-21 Matsushita Electric Ind Co Ltd Electrode for PTC thermistor, manufacture thereof, and PTC thermistor
JP3628222B2 (ja) * 2000-01-14 2005-03-09 ソニーケミカル株式会社 Ｐｔｃ素子の製造方法
JP3827514B2 (ja) * 2000-09-29 2006-09-27 Ｔｄｋ株式会社 ポリマーｐｔｃ素子
AUPR090300A0 (en) 2000-10-20 2000-11-16 AMC Technologies Pty Limited An electrical lead
JPWO2005064700A1 (ja) * 2003-12-26 2007-07-26 株式会社村田製作所 積層セラミック電子部品
JP4722131B2 (ja) 2004-08-05 2011-07-13 カソリック リミテッド 電気リードを製造する方法
CN104392938B (zh) * 2014-10-29 2017-04-19 禾邦电子(苏州)有限公司 半导体芯片封装方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0229286A1 (de) * 1985-12-17 1987-07-22 Siemens Aktiengesellschaft Elektrisches Bauelement in Chip-Bauweise
US4787135A (en) * 1986-03-31 1988-11-29 Nippon Mektron, Ltd. Method of attaching leads to PTC devices
EP0336497A1 (de) * 1988-04-05 1989-10-11 Koninklijke Philips Electronics N.V. Verfahren zum Herstellen eines Chipwiderstandes
US4959632A (en) * 1988-04-06 1990-09-25 Murata Manufacturing Co., Ltd. Organic PTC thermistor
WO1995034084A1 (en) * 1994-06-09 1995-12-14 Raychem Corporation Electrical devices

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0229286A1 (de) * 1985-12-17 1987-07-22 Siemens Aktiengesellschaft Elektrisches Bauelement in Chip-Bauweise
US4787135A (en) * 1986-03-31 1988-11-29 Nippon Mektron, Ltd. Method of attaching leads to PTC devices
EP0336497A1 (de) * 1988-04-05 1989-10-11 Koninklijke Philips Electronics N.V. Verfahren zum Herstellen eines Chipwiderstandes
US4959632A (en) * 1988-04-06 1990-09-25 Murata Manufacturing Co., Ltd. Organic PTC thermistor
WO1995034084A1 (en) * 1994-06-09 1995-12-14 Raychem Corporation Electrical devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6582647B1 (en) 1998-10-01 2003-06-24 Littelfuse, Inc. Method for heat treating PTC devices
US6640420B1 (en) 1999-09-14 2003-11-04 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
US6628498B2 (en) 2000-08-28 2003-09-30 Steven J. Whitney Integrated electrostatic discharge and overcurrent device

Also Published As

Publication number Publication date
EP0790625A2 (de) 1997-08-20
JPH09219302A (ja) 1997-08-19

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