EP0783830A1 - Elektrisches heizelement - Google Patents
Elektrisches heizelementInfo
- Publication number
- EP0783830A1 EP0783830A1 EP95930361A EP95930361A EP0783830A1 EP 0783830 A1 EP0783830 A1 EP 0783830A1 EP 95930361 A EP95930361 A EP 95930361A EP 95930361 A EP95930361 A EP 95930361A EP 0783830 A1 EP0783830 A1 EP 0783830A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heating element
- element according
- carrier
- electric heating
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005485 electric heating Methods 0.000 title claims 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 38
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 14
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 14
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 3
- 239000010703 silicon Substances 0.000 claims abstract description 3
- 238000003825 pressing Methods 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 230000007613 environmental effect Effects 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 2
- QQHSIRTYSFLSRM-UHFFFAOYSA-N alumanylidynechromium Chemical compound [Al].[Cr] QQHSIRTYSFLSRM-UHFFFAOYSA-N 0.000 claims description 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 claims description 2
- 239000010956 nickel silver Substances 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- 229910000990 Ni alloy Inorganic materials 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000007787 solid Substances 0.000 abstract description 6
- 229910010271 silicon carbide Inorganic materials 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000012799 electrically-conductive coating Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 description 1
- 229910001006 Constantan Inorganic materials 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910001000 nickel titanium Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 231100000563 toxic property Toxicity 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
Definitions
- the invention relates to an electrical heating element with the features of the preamble of claim 1.
- the heating element according to the invention is used in particular as a thermal shock-resistant plate heat exchanger, in particular as a plate.
- WO 91/10336 describes an electrical heating element which includes an electrically insulating support and an electrically conductive layer u attached thereon, electrical contacts being attached to the electrically conductive layer.
- Amorphous or polycrystalline silicon is used as the conductive layer.
- the conductive layer when flowing through the heat, generates heat that is emitted directly to the support.
- the carrier although electrically insulating, has heat-conducting properties. That is why beryllium oxide or aluminum nitrate is used in this publication as a carrier.
- This carrier must therefore be dimensioned relatively small. It typically has a thickness of 1 mm and a cross-sectional area of 5 cm '.
- a heat-conducting, preferably metallic body which absorbs the heat generated and thus acts as a so-called heat sensor. This body is generally formed by a massive plate.
- the bracket must ensure that the support plates move relative to the heat sink be temperature changes and still be in good contact with it.
- beryllium oxide or aluminum nitride as carrier plates has further disadvantages.
- beryllium oxide is highly toxic and must therefore be covered with a protective layer.
- the use of such heating elements in the household is unthinkable because of their toxic properties.
- aluminum nitride is not hot water resistant. This heating element also had to be covered with a protective layer, at least in the household area. Both materials also have a low impact resistance, so they are easily damaged.
- the heating element according to the invention has the advantage that it no longer has to be coupled to a further solid support serving as a heat sink, but rather that it can emit the heat generated directly to the object to be heated. Characterized the heating element is on the one hand simplifies BAULI c h and technically more feasible the instrumentss ⁇ other hand st degree increases.
- the heating surface load for the heating element according to the invention is in relation to the plate-shaped and massive support and not like the heating elements known from 91/10336 with regard to the small support plates.
- the electrically insulating support consists of silicon nitride (S13N4).
- This materia has high thermal shock resistance, high impact resistance and good hot water resistance, is harmless to health, hardly undergoes chemical reactions and is scratch-resistant.
- silicon nitride has an optimal behavior of the change in electrical resistance in relation to the change in temperature.
- the electrically insulating carrier consists of high-resistance silicon carbide (SiC), which also has very good mechanical, thermomechanical and chemical properties.
- the specific electrical resistance is approximately 10 13 ohm cm.
- a method for producing such a silicon carbide carrier is known.
- the silicon carbide is produced by means of a liquid phase smter process in which aluminum oxide and yttrium oxide are added as sintering additives.
- the support can also consist of other electrically insulating ceramics or, for example, of aluminum oxide (AI2O3).
- the layer or film serving as a heat source is preferably meandering and can consist of a wide variety of materials. Depending on the material, the layer is applied directly to the carrier using a sputtering process or it is vapor-deposited. In other embodiments, a film is first produced and then pressed onto the carrier by means of a pressing means.
- FIG. 1 shows a coated heating element according to the invention m viewed from below;
- Figure 2 shows the same heating element in the position of use as a hotplate in section
- Figure 3 is an exploded view of a heating element with a film and a pressure plate.
- the heating element shown schematically here has the shape of a circular plate, the shape being determined by a solid support 1.
- This carrier consists of an electrically insulating but heat-conducting ceramic, preferably of silicon nitride (S13N4).
- This plate typically has a cross-sectional area of 100-500 cm 'and a thickness of 1-5 mm. However, the dimensions vary depending on the area of application, which will be discussed later.
- an electrically conductive layer 2 is brought up. It preferably runs in a meandering shape over the entire surface of the carrier 2 in order to optimize the electrical resistance.
- This electrically conductive layer in this example consists of amorphous or polycrystalline doped silicon, as already known from publication WO 91/10336.
- Other electrically conductive layers are also suitable, wi for example metallic layers, in particular of chromium-nickel, chromium-nickel alloys, titanium or titanium nitride. The choice of the material of the electrically conductive layer depends on the given boundary conditions, which vary depending on the application.
- the electrically conductive layer 2 is preferably applied to the carrier 1 by means of a sputtering process or it is evaporated. In typical areas of application, their thickness is between a few tenths and a few micrometers.
- the electrically conductive layer 2 forms the heat source. It is provided with electrical contacts 3, which make it possible to connect a voltage source.
- the attachment of the electrical contacts 3 is particularly simplified when using silicon nitride as the carrier 1, since they can then be soldered directly onto the carrier, and because of the heat resistance of silicon nitride, even brazing processes can be used. If a voltage is applied, the current-carrying layer 2 generates heat, which is immediately released to the carrier 1. Since it is solid and has good heat shock resistance, it can be used as a heat sink.
- the carrier now absorbs the heat generated and passes it on to the object to be heated.
- the carrier in particular if it consists of silicon nitride, can typically be heated up to a temperature of 650 ° C. without long-term damage to the material occurring. However, peak temperatures up to 1650 ° C are possible.
- the heating element according to the invention is particularly suitable for use as a heat exchanger which is exposed to direct environmental influences, in particular water.
- a special area of application is the use as a hotplate.
- Such a hotplate is shown in the position of use in FIG.
- the layer 2 serving as a heat source is located on the underside of the carrier 1.
- the carrier 1 itself forms the hotplate. Since the carrier is made of silicon nitride, the object to be heated, here a pan P, can be placed directly on the carrier.
- the carrier 1 does not even need a protective layer because of its good material properties. Hardly anything can burn on the plate, and the carrier can also be cleaned with conventional cleaning agents, whereby abrasive rags can also be used.
- the hotplate according to the invention thus has significant advantages, not only in daily use but also in terms of energy balance. Tests have shown that when using the heating element according to the invention for heating 1.5 lite water to the boiling point, the energy consumption is reduced by up to _0.
- the object to be heated is placed directly on the carrier and the electrically conductive layer is on the underside of the carrier.
- the carrier does not necessarily have to be made of silicon nitride, but the use of other ceramics such as aluminum oxide is also possible.
- the heating elements can also be stacked in a sandwich. It is always essential that the carrier transfers the heat directly to the object to be heated, such as a pan, without another solid, heat-conducting carrier being arranged in between.
- the electrically conductive layer is covered with a further layer of silicon oxide (Si0 2 ) or silicon nitride (Si 3 N ⁇ ) in order to prevent oxidation z.
- the electrically conductive layer can also be coated with a thermally insulating layer.
- the meandering heat source consists of a foil 2 'which is made of metal or a metal alloy is.
- Preferred materials are constantan, aluminum chromium, nickel silver, copper-nickel alloys and steel. The choice of material depends on the desired temperature that should be achieved with this heating source.
- the film 2 ' has a thickness of 1 to 100 micrometers. This film 2 'is self-supporting even in a meandering shape, so that it can be produced separately from the carrier 1. It is punched in a simple manufacturing process. This significantly reduces the manufacturing costs and simplifies the production of the heating element.
- This film 2 ' is completely pressed onto the carrier 1 by means of a pressing means 4.
- This pressing means 4 is plate-shaped like the carrier 1 and here has at least approximately the same diameter.
- the mechanical and thermal properties of the pressing means must be such that a complete pressing of the film 2 'is guaranteed over the entire temperature range.
- the pressing means 4 preferably consists of a heat insulating material, in particular quartz or glass with a heat conduction coefficient of approximately 1 W / mK. As a result, the pressure medium also serves as thermal insulation. It is not imperative that the pressing means 4 have electrically insulating properties.
- the pressing means consists of electrically conductive material, there is an electrical insulating layer (not shown here) in the form of insulating paper or an insulating plate between the film 2 'and pressing means 4.
- an electrical insulating layer (not shown here) in the form of insulating paper or an insulating plate between the film 2 'and pressing means 4.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Resistance Heating (AREA)
- Cookers (AREA)
Description
Claims
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH285494 | 1994-09-20 | ||
CH285494 | 1994-09-20 | ||
CH2854/94 | 1994-09-20 | ||
CH41495 | 1995-02-13 | ||
CH414/95 | 1995-02-13 | ||
CH41495 | 1995-02-13 | ||
CH206995 | 1995-07-13 | ||
CH2069/95 | 1995-07-13 | ||
CH206995 | 1995-07-13 | ||
PCT/CH1995/000208 WO1996009738A1 (de) | 1994-09-20 | 1995-09-19 | Elektrisches heizelement |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0783830A1 true EP0783830A1 (de) | 1997-07-16 |
EP0783830B1 EP0783830B1 (de) | 1999-06-09 |
Family
ID=27172084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP95930361A Revoked EP0783830B1 (de) | 1994-09-20 | 1995-09-19 | Elektrisches heizelement |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0783830B1 (de) |
AT (1) | ATE181199T1 (de) |
AU (1) | AU3378695A (de) |
DE (1) | DE59506182D1 (de) |
DK (1) | DK0783830T3 (de) |
ES (1) | ES2135084T3 (de) |
WO (1) | WO1996009738A1 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19617319A1 (de) * | 1996-04-19 | 1997-10-23 | Inter Control Koehler Hermann | Verfahren sowie Einrichtung zur Regelung der Heizenergie einer Heizeinheit |
SE506968C2 (sv) * | 1996-07-25 | 1998-03-09 | Electrolux Ab | Keramisk spishäll och förfarande för framställning av filmskiktsbeläggning |
DE59813206D1 (de) * | 1997-01-10 | 2005-12-29 | Ego Elektro Geraetebau Gmbh | Kochsystem mit einer Kontaktwärme übertragenden Elektro-Kochplatte |
DE19814949C2 (de) * | 1997-05-07 | 2002-04-18 | Aeg Hausgeraete Gmbh | Gareinrichtung mit Induktionsbeheizung und Widerstandsbeheizung |
DE19746844C1 (de) * | 1997-10-23 | 1998-12-03 | Schott Glas | Anordnung eines keramischen Heizelementes als Kochzone in einer Aussparung einer Kochfläche |
DE19746845C1 (de) * | 1997-10-23 | 1998-12-03 | Schott Glas | Anordnung eines keramischen Heizelementes als Kochzone in einer Aussparung einer Fläche |
US6037574A (en) * | 1997-11-06 | 2000-03-14 | Watlow Electric Manufacturing | Quartz substrate heater |
DE19813996A1 (de) * | 1998-03-28 | 1999-10-07 | Aeg Hausgeraete Gmbh | Gareinrichtung mit einer Struktur zur Induktionsbeheizung und Widerstandsbeheizung |
DE19820108C2 (de) * | 1998-05-06 | 2001-03-15 | Schott Glas | Anordnung eines wärmeleitenden keramischen Trägers mit einem Heizkörper als Kochzone in einer Aussparung einer Kochfläche |
DE10008646A1 (de) | 2000-02-24 | 2001-09-13 | Kempten Elektroschmelz Gmbh | Beschichteter Formkörper aus Siliciumnitrid |
US8481896B2 (en) * | 2009-12-08 | 2013-07-09 | Phillip G. Quinton, Jr. | Heater plate with embedded hyper-conductive thermal diffusion layer for increased temperature rating and uniformity |
CN105509488B (zh) * | 2015-12-23 | 2017-09-12 | 西安超码科技有限公司 | 一种浸入式陶瓷电阻内加热装置 |
DE102016113815A1 (de) * | 2016-07-27 | 2018-02-01 | Heraeus Noblelight Gmbh | Infrarotflächenstrahler und Verfahren zur Herstellung des Infrarotflächenstrahlers |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3126989A1 (de) * | 1981-07-08 | 1983-01-27 | E.G.O. Elektro-Geräte Blanc u. Fischer, 7519 Oberderdingen | Kochplatte |
JPH0628248B2 (ja) * | 1984-04-20 | 1994-04-13 | 富士通株式会社 | 二段拡散炉 |
JPH0719643B2 (ja) * | 1984-10-26 | 1995-03-06 | 日本電装株式会社 | セラミツクスヒ−タおよびその製造方法 |
JPS60166469A (ja) * | 1985-01-21 | 1985-08-29 | Tdk Corp | 発熱ヘツド |
US4804823A (en) * | 1986-07-31 | 1989-02-14 | Kyocera Corporation | Ceramic heater |
JPS63278203A (ja) * | 1987-05-09 | 1988-11-15 | Oki Electric Ind Co Ltd | 発熱抵抗体 |
JPS63278201A (ja) * | 1987-05-09 | 1988-11-15 | Oki Electric Ind Co Ltd | 発熱抵抗体 |
JP2778598B2 (ja) * | 1989-06-23 | 1998-07-23 | 東京エレクトロン株式会社 | 加熱方法及び加熱装置 |
-
1995
- 1995-09-19 EP EP95930361A patent/EP0783830B1/de not_active Revoked
- 1995-09-19 AT AT95930361T patent/ATE181199T1/de not_active IP Right Cessation
- 1995-09-19 AU AU33786/95A patent/AU3378695A/en not_active Abandoned
- 1995-09-19 WO PCT/CH1995/000208 patent/WO1996009738A1/de active IP Right Grant
- 1995-09-19 ES ES95930361T patent/ES2135084T3/es not_active Expired - Lifetime
- 1995-09-19 DK DK95930361T patent/DK0783830T3/da active
- 1995-09-19 DE DE59506182T patent/DE59506182D1/de not_active Revoked
Non-Patent Citations (2)
Title |
---|
278203 (OKI ELECTRIC IND. CO. ) 15.November 1988, * |
PATENT ABSTRACTS OF JAPAN vol. 13 no. 106 (E-726) ,14.März 1989 & JP,A,63 * |
Also Published As
Publication number | Publication date |
---|---|
DK0783830T3 (da) | 1999-12-27 |
EP0783830B1 (de) | 1999-06-09 |
WO1996009738A1 (de) | 1996-03-28 |
ATE181199T1 (de) | 1999-06-15 |
DE59506182D1 (de) | 1999-07-15 |
ES2135084T3 (es) | 1999-10-16 |
AU3378695A (en) | 1996-04-09 |
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Legal Events
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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Effective date: 19970411 |
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17Q | First examination report despatched |
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