EP0744290B1 - Verfahren zur Herstellung von Ladungselektroden - Google Patents

Verfahren zur Herstellung von Ladungselektroden Download PDF

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Publication number
EP0744290B1
EP0744290B1 EP19960303395 EP96303395A EP0744290B1 EP 0744290 B1 EP0744290 B1 EP 0744290B1 EP 19960303395 EP19960303395 EP 19960303395 EP 96303395 A EP96303395 A EP 96303395A EP 0744290 B1 EP0744290 B1 EP 0744290B1
Authority
EP
European Patent Office
Prior art keywords
charge plate
substrate
patterning
conductive
charge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP19960303395
Other languages
English (en)
French (fr)
Other versions
EP0744290A3 (de
EP0744290A2 (de
Inventor
Brian Morris
James Harrison, Jr.
Greggory Ridgley
Kenneth Lind
Richard Sexton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kodak Versamark Inc
Original Assignee
Kodak Versamark Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kodak Versamark Inc filed Critical Kodak Versamark Inc
Publication of EP0744290A2 publication Critical patent/EP0744290A2/de
Publication of EP0744290A3 publication Critical patent/EP0744290A3/de
Application granted granted Critical
Publication of EP0744290B1 publication Critical patent/EP0744290B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/07—Ink jet characterised by jet control
    • B41J2/075—Ink jet characterised by jet control for many-valued deflection
    • B41J2/08—Ink jet characterised by jet control for many-valued deflection charge-control type
    • B41J2/085—Charge means, e.g. electrodes

Definitions

  • the present invention relates to continuous ink jet printers and, more particularly, to improved construction for the charge plate in such printers.
  • electrically conductive ink is supplied under pressure to a manifold region that distributes the ink to a plurality of orifices, typically arranged in a linear array(s).
  • the ink discharges from the orifices in filaments which break into droplet streams.
  • Individual droplet streams are selectively charged in the region of the break off from the filaments and charge drops are deflected from their normal trajectories. The deflected drops may be caught and recirculated, and the undeflected drops allowed to proceed to a print medium.
  • Drops are charged by a charge plate having a plurality of charging electrodes along one edge, and a corresponding plurality of connecting leads along one surface.
  • the edge of the charge plate having the charging electrodes is placed in close proximity to the break off point of the ink jet filaments, and charge is applied to the leads to induce charges in the drops as they break off from the filaments.
  • US-A-4223321 discloses a planar charge plate having individual charge electrodes uniformly spaced along one face thereof provided by cutting grooves along one face. The surfaces are metallized and printed circuit leads are formed leading from the grooves. The grooves are filled with an electrically conductive material.
  • the charge plate fabrication process according to the present invention wherein the charge plate fabrication technique allows for fabrication by conventional methods, such as thin film and thick film patterning. Past efforts to utilize these methods failed due to the inability to pattern over an edge.
  • the present invention overcomes previous failures because in the subject method the patterning of the top and the edge are separated, which allows for more flexibility in manufacturing. In addition, materials which are available for fabrication with the new technique have a lower etch rate.
  • the invention provides a method of fabricating a charge plate for an ink jet printer comprising the steps of providing a non-conductive charge plate substrate having an edge and a top; edge patterning the non-conductive charge plate substrate to define a charging face on the edge of the non-conductive charge plate substrate; completing a conductive path from the charging face to the top of the non-conductive charge plate substrate to create a charge plate; characterised by top patterning the charge plate by thin film or thick film patterning, to allow an electrical connection to the charge plate; coating the top patterned surface with a dielectric material.
  • a method of fabricating a charge plate for an ink jet printer allows for fabrication by conventional methods. Initially, a non-conductive charge plate substrate is provided, the substrate having an edge and a top. The substrate is then edge patterned to define a charging face on the edge of the non-conductive charge plate substrate. The conductive path from the charging face to the top of the charge plate substrate is completed by top printing on the top surface to define a wrap around.
  • a charge plate is created.
  • the charge plate is then top patterned, such as by photo sensitive thick film paste, to connect top electrical connections to the front edge for charging and deflecting.
  • a charge plate substrate 10 of Fig. 1 capable of being assembled into a charge plate coupon to form a charge plate assembly, is illustrated.
  • the charge plate substrate 10 is a non-conductive material, such as a dielectric or insulator material.
  • the charge plate substrate 10 is ceramic and fabricated from 96% aluminum oxide having a coefficient of thermal expansion (CTE) of 8.2x10 -6 /°C.
  • CTE coefficient of thermal expansion
  • a front surface or edge 11 of the substrate 10 is tapered away from perpendicularity with a top surface 14 by 2.5° such that in an assembled charge plate, the electrodes do not interfere with the trajectory of any deflected and/or caught droplets.
  • the front surface 11 is preferably flat to provide optimum charge and deflection.
  • the substrate 10 of Fig. 1 is edge patterned on its front edge 11 to define charge surfaces or charging face 12.
  • the charge surfaces 12 are defined by passing thick film conductive ink through an opening in a screen, i.e., silk screen printing, and/or thin metal foil, i.e., stencil printing, using standard processes in the thick film processing art.
  • the edge patterned substrate is dried and fired, for conductivity and durability. Drying typically occurs for approximately twenty minutes, at 150°C.
  • a typical recommended firing profile has the conductor layer fired in a belt furnace.
  • a sixty minute firing cycle with a peak temperature of 850°C for ten minutes is recommended.
  • Silk screening has the advantage of allowing for the creation of unusual patterns; while stenciling has the advantage of providing improved quality of printed lines and spaces without the wire mesh which can create problems when pushing ink through at high resolutions.
  • a gold thick film paste such as commercially available DuPont 5715 Gold Thick Film Paste, is preferable over nickel because gold is more chemically inert than nickel.
  • a conductive path is continued to top surface 14, to create a wrap around conductive path 16.
  • the wrap around 16 is also defined by thick film paste or printing techniques, such as printing, drying and firing steps.
  • the present invention applies thick film processing to make the electrical connection between the top surface 14 and the charging face 12.
  • Electrical connection from top surface 14 to the front surface 11 is achieved using electrical connection wrap arounds 12 and 16 during the wrap around process, which connects the front face electrical connections 12 to the top electrical connections 16. This involves direct metal to metal diffusion during the step of firing, prior to the step of top patterning, and following the steps of printing and drying, of the substrate.
  • top patterning 18 of the substrate is illustrated, subsequent to the steps of printing, drying, firing, and metal to metal diffusion, to create a charge plate.
  • Top patterning of the substrate can be by any suitable means, such as use of Fodel photoimageable materials as described in Proceedings of the 1993 International Symposium On Microelectronics.
  • Fodel technology is an extension of thick film paste technology, developed by combining inorganic components, metal powders, glass powders, metal oxides and refractory powders, used to make thick film dielectrics and conductors with the organic components, polymers, photoinitiators, monomers and stabilizers, used to make photoresist films for the printed wiring board industry. This combination results in photoimageable ceramic material that combines the well known reliability of ceramic materials with the ease of processing in conventional equipment, using mild aqueous chemistries, currently used in the printed wiring board industry.
  • the Fodel process is a combination of the conventional thick film and printed wiring board processes.
  • conventional thick or thin film processes and conventional printed circuit board processes can be used independently or in any suitable combination to achieve the patterning of the charge plate of the present invention.
  • the Fodel process is described herein for purposes of example only, and is not to be considered as limiting the invention.
  • the Fodel process begins with the application of a photoactive paste, such as a commercially available Fodel paste, to the desired substrate by blank screen printing.
  • a photoactive paste such as a commercially available Fodel paste
  • the paste is allowed to level at room temperature and is then dried, for example at a temperature of 80°C. After drying, the paste is exposed in UV light (with a typical maximum wavelength of approximately 360 nm) through the appropriate photomask to form a latent image.
  • the latent image in the materials is developed such as in a conveyorized, spray processor, for example using 1% aqueous Na 2 CO 3 solution.
  • the developed paste is then fired by conventional thick film methods.
  • the top patterned surface is coated with a material that has a high breakdown voltage and is pinhole free.
  • a preferred material is a dielectric material which sinters to the top patterned surface to make a good dielectric coating.
  • the dielectric coating may be any suitable dielectric such as commercially available DuPont 5704 Dielectric.
  • a charge plate fabrication process for fabricating a charge plate for an ink jet printer.
  • the non-conductive charge plate substrate 10 is provided and edge patterned to define a charging face on the edge of the substrate.
  • the patterned substrate is then dried and fired, before a conductive path is completed from the charging face to the top of the non-conductive charge plate substrate to create a charge plate.
  • the charge plate is then top patterned, such as by photoimageable thick film or thin film, to allow an electrical connection to the charge plate.
  • the top patterned surface is then coated with a dielectric material.
  • electrodes can be formed on the non-conductive charge plate substrate. Also, heat can be applied to the charge plate to maintain the charging electrodes at a predetermined differential temperature than the temperature of ink.
  • a resistor can be incorporated on the bottom surface of the charge plate to apply current and voltage for heating, thereby providing a resistive heater which is integral to the charge plate. Such an arrangement allows for improved transfer of heat to the charging electrodes.
  • the present invention is useful in the field of ink jet printing, and has the advantage of allowing for direct formation of a charge face. This provides the advantage of simplification of charge plate fabrication. Once the wrap around is complete, top patterning of the charge plate can be achieved by a variety of techniques such as etchable thick film process, traditional thin film process, hybridization of thick and thin film processes, and photoimageable thick film techniques.

Landscapes

  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)

Claims (5)

  1. Verfahren zum Herstellen einer Aufladeplatte für einen Tintenstrahldrucker, welches die folgenden Schritte enthält:
    a) Bereitstellen eines nicht leitfähigen Aufladeplattensubstrates (10), welches einen Rand (11) sowie eine Oberseite (14) aufweist,
    b) Aufbringen eines Musters am Rand des nicht leitfähigen Aufladeplattensubstrats (10), um eine Aufladefläche (12) an dem Rand (11) des nicht leitfähigen Aufladeplattensubstrats (10) zu bilden,
    c) Herstellen eines Leitweges (16) von der Aufladefläche (12) zu der Oberseite (14) des nicht leitfähigen Aufladeplattensubstrats (10), um eine Aufladeplatte zu erzeugen,
    gekennzeichnet durch
    d) Aufbringen eines Musters (18) auf der Oberseite der Aufladeplatte durch Bilden eines Dünnschicht- oder Dickschichtmusters, um eine elektrische Verbindung mit der Aufladeplatte zu ermöglichen,
    e) Beschichten der oberen, mit einem Muster versehenen Oberfläche mit einem dielektrischen Material.
  2. Verfahren zum Herstellen einer Aufladeplatte nach Anspruch 1,
    bei dem der Schritt des Aufbringens eines Musters (18) auf der Oberseite der Aufladeplatte den Schritt des Aufbringens eines Musters auf der Oberseite durch Aufbringen eines belichtbaren Dickschichtmusters enthält.
  3. Verfahren zum Herstellen einer Aufladeplatte nach Anspruch 1,
    bei dem das nicht leitfähige Aufladeplattensubstrat (10) 96 % Aluminiumoxid enthält.
  4. Verfahren zum Herstellen einer Aufladeplatte nach Anspruch 1,
    weiterhin enthaltend den Schritt des Bildens von Elektroden auf dem nicht leitfähigen Aufladeplattensubstrat (10).
  5. Verfahren zum Herstellen einer Aufladeplatte nach Anspruch 4,
    weiterhin enthaltend den Schritt des Bereitstellens einer integralen Widerstandsheizeinrichtung an der Aufladeplatte.
EP19960303395 1995-05-26 1996-05-14 Verfahren zur Herstellung von Ladungselektroden Expired - Lifetime EP0744290B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US45232695A 1995-05-26 1995-05-26
US452326 1995-05-26

Publications (3)

Publication Number Publication Date
EP0744290A2 EP0744290A2 (de) 1996-11-27
EP0744290A3 EP0744290A3 (de) 1998-03-04
EP0744290B1 true EP0744290B1 (de) 2001-07-11

Family

ID=23796049

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19960303395 Expired - Lifetime EP0744290B1 (de) 1995-05-26 1996-05-14 Verfahren zur Herstellung von Ladungselektroden

Country Status (3)

Country Link
EP (1) EP0744290B1 (de)
CA (1) CA2177053A1 (de)
DE (1) DE69613761T2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3046957B2 (ja) * 1998-11-04 2000-05-29 株式会社東京機械製作所 噴射液体荷電装置の荷電板及びその製造方法
US7163281B2 (en) 2004-05-05 2007-01-16 Eastman Kodak Company Method for improving drop charging assembly flatness to improved drop charge uniformity in planar electrode structures
US20060082620A1 (en) 2004-10-15 2006-04-20 Eastman Kodak Company Charge plate fabrication technique

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4223321A (en) * 1979-04-30 1980-09-16 The Mead Corporation Planar-faced electrode for ink jet printer and method of manufacture
CA1227699A (en) * 1983-07-27 1987-10-06 Walter L. Schutrum Electroformed charge plate for ink jet printers
US5459500A (en) * 1992-03-25 1995-10-17 Scitex Digital Printing, Inc. Charge plate connectors and method of making
EP0613778B1 (de) * 1993-03-01 1998-06-10 SCITEX DIGITAL PRINTING, Inc. Passivierungsschicht für Ladungselektroden auf Basis von Keramik

Also Published As

Publication number Publication date
DE69613761T2 (de) 2001-10-25
CA2177053A1 (en) 1996-11-27
DE69613761D1 (de) 2001-08-16
EP0744290A3 (de) 1998-03-04
EP0744290A2 (de) 1996-11-27

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