EP0731674A4 - Thermal packaging unit for biocompatible implants - Google Patents

Thermal packaging unit for biocompatible implants

Info

Publication number: EP0731674A4
Authority: EP; European Patent Office
Prior art keywords: packaging unit; biocompatible implants; thermal packaging; thermal; implants
Prior art date: 1993-11-23
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP94905916A

Other languages

German (de)

French (fr)

Other versions

EP0731674A1 (en

Inventor

Roy C Wiley

David R Sarver

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Biomet Inc

Original Assignee

Biomet Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1993-11-23

Filing date

1993-11-23

Publication date

1999-03-03

1993-11-23 Application filed by Biomet Inc filed Critical Biomet Inc

1993-11-23 Priority claimed from PCT/US1993/011432 external-priority patent/WO1995015129A1/en

1996-09-18 Publication of EP0731674A1 publication Critical patent/EP0731674A1/en

1999-03-03 Publication of EP0731674A4 publication Critical patent/EP0731674A4/en

Status Withdrawn legal-status Critical Current

Links

EP94905916A 1993-11-23 1993-11-23 Thermal packaging unit for biocompatible implants Withdrawn EP0731674A4 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
PCT/US1993/011432 WO1995015129A1 (en)	1992-10-21	1993-11-23	Thermal packaging unit for biocompatible implants

Publications (2)

Publication Number	Publication Date
EP0731674A1 EP0731674A1 (en)	1996-09-18
EP0731674A4 true EP0731674A4 (en)	1999-03-03

Family

ID=22237222

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP94905916A Withdrawn EP0731674A4 (en)	1993-11-23	1993-11-23	Thermal packaging unit for biocompatible implants

Country Status (3)

Country	Link
EP (1)	EP0731674A4 (en)
JP (1)	JPH09508816A (en)
AU (1)	AU5983494A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB0207170D0 (en)	2002-03-26	2002-05-08	Mcminn Derek J W	Hip joint prosthesis
KR20070056050A (en) *	2004-07-01	2007-05-31	오소플랜 피티와이 엘티디	Hip resurfacing component

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3889483A (en) *	1973-04-30	1975-06-17	Readi Temp	Heat transfer package with shaped frangible ampule
US4758161A (en) *	1987-01-28	1988-07-19	Core-Vent Corporation	Coping insert for use with a dental implant
US5037442A (en) *	1988-08-30	1991-08-06	Sulzer Brothers Limited	Fixing stem for a prosthesis

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3685507A (en) *	1970-11-02	1972-08-22	Readi Temp	Heat transfer unit
US3942510A (en) *	1974-08-21	1976-03-09	General Kinetronics	Heating device
US4077390A (en) *	1976-08-02	1978-03-07	Marc F. Fiedler	Reusable heat pack containing supercooled solution and means for activating same

1993
- 1993-11-23 AU AU59834/94A patent/AU5983494A/en not_active Abandoned
- 1993-11-23 JP JP7515566A patent/JPH09508816A/en active Pending
- 1993-11-23 EP EP94905916A patent/EP0731674A4/en not_active Withdrawn

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3889483A (en) *	1973-04-30	1975-06-17	Readi Temp	Heat transfer package with shaped frangible ampule
US4758161A (en) *	1987-01-28	1988-07-19	Core-Vent Corporation	Coping insert for use with a dental implant
US5037442A (en) *	1988-08-30	1991-08-06	Sulzer Brothers Limited	Fixing stem for a prosthesis

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO9515129A1 *

Also Published As

Publication number	Publication date
AU5983494A (en)	1995-06-19
JPH09508816A (en)	1997-09-09
EP0731674A1 (en)	1996-09-18

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Legal Events

Date	Code	Title	Description
1996-08-02	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
1996-09-18	17P	Request for examination filed	Effective date: 19960624
1996-09-18	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AT CH DE DK ES FR GB IT LI
1999-03-03	A4	Supplementary search report drawn up and despatched
1999-03-03	AK	Designated contracting states	Kind code of ref document: A4 Designated state(s): AT CH DE DK ES FR GB IT LI
2002-01-30	17Q	First examination report despatched	Effective date: 20011213
2004-01-13	GRAP	Despatch of communication of intention to grant a patent	Free format text: ORIGINAL CODE: EPIDOSNIGR1
2004-12-17	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
2005-02-02	18D	Application deemed to be withdrawn	Effective date: 20040726