EP0627781A1 - Passives Filter und Verfahren zu seiner Herstellung - Google Patents

Passives Filter und Verfahren zu seiner Herstellung Download PDF

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Publication number
EP0627781A1
EP0627781A1 EP94401219A EP94401219A EP0627781A1 EP 0627781 A1 EP0627781 A1 EP 0627781A1 EP 94401219 A EP94401219 A EP 94401219A EP 94401219 A EP94401219 A EP 94401219A EP 0627781 A1 EP0627781 A1 EP 0627781A1
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EP
European Patent Office
Prior art keywords
spacer
substrates
elements
substrate
filter according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP94401219A
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English (en)
French (fr)
Inventor
Didier Laloue
Daniel Plas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VALTRONIC INDUSTRIE SA
Original Assignee
VALTRONIC INDUSTRIE SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VALTRONIC INDUSTRIE SA filed Critical VALTRONIC INDUSTRIE SA
Publication of EP0627781A1 publication Critical patent/EP0627781A1/de
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H01P1/20327—Electromagnetic interstage coupling
    • H01P1/20336—Comb or interdigital filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/007—Manufacturing frequency-selective devices

Definitions

  • the present invention relates to a passive filter and the method of manufacturing such a filter.
  • This invention applies more particularly to filters operating in the field of radio frequencies and microwaves.
  • Passive filters are currently produced in either cylindrical or micro-ribbon or triplate technology, that is to say with two adjoining substrates.
  • microstrip technology makes it possible to produce resonators and coupling and adaptation elements on the same substrate, this over a small thickness, as is known from the French patent application filed under the number 90 14514 in the name of VALTRONIC.
  • filters in micro-ribbon technology are not shielded, are sensitive to parasitic radiation, and therefore require precautions for use or the installation of an external shielding which increases the cost of manufacturing.
  • Filters in triplate technology are slightly thicker than filters in micro-ribbon technology, in particular because of the presence of a second substrate, but have the advantage of being shielded.
  • this triplate embodiment requires having the same design on the two opposite faces of the contiguous substrates or, where appropriate, a track not having vis-à-vis.
  • a first object of the invention is to allow the production of filters which are not very sensitive to radiation, therefore naturally shielded, not requiring an adaptation and external coupling network and making it possible to have, on the opposite circuit faces, different circuit configurations, without risking causing electrical malfunctions.
  • the filter made up of two substrates made of electrically insulating material, covered on each face with conductive layers, one face of which is screen-printed to constitute a plurality of conductive microstrip lines parallel to each other and all of whose ends are joined by the same edge to the ground plane formed by the opposite face of the substrate uniformly covered with conductive metal, is characterized in that the two substrates are arranged with the screen-printed faces facing each other at a distance determined by a metallic spacer and in that at least one of the substrates comprises coupling and adaptation lines.
  • At least two non-neighboring resonators are coupled by a reported inductive and / or capacitive impedance.
  • the coupling lines belong to the first substrate while the adaptation lines belong to the second substrate or vice versa.
  • a first spacer element is arranged along each line of symmetry of each micro-band contributing to the formation of a resonator
  • each micro-band contributing to the formation of a resonator comprises at its end connected to the ground plane a second spacer element forming a shield to reduce insertion losses, said second spacer element being oriented in a direction perpendicular to the direction of the first element oriented along the axis of symmetry.
  • third spacer elements constitute shielding elements.
  • Another object of the invention is to allow this technique to modify the position of the output pins without affecting the design of the filter, this advantage results in a gain on the occupied substrate surface and on the electrical characteristics.
  • fourth spacer elements are also electrically connected to connection pads formed on the screen-printed conductive layer of each substrate.
  • the output pins produced from the spacer are used as transfer lugs and stress damping element.
  • the filter consists of a first plurality of micro-bands coupled by a selfic and / or capacitive impedance to form a reception filter and a second plurality of micro-bands coupled by a selfic impedance and / or capacitive to form a transmission filter.
  • connection pads constitute entry points of the antenna signal and of the transmission signal and the exit point of the transmission signal.
  • the micro-strip lines are of trapezoidal shape.
  • the microstrip lines are of rectangular shape.
  • a final object of the invention is to propose a method of manufacturing a pseudo-triple plate type filter.
  • the cutting of the junction elements is carried out flush with the substrates and the cutting of the connection elements is carried out at a given distance from the substrate.
  • a filter in pseudo-triplate technology is represented in FIG. 1 and its realization comprises two ceramic substrates (1) and (2) forming a dielectric on which are deposited conductive layers serving, for the external faces of the substrates, as external shielding ( 3).
  • conductive portions form microstrips (4) constituting resonators, adaptation and coupling lines (5), connection pads (8) as well as shielding zones extending on the wafer by a metallization (9) so as to make a connection with the external conductive shielding layer (3).
  • a metal spacer (6) obtained from a cut plate whose different elements, as shown in Figure 3, consist of a frame (61) to which are connected connection elements (68) and junction elements (62).
  • connection elements (68) connect the frame (61), either to connection pads (8), or to shielding elements (69), as shown in FIG. 3.
  • the connection elements (62) connect to the frame (61) of the spacers (64) oriented along the main axis of the microstrips forming the resonators, as shown in FIG. 2, and of the shielding elements (69) arranged in a direction perpendicular to these spacer elements ( 64).
  • the spacer of Figure 3 serves as a connection between the elements of a passive filter produced using two substrates (1, 2) arranged opposite. On each of the respective faces of the substrates (1, 2) located opposite, a first set of four micro-bands (411 to 414) for the first substrate (1) and, respectively (421 to 424) is produced by screen printing. ) for the second substrate (2), to constitute the resonators of a reception filter, on the one hand connected at the output by an adaptation and coupling element (8110) to the connection pad (811) delivering the signal reception and, on the other hand, connected at the input by a coupling and adaptation line (8141) which is formed by a conductive surface opening onto a pad (814) for connection to the antenna (ANT).
  • a coupling and adaptation line (8141) which is formed by a conductive surface opening onto a pad (814) for connection to the antenna (ANT).
  • the same conductive pad (814) is also connected by a second conductive link (8142) comprising inductive and / or capacitive coupling pads (8143) to a second set of microstrips disposed on each of the substrates (1, 2) and formed of three micro-bands (415 to 417) on the first substrate (1) and respectively (425 to 427) on the second substrate (2).
  • the last of the three micro-bands (417) on the first substrate is connected by a micro-band (8271) to a connection pad (827) ensuring the input of the signal to be transmitted (TX).
  • the first set (411 to 414) of microstrips of the first substrate (1) comprises a microstrip (511) for capacitive coupling between the first (411) and the fourth (414) microstrip and the second set of microstrips -bands (415 to 417) of the first substrate (1) comprises a microstrip (512) of interdigitated capacitive coupling between the first (415) and the third (417) microstrip of the first substrate (1).
  • the micro-bands (421 to 427) of the second substrate (2) do not have coupling capacity, but for certain embodiments this could be envisaged thanks to the invention.
  • Grounding pads (812, 813, 816, 822, 823, 826) and shielding strips (911, 912) are arranged at the ends of each substrate plate and inductive coupling pads (815) with the second micro-ribbon (812) are connected to ground by the shield (6915) and the connecting elements (62), as shown in FIG. 4, on which the spacer (6) is shown in projection on the screen-printed face of the first substrate (1).
  • the spacer elements (64) separating the microstrips (411, 421, 412, 422, etc.) forming the resonators are oriented along the longitudinal axis of the resonators and comprise at the widest end of each micro-strip forming the resonator, that is to say the end close to the edges of the substrate, a spacer strip (69) of direction perpendicular to the spacer strips (64), this spacer strip ( 69) constituting a shield.
  • the screen-printed face of the second substrate (2) is arranged opposite the assembly shown in FIG.
  • the first microstrip (421) of the first assembly forming the resonator is arranged opposite the first micro-strip (411) of the corresponding spacer (64) and that the last micro-strip of the first assembly (424) is arranged opposite the last microstrip (414) of the first substrate (1), likewise for the microstrips of the second resonator assembly.
  • the solder paste is screen-printed on each of the elements. conductor of each of the substrates (1, 2) in the zones corresponding to the locations of the spacer elements (6).
  • the first substrate is arranged in a template which includes cylindrical fingers on which the frame (61) is mounted by means of two holes (631, 632), the second of which is oblong so as to ensure precise centering of all of the elements. spacer (6) and tolerate expansion of the spacer during reflow temperature.
  • the second substrate (2) is then mounted on this assembly with the screen-printed face oriented towards the spacer assembly (6). The assembly is tightened and heated so as to ensure the melting of the solder paste and the soldering of the conductive elements to the spacer elements. This weld is represented by the reference (7) in FIG. 1.
  • connection elements (6811, 6814, 6827) of the spacer are cut out, connected to the connection pads (811, 814, 827) of the first screen-printed substrate along the dotted line (AA) of so as to have spacer elements which protrude from the assembly of the two substrates (1, 2), these connection elements possibly being bent to allow connection to be made with another electronic assembly at a desired location.
  • connection elements (68) connecting the masses (69) or the connection elements (62) connecting the shields (69) are cut along the lines (BB) flush with the substrates (1, 2) and the substrates (1, 2) are metallized on the edge to form the short-circuit to ground in the case of ⁇ / 4 type resonators and to make the side shielding.
  • the fact that the substrates (1, 2) are not joined together makes it possible to produce a different drawing of the lines on each of the substrates without however influencing the electrical operation.
  • the micro-bands of the second resonator assembly (425 to 427) of the second substrate (2) are connected by a micro-ribbon (523) for coupling while on the first substrate (1) the micro-bands constituting the elements of vis-à-vis resonator (415a to 427a) are not coupled together with respect to the first and third micro-bands.
  • the third micro-band (417a) is connected by a connection pad (828) and an interdigitated capacity.
  • the first micro-band (415a) is connected by an interdigitated capacitance and an adaptation and coupling line (8144) comprising an inductive element (8143) to the input connection range (814a) of the antenna.
  • the first element (411) is connected to the third and fourth by interdigitated capacitive coupling lines (515, 514 respectively) .
  • micro-bands (415a to 417a) of the second set of resonators on the first substrate (1) are longer than the micro-bands (425 to 427) forming the second set on the second substrate (2).
  • this technique also allows the position of the output pins to be changed without affecting the design of the filter.
  • the first set of resonators consists of four micro-bands, the couplings of which can be modified according to the types of filter desired; similarly, the second set consists of three micro-bands but the invention also adapts to filters comprising a single set of micro-bands or several sets of micro-bands, the number of micro-bands of which may be different from those shown in the figures and whose couplings can also be different.
  • the drawings of the internal faces opposite may be different.
  • This type of solution of the invention is advantageously used in information processing systems, such as for example radio telephones which operate in the frequency range from 0.5 to 10 GHz with a bandwidth of 20 MHz to 1 GHz.
  • Metal spacers between 280 and 350 ⁇ m will be used.
  • the plate cut in the form of a grid has the advantage of allowing peripheral shielding of the filter, therefore of increasing the electrical performance and the lower insertion losses in the strip.
  • the plate also has the advantage of making an electrical connection between the resonators opposite the two substrates so that they have the same electrical length. In fact, the tests carried out have shown that if this connection is not made, the filter sees its number of resonators double; therefore become more selective, but have greater insertion losses in the band, and become much more complex to adjust.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
EP94401219A 1993-06-04 1994-06-02 Passives Filter und Verfahren zu seiner Herstellung Withdrawn EP0627781A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9306694 1993-06-04
FR9306694A FR2706084A1 (fr) 1993-06-04 1993-06-04 Filtre passif et procédé de fabrication d'un tel filtre.

Publications (1)

Publication Number Publication Date
EP0627781A1 true EP0627781A1 (de) 1994-12-07

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EP94401219A Withdrawn EP0627781A1 (de) 1993-06-04 1994-06-02 Passives Filter und Verfahren zu seiner Herstellung

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EP (1) EP0627781A1 (de)
FR (1) FR2706084A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5648747A (en) * 1995-03-15 1997-07-15 Grothe; Wolfgang Planar filter having an overcoupling stripline an integral multiple of a half wavelength in length

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4609892A (en) * 1985-09-30 1986-09-02 Motorola, Inc. Stripline filter apparatus and method of making the same
DE4029665A1 (de) * 1990-09-19 1992-03-26 Licentia Gmbh Interdigitalfilter
EP0487396A1 (de) * 1990-11-21 1992-05-27 Valtronic France Passives Bandpassfilter

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4609892A (en) * 1985-09-30 1986-09-02 Motorola, Inc. Stripline filter apparatus and method of making the same
DE4029665A1 (de) * 1990-09-19 1992-03-26 Licentia Gmbh Interdigitalfilter
EP0487396A1 (de) * 1990-11-21 1992-05-27 Valtronic France Passives Bandpassfilter

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
1986 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM-DIGEST;June 2-4,1986,Baltimore,US IEEE,New York,US,1986 pages 403-406 *
W.-T. LO ET AL.: "K-Band quasi-planar tapped combline filter and diplexer", IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, vol. 41, no. 2, February 1993 (1993-02-01), NEW YORK US, pages 215 - 223, XP000361234, DOI: doi:10.1109/22.216459 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5648747A (en) * 1995-03-15 1997-07-15 Grothe; Wolfgang Planar filter having an overcoupling stripline an integral multiple of a half wavelength in length

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Publication number Publication date
FR2706084A1 (fr) 1994-12-09

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