EP0371863A1 - Metall-Metall-Verbindungsverfahren und resultierende Struktur - Google Patents

Metall-Metall-Verbindungsverfahren und resultierende Struktur Download PDF

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Publication number
EP0371863A1
EP0371863A1 EP89403266A EP89403266A EP0371863A1 EP 0371863 A1 EP0371863 A1 EP 0371863A1 EP 89403266 A EP89403266 A EP 89403266A EP 89403266 A EP89403266 A EP 89403266A EP 0371863 A1 EP0371863 A1 EP 0371863A1
Authority
EP
European Patent Office
Prior art keywords
metal
heating
bonding
metal surfaces
ambient atmosphere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP89403266A
Other languages
English (en)
French (fr)
Inventor
Arnold Reisman
Deepak Nayak
Iwona Turlik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Ltd
MCNC
Original Assignee
Northern Telecom Ltd
MCNC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northern Telecom Ltd, MCNC filed Critical Northern Telecom Ltd
Publication of EP0371863A1 publication Critical patent/EP0371863A1/de
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area

Definitions

  • This invention relates to bonding of surfaces and more specifically to the bonding of metal surfaces.
  • a common problem faced by existing techniques is the removal of residual oxide coatings on the surfaces to be bonded.
  • Numerous patents teach that a stronger bond is obtained when the metal surfaces to be bonded are free of oxides.
  • U.S. Patent No. 4,732,312 to Kennedy, et al. teaches the removal of surface oxides when diffusion bonding.
  • U.S. Patent No. 4,704,512 to Lisec teaches removal of oxides when welding, and
  • U.S. Patent No. 4,245,768 to Sater removes surface oxides when welding metals using ion beam technology.
  • Fig. 1a two metal surfaces 1 and 2, to be bonded are shown.
  • Fig. 1b the two metal surfaces to be bonded are placed in physical contact, and are pressed together.
  • Fig. 1c the metal surfaces 1 and 2 are placed in furnace 4 containing an oxidizing ambient and heated, to form a thin oxide bond layer 3 therebetween.
  • FIG. 2 an alternative method of bonding metal surfaces by first forming an oxide on one or both surfaces to be bonded is shown.
  • oxide layers 5 and 6 are formed on the respective metal surfaces 1 and 2 to be bonded.
  • Fig. 2b the oxide surfaces 5 and 6 are pressed together and then heated in a furnace 4 containing an oxidizing ambient atmosphere to bond the surfaces (Fig. 2c).
  • Fig. 2c an intermediate oxide bond layer 7 is shown between oxide layers 5 and 6. It will be understood by those having skill in the art that oxide layers 5, 6 and 7 form a single oxide layer which bonds the metal surfaces 1 and 2.
  • a quartz carrier 11 may be employed to hold a pair of flat surfaces to be bonded 1 and 2, in the furnace.
  • a quartz plate 13 may be placed on top of the pair of surfaces to act as a uniformly distributed weight source.
  • the plate 13 preferably weighs several hundred grams.
  • Pegs 12 may be employed to hold plate 13 in place.
  • the quartz plate maintains the surfaces in intimate contact during insertion into the furnace, and during the bonding process, and provides for more consistent bonding.
  • bonding may take place in a standard annealing furnace or a rapid thermal annealing chamber, both of which are well known to those having skill in the art and will not be described in detail.
  • the bonding time for the standard furnace at the annealing temperature is at least 20 minutes, while in a rapid thermal annealing furnace, times between 2-4 minutes may be employed.
  • An ambient atmosphere of dry oxygen and water vapor may be employed, with the amount of oxygen and water vapor not being critical as long as oxides are formed.
  • HCl gas present to the extent of several percent by volume may also be present in the ambient atmosphere.
  • Nitrogen, argon or other unreactive gases may also be employed with oxygen and water.
  • the bonding temperature may vary from about 600°C to about 1150°C.
  • This method of bonding metal surfaces according to the present invention may be employed in semiconductor-on-insulator (SOI) or semiconductor fabrication processes, as disclosed in the U.S. application, Serial No. 07/277,607, entitled "High Density Semiconductor Structure and Method of Making the Same.”
  • SOI semiconductor-on-insulator
  • the disclosure of this co-pending application is expressly incorporated by reference.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
EP89403266A 1988-11-29 1989-11-27 Metall-Metall-Verbindungsverfahren und resultierende Struktur Withdrawn EP0371863A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US27762088A 1988-11-29 1988-11-29
US277620 1988-11-29

Publications (1)

Publication Number Publication Date
EP0371863A1 true EP0371863A1 (de) 1990-06-06

Family

ID=23061664

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89403266A Withdrawn EP0371863A1 (de) 1988-11-29 1989-11-27 Metall-Metall-Verbindungsverfahren und resultierende Struktur

Country Status (2)

Country Link
EP (1) EP0371863A1 (de)
CA (1) CA2004074A1 (de)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB900804A (en) * 1959-11-12 1962-07-11 Johnson Matthey Co Ltd Improvements in and relating to the production of composite metal sheet or strip
EP0117671A1 (de) * 1983-02-12 1984-09-05 Alcan International Limited Verbinden von Metallen
EP0201123A1 (de) * 1985-04-24 1986-11-12 Koninklijke Philips Electronics N.V. Vakuumdichter Abschluss mittels Thermokompression unter Bildung einer Oxidschicht

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB900804A (en) * 1959-11-12 1962-07-11 Johnson Matthey Co Ltd Improvements in and relating to the production of composite metal sheet or strip
EP0117671A1 (de) * 1983-02-12 1984-09-05 Alcan International Limited Verbinden von Metallen
EP0201123A1 (de) * 1985-04-24 1986-11-12 Koninklijke Philips Electronics N.V. Vakuumdichter Abschluss mittels Thermokompression unter Bildung einer Oxidschicht

Also Published As

Publication number Publication date
CA2004074A1 (en) 1990-05-29

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