EP0299099A1 - Method of making silver/Me0 contact plates with a weldable or solderable backing - Google Patents

Method of making silver/Me0 contact plates with a weldable or solderable backing Download PDF

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Publication number
EP0299099A1
EP0299099A1 EP87110116A EP87110116A EP0299099A1 EP 0299099 A1 EP0299099 A1 EP 0299099A1 EP 87110116 A EP87110116 A EP 87110116A EP 87110116 A EP87110116 A EP 87110116A EP 0299099 A1 EP0299099 A1 EP 0299099A1
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European Patent Office
Prior art keywords
pressing
silver
copper
press
contact
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EP87110116A
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German (de)
French (fr)
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EP0299099B1 (en
Inventor
Konrad Dr. Herz
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Inovan Stroebe KG
Inovan GmbH and Co KG Metalle und Bauelemente
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Inovan Stroebe KG
Inovan GmbH and Co KG Metalle und Bauelemente
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Application filed by Inovan Stroebe KG, Inovan GmbH and Co KG Metalle und Bauelemente filed Critical Inovan Stroebe KG
Priority to EP87110116A priority Critical patent/EP0299099B1/en
Priority to AT87110116T priority patent/ATE60163T1/en
Priority to DE8787110116T priority patent/DE3767487D1/en
Publication of EP0299099A1 publication Critical patent/EP0299099A1/en
Application granted granted Critical
Publication of EP0299099B1 publication Critical patent/EP0299099B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
    • H01H11/045—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion with the help of an intermediate layer

Definitions

  • the invention relates to a method for applying a solderable or weldable layer either made of silver, silver-copper and other silver alloys or of copper, copper-nickel or other copper alloys, on the back (bottom) of a silver / MeO contact plate with Me components , preferably made of cadmium, tin, zinc, copper, bismuth, molybdenum, tungsten or indium, in which the MeO particles are fibrous (skewered) and with their fiber longitudinal direction are approximately perpendicular to the contact surface.
  • Modern electrical switching devices are characterized by a small design, high functional reliability and a long service life. These features depend in large part on the design of the electrical contacts, in particular special from the choice of the contact material.
  • a material made of a silver alloy with metal oxide components has proven to be optimal in recent years.
  • a particularly noteworthy group is a silver-cadmium oxide alloy.
  • Such contact material can be produced in various ways.
  • a silver base metal alloy can thus be oxidized through, or oxidized silver / base metal particles can also be joined together by pressing, sintering and, if necessary, re-stamping.
  • a targeted termination of the oxidation process can ensure that the underside of the silver / base metal sheet or a corresponding block remains free of metal oxide components, so that this underside can be soldered or welded without difficulty.
  • the underside has to be machined so that the contact made of this material can be soldered or welded.
  • the oxides are also deformed in the longitudinal direction during the forming process and / or broken down into smaller particles. It has been shown that the properties of these silver / metal oxide materials depend on the orientation of the metal oxide fibers to the contact surface.
  • the contact plates required for switching devices in energy technology are separated from the semi-finished product in such a way that the fiber direction of the oxides is either parallel or perpendicular to the subsequent contact surface. It is known from numerous studies that the switching properties of the contact plates, in particular the material burn-off, when the fibers are arranged perpendicular to the button, are considerably more favorable than with parallel alignment. The greater the fiber structure of the oxides, the greater this effect. This influence of anisotropy was observed to an increased extent, in particular also on contact materials which were produced in a reaction spray process, for example according to DE-PS 29 29 630. In the case of contacts produced in this way, in an economical manner, it is therefore expedient, in order to achieve reduced contact material erosion or silver savings, to produce contact plates with an oxide fiber direction oriented perpendicular to the button.
  • the object of the invention is to provide contact plates made of silver / MeO material with a fiber direction of the metal oxides lying approximately perpendicular to the contact surface with a solderable and weldable underside.
  • This underside which can be soldered and welded, should not only allow good adhesion to be established with the contact carrier, which is made of copper or a copper alloy, but should also be inexpensive to implement.
  • the layer is applied as a film or powder by hot press cladding by hot press welding in an inert gas or reducing atmosphere.
  • the layer is also hot-plated on the contact plate, but not, as is known, by the usual hot roll cladding with a high degree of deformation, but by hot-pressure welding, that is practically without reshaping the layer to be plated.
  • hot-pressure welding that is practically without reshaping the layer to be plated.
  • the hot press plating according to the invention should take place under an inert gas or, better still, under a reducing atmosphere.
  • This not only avoids oxidation of the connection surfaces with certainty, but also ensures that during the warming up of the parts, an at least superficial reduction takes place, the metal oxide particles on the surface of the connection point are thus converted to metals. Since the silver-metal oxide materials are more or less brittle at room temperature, a close approximation of the atoms in the platelet surface and plating layer is only guaranteed when they are warm and under pressure.
  • the metallic connection is improved by diffusion and healing processes.
  • the pressing temperature is expedient, depending on the alloy composition of the layer material used, between 500 ° C. and 900 ° C.
  • the surrounding atmosphere has proven itself to be hydrogen gas, nitrogen or a mixture of these gases, which not only achieve good results, but also are inexpensive.
  • the level of the required pressure is advantageously between 2000 and 8000 bar. It depends on the level of the selected pressing temperature, the material combination of the layer structure and the type and geometry of the press punch and die.
  • pre-press-post-press very good joining properties arise when the plating is carried out in two stages (pre-press-post-press). This may be due to the fact that all gas inclusions impairing the connection are pressed out of the connection zone during the pre-pressing. If, according to a further feature of the invention, a pressing tool with a stamp is used during the pre-pressing, the working side of which is convex, then even if only a small amount of shaping work is done, which may also benefit the connection. In addition, a uniform layer thickness of the applied solderable and weldable layer can also be achieved during repressing.
  • a contact plate is inserted into a press die (1, 11), the MeO particles of which run in a fibrous form and, as indicated by dashed lines, are perpendicular to the contact surface.
  • a foil (or metal powder) (2) made of solderable or weldable material is placed on it and is to be connected to the contact plate (3). Since the connection is to be made by hot pressure welding, the press die (1, 11) is made of high-temperature steel, graphite or ceramic.
  • a stamp (4) or a pair of stamps (14) presses the foil (or the metal powder) (2) onto the contact plate (3) and thus provides the Connection between these two parts.
  • the pressing or plating takes place under an inert gas atmosphere or a reducing atmosphere.
  • the hot press cladding or hot press welding should take place in two stages, pre-pressing and post-pressing.
  • a stamp (24) FIG. 3a
  • a convex working surface (5) is expediently used, so that a component results after the pre-pressing, as shown in FIG. 3c.
  • the layer thickness of the cladding is then somewhat thinner in the middle of the plate than at the edge. As a result, a reduction in the layer thickness at the edge of the platelet, as is frequently observed as a result of burr formation in the case of single-stage pressing, can be avoided in the subsequent step.
  • re-pressing Fig.
  • the layer is brought back into the desired shape with the usual embossing die (4), so that a contact plate (13) (Fig.) Provided with a solderable and weldable layer (12) is then 3f) with a uniform plating layer thickness.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Contacts (AREA)
  • Manufacture Of Switches (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)

Abstract

Because of their high MeO component, such small contact plates cannot be directly soldered or welded onto contact carriers. For this purpose, such a small contact plate must be provided with a layer which can be soldered or welded. According to the invention, it is proposed that such a layer be applied in the course of hot-press plating (hot-press welding), in an inert gas or reducing atmosphere. <IMAGE>

Description

Die Erfindung betrifft ein Verfahren zum Auftragen einer löt- oder schweißfähigen Schicht entweder aus Silber, Silber-Kupfer und anderen Silberlegierungen oder aus Kupfer, Kupfer-Nickel oder anderen Kupferlegierungen, auf der Rückseite (Unterseite) eines Silber/MeO-Kontaktplätt­chens mit Me-Anteilen, vorzugsweise aus Cadmium, Zinn, Zink, Kupfer, Wismut, Molybdän, Wolfram oder Indium, bei dem die MeO-Partikel faserförmig (spießig) ausgebildet sind und mit ihrer Faser-Längsrichtung etwa senkrecht zur Kontaktoberfläche liegen.The invention relates to a method for applying a solderable or weldable layer either made of silver, silver-copper and other silver alloys or of copper, copper-nickel or other copper alloys, on the back (bottom) of a silver / MeO contact plate with Me components , preferably made of cadmium, tin, zinc, copper, bismuth, molybdenum, tungsten or indium, in which the MeO particles are fibrous (skewered) and with their fiber longitudinal direction are approximately perpendicular to the contact surface.

Moderne elektrische Schaltgeräte zeichnen sich durch eine kleine Bauweise, hohe Funktionssicherheit und große Lebensdauer aus. Diese Merkmale hängen zum wesentlichen Teil von der Gestaltung der elektrischen Kontakte, insbe­ sondere von der Auswahl des Kontaktwerkstoffes ab. Für Schaltgeräte, die Ströme im Bereich 50 A bis 3000 A zu schalten haben, hat sich in den letzten Jahren ein Werk­stoff aus einer Silberlegierung mit Metalloxidanteilen als optimal erwiesen. Eine besonders hervorzuhebende Gruppe ist hierbei eine Silber-Cadmiumoxid-Legierung.Modern electrical switching devices are characterized by a small design, high functional reliability and a long service life. These features depend in large part on the design of the electrical contacts, in particular special from the choice of the contact material. For switching devices that have to switch currents in the range of 50 A to 3000 A, a material made of a silver alloy with metal oxide components has proven to be optimal in recent years. A particularly noteworthy group is a silver-cadmium oxide alloy.

Derartiges Kontaktmaterial kann auf verschiedene Art und Weise hergestellt werden. So kann eine Silber-Unedelme­tall-Legierung durchoxidiert werden, oder es können auch oxidierte Silber/Unedelmetall-Partikel durch Pressen, Sintern und gegebenenfalls Nachprägen zusammengefügt werden. Im ersten Fall kann durch gezieltes Abbrechen des Oxidationsvorganges erreicht werden, daß die Unterseite des Silber/Unedelmetall-Bleches beziehungsweise eines entsprechenden Blockes frei von Metalloxid-Anteilen bleibt, so daß diese Unterseite ohne Schwierigkeiten zu verlöten oder zu verschweißen ist. Bei dem aus oxidierten Silber/Unedelmetall-Partikeln zusammengefügten Material ist dies jedoch nicht möglich. Hier muß nachträglich die Unterseite so bearbeitet werden, daß ein Verlöten oder Verschweißen des aus diesem Material gefügten Kontaktes möglich ist.Such contact material can be produced in various ways. A silver base metal alloy can thus be oxidized through, or oxidized silver / base metal particles can also be joined together by pressing, sintering and, if necessary, re-stamping. In the first case, a targeted termination of the oxidation process can ensure that the underside of the silver / base metal sheet or a corresponding block remains free of metal oxide components, so that this underside can be soldered or welded without difficulty. However, this is not possible with the material composed of oxidized silver / base metal particles. Here, the underside has to be machined so that the contact made of this material can be soldered or welded.

Bei der pulvermetallurgischen Herstellung von Silber/­Metalloxid-Werkstoffen, bei der die oxidierten Silber/­Unedelmetall-Partikel durch Pressen, Sintern und Nach­prägen zusammengefügt werden, kann eine ausgeprägte faser­förmige (spießige) Anordnung der im Silber eingelagerten Oxide durch Strangpressen erreicht werden. Dabei werden die aus dem zugrundeliegenden Silber/Metalloxidpulver in bekannter Weise durch Pressen und Sintern hergestellten Rohlinge mit hohem Umformgrad zu stangenförmigem Halbzeug stranggepreßt. Die Oxidteilchen ordnen sich dabei in Preß­richtung faserförmig, parallel zur Stabachse (Längsrich­ tung) des Halbzeugs an. Je nach Größe, Art und Beschaffen­heit werden die Oxide außerdem beim Umformprozeß in Längs­richtung verformt und/oder in kleinere Partikel zerteilt. Es hat sich gezeigt, daß die Eigenschaften dieser Silber/­Metalloxid-Werkstoffe abhängig sind von der Orientierung der Metalloxidfasern zur Kontaktoberfläche.In the powder-metallurgical production of silver / metal oxide materials, in which the oxidized silver / base metal particles are joined together by pressing, sintering and re-stamping, a pronounced fibrous (spiky) arrangement of the oxides embedded in the silver can be achieved by extrusion. The blanks produced from the underlying silver / metal oxide powder in a known manner by pressing and sintering are extruded with a high degree of deformation to give rod-shaped semifinished products. The oxide particles arrange themselves in a fiber shape in the pressing direction, parallel to the rod axis (longitudinal direction tung) of the semi-finished product. Depending on the size, type and nature, the oxides are also deformed in the longitudinal direction during the forming process and / or broken down into smaller particles. It has been shown that the properties of these silver / metal oxide materials depend on the orientation of the metal oxide fibers to the contact surface.

Die für Schaltgeräte der Energietechnik benötigten Kontaktplättchen werden so aus dem Halbzeug abgetrennt, daß die Faserrichtung der Oxide entweder parallel oder senkrecht zur späteren Kontaktoberfläche liegt. Aus zahl­reichen Untersuchungen ist bekannt, daß die Schalteigen­schaften der Kontaktplättchen, insbesondere der Material­abbrand, bei Anordnung der Fasern senkrecht zur Schalt­fläche, wesentlich günstiger sind als bei paralleler Aus­richtung. Dieser Effekt ist umso größer, je ausgeprägter die Faserstruktur der Oxide ist. Insbesondere auch an Kontaktwerkstoffen, die in einem Reaktions-Sprüh-Verfah­ren, beispielsweise nach der DE-PS 29 29 630, hergestellt worden sind, wurde dieser Anisotropieeinfluß in verstärk tem Maße beobachtet. Bei derart, auf wirtschaftliche Art und Weise, hergestellten Kontakten, ist es deshalb zur E­rzielung eines verringerten Kontaktmaterialabbrands bezie­hungsweise einer Silbereinsparung zweckmäßig, Kontakt­plättchen mit senkrecht zur Schaltfläche orientierter Oxidfaserrichtung herzustellen.The contact plates required for switching devices in energy technology are separated from the semi-finished product in such a way that the fiber direction of the oxides is either parallel or perpendicular to the subsequent contact surface. It is known from numerous studies that the switching properties of the contact plates, in particular the material burn-off, when the fibers are arranged perpendicular to the button, are considerably more favorable than with parallel alignment. The greater the fiber structure of the oxides, the greater this effect. This influence of anisotropy was observed to an increased extent, in particular also on contact materials which were produced in a reaction spray process, for example according to DE-PS 29 29 630. In the case of contacts produced in this way, in an economical manner, it is therefore expedient, in order to achieve reduced contact material erosion or silver savings, to produce contact plates with an oxide fiber direction oriented perpendicular to the button.

Es wurde schon erwähnt, daß infolge des hohen Metalloxid­gehaltes, der im allgemeinen über 5 Gew.% liegt, derar­tige Kontaktplättchen nicht direkt auf einen Kontaktträ­ger, der im allgemeinen aus Kupfer oder einer Kufperlegie­rung besteht, auflötbar oder aufschweißbar sind. Um trotz­dem eine Löt- beziehungsweise Schweißbefestigung der Kon­taktplättchen auf ihren Kontaktträgern zu ermöglichen, muß entweder, wie oben angeführt, durch gezielte Oxida­tion die Oxidation der Unterseite des Kontaktplättchens vermieden oder es muß auf dieser Unterseite eine löt­fähige Schicht aufgebracht werden.It has already been mentioned that, due to the high metal oxide content, which is generally above 5% by weight, such contact plates cannot be soldered or welded directly onto a contact carrier, which generally consists of copper or a copper alloy. In order to enable the contact plates to be soldered or welded onto their contact carriers, must either avoid oxidation of the underside of the contact plate by targeted oxidation, as stated above, or a solderable layer must be applied to this underside.

So ist es beispielsweise bekannt, bandförmiges Silber/­Metalloxid-Halbzeug durch Warmwalzplattieren bei hohem Umformgrad von 50 bis 65 % mit einer lötfähigen Schicht aus Silber zu verbinden. Die aus solchem Material abge­trennten Kontaktplättchen weisen dann allerdings eine Oxidfaser auf, die parallel zur Kontaktoberfläche liegt.For example, it is known to connect strip-shaped silver / metal oxide semifinished products to a solderable layer of silver by hot roll plating at a high degree of deformation of 50 to 65%. The contact platelets separated from such material then have an oxide fiber which is parallel to the contact surface.

Weiter bekannt sind noch verschiedene Verfahren zum Auf­bringen einer derartigen Schicht durch Löten oder Hinter­gießen, die aber alle mit mehr oder wenigen großen Nach­teilen verbunden sind.Various methods for applying such a layer by soldering or back casting are also known, but they are all associated with more or less major disadvantages.

Aufgabe der Erfindung ist es, Kontaktplättchen aus Silber/MeO-Werkstoff mit etwa senkrecht zur Kontaktober­fläche liegender Faserrichtung der Metalloxide mit einer löt- und schweißfähigen Unterseite zu versehen. Diese löt- und schweißfähige Unterseite soll nicht nur eine gute Haftung mit dem aus Kupfer oder einer Kupferlegie­rung bestehenden Kontaktträger herstellen lassen, sondern sie soll auch kostengünstig zu verwirklichen sein.The object of the invention is to provide contact plates made of silver / MeO material with a fiber direction of the metal oxides lying approximately perpendicular to the contact surface with a solderable and weldable underside. This underside, which can be soldered and welded, should not only allow good adhesion to be established with the contact carrier, which is made of copper or a copper alloy, but should also be inexpensive to implement.

Erreicht wird dies nach der Erfindung dadurch, daß die Schicht als Folie oder Pulver durch Warmpreßplattieren im Wege des Warmpreßschweißens unter Inertgas- oder reduzie­render Atmosphäre aufgebracht wird.This is achieved according to the invention in that the layer is applied as a film or powder by hot press cladding by hot press welding in an inert gas or reducing atmosphere.

Nach der Erfindung wird also ebenfalls die Schicht warm auf das Kontaktplättchen plattiert, jedoch nicht wie be­kannt im Wege des üblichen Warmwalzplattierens mit hohem Umformgrad, sondern im Wege des Warmpreßschweißens, also praktisch ohne Umformung der zu plattierenden Schicht. Infolge von Druck und Temperatur ergibt sich, wie einge­hende Versuche gezeigt haben, eine mechanisch feste und elektrisch widerstandsarme Verbindung, die es ermöglicht, derartige Kontaktplättchen ohne Schwierigkeiten auf Kontaktträger aufzulöten oder aufzuschweißen.According to the invention, the layer is also hot-plated on the contact plate, but not, as is known, by the usual hot roll cladding with a high degree of deformation, but by hot-pressure welding, that is practically without reshaping the layer to be plated. As a result of pressure and temperature, as detailed tests have shown, there is a mechanically strong and electrically low-resistance connection which makes it possible to solder or weld such contact plates onto contact carriers without difficulty.

Mit dazu beitragen mag auch, daß das Warmpreßplattieren nach der Erfindung unter Inertgas- oder besser noch unter reduzierender Atmosphäre stattfinden soll. Dadurch wird nicht nur mit Sicherheit eine Oxidation der Verbindungs­flächen vermieden, sondern auch noch erreicht, daß während des Aufwärmens der Teile, eine zumindest ober­flächige Reduktion stattfinden die Metalloxidpartikel an der Oberfläche der Verbindungsstelle also zu Metallen um­gewandelt werden. Da die Silber-Metalloxidwerkstoffe bei Raumtemperatur mehr oder weniger spröde sind, ist eine enge Annäherung der Atome in der Plättchenoberfläche und Plattierschicht nur in warmem Zustand und unter Druck ge­währleistet. Je nach Höhe der gewählten Preßtemperatur erfolgt dann durch Diffusions- und Ausheilvorgänge eine Verbesserung der metallischen Verbindung.This may also contribute to the fact that the hot press plating according to the invention should take place under an inert gas or, better still, under a reducing atmosphere. This not only avoids oxidation of the connection surfaces with certainty, but also ensures that during the warming up of the parts, an at least superficial reduction takes place, the metal oxide particles on the surface of the connection point are thus converted to metals. Since the silver-metal oxide materials are more or less brittle at room temperature, a close approximation of the atoms in the platelet surface and plating layer is only guaranteed when they are warm and under pressure. Depending on the level of the selected pressing temperature, the metallic connection is improved by diffusion and healing processes.

Wie Versuche gezeigt haben, liegt die Preßtemperatur zweckmäßigerweise, je nach Legierungszusammensetzung des verwendeten Schichtwerkstoff, zwischen 500 °C und 900 °C Als umgebende Atmosphäre hat sich Wasserstoffgas, Stickstoff oder eine Mischung dieser Gase bewährt, die nicht nur gute Ergebnisse erzielen lassen, sondern auch preiswert sind. Die Höhe des erforderlichen Preßdruckes liegt zweckmäßigerweise zwischen 2000 und 8000 bar. Sie richtet sich nach der Höhe der gewählten Preßtemperatur, der Werkstoffkombination des Schichtver­bandes sowie nach Materialart und Geometrie von Preß­stempel und -matrize.As tests have shown, the pressing temperature is expedient, depending on the alloy composition of the layer material used, between 500 ° C. and 900 ° C. The surrounding atmosphere has proven itself to be hydrogen gas, nitrogen or a mixture of these gases, which not only achieve good results, but also are inexpensive. The level of the required pressure is advantageously between 2000 and 8000 bar. It depends on the level of the selected pressing temperature, the material combination of the layer structure and the type and geometry of the press punch and die.

Insbesondere für extrem belastete Kontakte empfiehlt es sich, die nach der Erfindung plattierten Kontaktplättchen in einer Folgebehandlung, vorzugsweise unter Inertgas, mit einer Temperatur zwischen 600 °C und 950 °C zu glühen, um die oben geschilderten Diffusionsvorgänge und damit die Festigkeit der Verbindung zu unterstützen. Außerdem lassen sich bei dieser Glühung eventuelle Ver­bindungsfehler oder Gaseinschlüsse durch Blasenbildung erkennen.Particularly for extremely stressed contacts, it is advisable to anneal the contact plates plated according to the invention in a subsequent treatment, preferably under inert gas, at a temperature between 600 ° C. and 950 ° C. in order to support the diffusion processes described above and thus the strength of the connection . In addition, any connection errors or gas inclusions caused by bubbles can be identified in this annealing.

Überraschenderweise hat sich gezeigt, daß sehr gute Ver­bindungseigenschaften dann entstehen, wenn das Plattieren in zwei Stufen (Vorpressen-Nachpressen) erfolgt. Dies mag darauf zurückzuführen sein, daß beim Vorpressen samtliche die Verbindung beeinträchtigenden Gaseinschlüsse aus der Verbindungszone herausgedrückt werden. Wird einem weite­ren Erfindungsmerkmal nach beim Vorpressen ein Preßwerk­zeug mit einem Stempel verwendet, dessen Arbeitsseite konvex ausgebildet ist, so wird auch noch eine, wenn auch geringe, Umformarbeit geleistet, die ebenfalls der Verbin­dung zugute kommen mag. Außerdem kann damit auch eine gleichmäßige Schichtdicke der aufgebrachten löt- und schweißbaren Schicht beim Nachpressen erzielt werden.Surprisingly, it has been shown that very good joining properties arise when the plating is carried out in two stages (pre-press-post-press). This may be due to the fact that all gas inclusions impairing the connection are pressed out of the connection zone during the pre-pressing. If, according to a further feature of the invention, a pressing tool with a stamp is used during the pre-pressing, the working side of which is convex, then even if only a small amount of shaping work is done, which may also benefit the connection. In addition, a uniform layer thickness of the applied solderable and weldable layer can also be achieved during repressing.

Auf der Zeichnung ist die Erfindung schematisch darge­stellt, und zwar zeigen:

  • Fig. 1 ein einachsiges Preßwerkzeug,
  • Fig. 2 ein biaxiales Preßwerkzeug zur Durchführung des Verfahrens und
  • Fig. 3 den Vorgang des Vor- und Nachpressens.
The invention is shown schematically in the drawing, in which:
  • 1 is a uniaxial pressing tool,
  • Fig. 2 shows a biaxial pressing tool for performing the method and
  • Fig. 3 shows the process of pre and post pressing.

In ein Preßgesenk (1, 11) ist ein Kontaktplättchen einge­Iegt, dessen MeO-Partikel faserförmig verlaufen und etwa, wie gestrichelt angedeutet, senkrecht zur Kontaktober­fläche liegen. Darauf aufgelegt ist eine Folie (bezie­hungsweise Metallpulver) (2) aus löt- oder schweißfähigem Material, die mit dem Kontaktplättchen (3) zu verbinden ist. Da die Verbindung im Wege des Warmpreßschweißens erfolgen soll, ist das Preßgesenk (1, 11) aus hochwarm­festem Stahl, aus Graphit oder Keramik.A contact plate is inserted into a press die (1, 11), the MeO particles of which run in a fibrous form and, as indicated by dashed lines, are perpendicular to the contact surface. A foil (or metal powder) (2) made of solderable or weldable material is placed on it and is to be connected to the contact plate (3). Since the connection is to be made by hot pressure welding, the press die (1, 11) is made of high-temperature steel, graphite or ceramic.

Nach Aufheizen des Kontaktplättchens (3) und der Folie (beziehungsweise des Metallpulvers) (2) drückt ein Stem­pel (4) beziehungsweise ein Stempelpaar (14) die FoIie (beziehungsweise das Metallpulver) (2) auf das Kontakt­plättchen (3) und stellt somit die Verbindung zwischen diesen beiden Teilen her. Das Pressen beziehungsweise Plattieren erfolgt unter Inertgas-Atmosphäre oder redu­zierender Atmosphäre.After the contact plate (3) and the foil (or the metal powder) (2) have been heated, a stamp (4) or a pair of stamps (14) presses the foil (or the metal powder) (2) onto the contact plate (3) and thus provides the Connection between these two parts. The pressing or plating takes place under an inert gas atmosphere or a reducing atmosphere.

Wie beschrieben, soll das Warmpreßplattieren beziehungs­weise Warmpreßschweißen in zwei Stufen, Vorpressen und Nachpressen, erfolgen. Hierbei wird zweckmäßigerweise, wie in Fig. 3 gezeigt, ein Stempel (24) (Fig. 3a) mit kon­vexer Arbeitsfläche (5) verwendet, so daß sich nach dem Vorpressen ein Bauteil ergibt, wie dies Fig. 3c zeigt. Die Schichtdicke der Plattierung ist dann in der Plätt­chenmitte etwas dünner als am Rand. Dadurch kann eine Ver­ringerung der Schichtdicke am Plättchenrand, wie dies häu­fig infolge Gratbildung bei einstufiger Pressung zu beob­achten ist, im nachfolgenden Schritt vermieden werden. Beim Nachpressen (Fig. 3d bis f) wird mit dem üblichen Prägestempel (4) die Schicht wieder in die gewünschte Form gebracht, so daß sich sodann ein, mit einer löt- und schweißfähigen Schicht (12) versehenes Kontaktplättchen (13) (Fig. 3f) mit gleichmäßiger Plattierschichtdicke ergibt.As described, the hot press cladding or hot press welding should take place in two stages, pre-pressing and post-pressing. Here, as shown in FIG. 3, a stamp (24) (FIG. 3a) with a convex working surface (5) is expediently used, so that a component results after the pre-pressing, as shown in FIG. 3c. The layer thickness of the cladding is then somewhat thinner in the middle of the plate than at the edge. As a result, a reduction in the layer thickness at the edge of the platelet, as is frequently observed as a result of burr formation in the case of single-stage pressing, can be avoided in the subsequent step. During re-pressing (Fig. 3d to f), the layer is brought back into the desired shape with the usual embossing die (4), so that a contact plate (13) (Fig.) Provided with a solderable and weldable layer (12) is then 3f) with a uniform plating layer thickness.

Claims (8)

1. Verfahren zum Auftragen einer löt- oder schweißfähi­gen Schicht, entweder aus Silber, Silber-Kupfer und ande­ren Silberlegierungen oder aus Kupfer, Kupfer-Nickel und anderen Kupferlegierungen auf der Rückseite (Unterseite) eines Silber/MeO-Kontaktplättchens mit Me-Anteilen, vor­zugsweise aus Cadmium, Zinn, Zink, Kupfer, Wismut, Molyb­dän, Wolfram oder Indium, bei dem die MeO-Partikel faser­förmig (spießig) ausgebildet sind und mit ihrer Faser-­Sängsrichtung etwa senkrecht zur Kontaktoberfläche liegen,
dadurch gekennzeichnet,
daß die Schicht (12) als Folie (2) oder Pulver durch Warm­preßplattieren im Wege des Warmpreßschweißens unter Inert­gas- oder reduzuierender Atmosphäre aufgebracht wird.1. Method for applying a solderable or weldable layer, either made of silver, silver-copper and other silver alloys or of copper, copper-nickel and other copper alloys on the back (bottom) of a silver / MeO contact plate with Me components, preferably made of cadmium, tin, zinc, copper, bismuth, molybdenum, tungsten or indium, in which the MeO particles are fibrous (spiky) and with their fiber longitudinal direction are approximately perpendicular to the contact surface,
characterized,
that the layer (12) is applied as a film (2) or powder by hot press cladding by hot press welding under an inert gas or reducing atmosphere. 2. Verfahren nach Anspruch 1,
dadurch gekennzeichnet,
daß die Preßtemperatur zwischen 500 °C und 900°C liegt.2. The method according to claim 1,
characterized,
that the pressing temperature is between 500 ° C and 900 ° C. 3. Verfahren nach Anspruch 1,
dadurch gekennzeichnet,
daß der Preßdruck zwischen 1000 bar und 10000 bar liegt.3. The method according to claim 1,
characterized,
that the pressure is between 1000 bar and 10000 bar. 4. Verfahren nach Anspruch 1,
dadurch gekennzeichnet,
daß als umgebende Atmosphäre Wasserstoffgas, Stickstoff oder eine Mischung dieser Gase dient.4. The method according to claim 1,
characterized,
that hydrogen gas, nitrogen or a mixture of these gases serves as the surrounding atmosphere. 5. Verfahren nach einem oder mehreren
der vorhergehenden Ansprüche,
dadurch gekennzeichnet,
daß die plattierten Kontaktplättchen (13) in einer Folge­behandlung, vorzugsweise unter Inertgas, mit einer Tempe­ratur zwischen 600 °C und 950 °C geglüht werden.5. Procedure according to one or more
of the preceding claims,
characterized,
that the plated contact plates (13) are annealed in a subsequent treatment, preferably under inert gas, at a temperature between 600 ° C and 950 ° C. 6. Verfahren nach Anspruch 1,
dadurch gekennzeichnet,
daß das Plattieren in zwei Stufen (Vorpressen - Nach­pressen) erfolgt.6. The method according to claim 1,
characterized,
that the plating takes place in two stages (pre-pressing - post-pressing). 7. Preßwerkzeug zur Durchführung des Verfahrens nach einem oder mehreren der vorhergehenden Ansprüche, bestehend aus einem den äußeren Abmessungen der Kontakt­plättchen (3) entsprechenden Preßgesenk (1) sowie einem in das Preßgesenk (1) eingreifenden Preßstempel (4),
dadurch gekennzeichnet,
daß der Preßstempel (24) zum Vorpressen eine konvexe Arbeitsfläche (5) aufweist.7. Press tool for carrying out the method according to one or more of the preceding claims, consisting of a press die (1) corresponding to the outer dimensions of the contact plate (3) and a press die (4) engaging in the press die (1),
characterized,
that the press ram (24) has a convex working surface (5) for pre-pressing. 8. Preßwerkzeug zur Durchführung des Verfahrens nach einem oder mehreren der vorhergehenden Ansprüche,
dadurch gekennzeichnet,
daß es aus hochwarmfestem Stahl, aus Graphit oder aus Keramik ist.8. pressing tool for performing the method according to one or more of the preceding claims,
characterized,
that it is made of high-temperature steel, graphite or ceramic.
EP87110116A 1987-07-14 1987-07-14 Method of making silver/me0 contact plates with a weldable or solderable backing Expired - Lifetime EP0299099B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP87110116A EP0299099B1 (en) 1987-07-14 1987-07-14 Method of making silver/me0 contact plates with a weldable or solderable backing
AT87110116T ATE60163T1 (en) 1987-07-14 1987-07-14 PROCESS FOR MAKING SILVER/ME CONTACT PADS WITH SOLDERABLE OR WELDING UNDERSIDE.
DE8787110116T DE3767487D1 (en) 1987-07-14 1987-07-14 METHOD FOR THE PRODUCTION OF SILVER / ME0 CONTACT PLATES WITH A LETERABLE OR WELDABLE BASE.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP87110116A EP0299099B1 (en) 1987-07-14 1987-07-14 Method of making silver/me0 contact plates with a weldable or solderable backing

Publications (2)

Publication Number Publication Date
EP0299099A1 true EP0299099A1 (en) 1989-01-18
EP0299099B1 EP0299099B1 (en) 1991-01-16

Family

ID=8197126

Family Applications (1)

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EP87110116A Expired - Lifetime EP0299099B1 (en) 1987-07-14 1987-07-14 Method of making silver/me0 contact plates with a weldable or solderable backing

Country Status (3)

Country Link
EP (1) EP0299099B1 (en)
AT (1) ATE60163T1 (en)
DE (1) DE3767487D1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993011550A1 (en) * 1991-12-04 1993-06-10 Siemens Aktiengesellschaft Contact with a silver contact base and process for making it
WO1995008833A1 (en) * 1993-09-20 1995-03-30 Siemens Aktiengesellschaft Process for bonding a contact layer of silver-metal oxide material and a metal contact base, and suitable contact layer
EP1387370A1 (en) * 2002-08-03 2004-02-04 INOVAN GmbH &amp; Co. KG Metalle und Bauelemente Semi-finished band-shaped product
WO2010051922A3 (en) * 2008-11-06 2010-07-01 Ami Doduco Gmbh Method for producing a semi-finished part and semi-finished part for electrical contacts and contact piece
EP2946395A1 (en) * 2013-01-16 2015-11-25 Tyco Electronics Austria GmbH Contact element, relay comprising a contact element and method for producing a contact element

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1550507A (en) * 1966-12-09 1968-12-20
DE2436927A1 (en) * 1974-07-31 1976-02-19 Siemens Ag Electrical contacts mfr from silver-metal oxide powder - by pressing to obtain very low porosity, thus reducing burn-off
DE2625846A1 (en) * 1976-06-09 1977-12-22 Siemens Ag Composite strip for mfg. relay contacts - includes layer of material suitable for high temp. soldering
EP0022980A1 (en) * 1979-07-21 1981-01-28 DORNIER SYSTEM GmbH Process for manufacturing silver powder

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1550507A (en) * 1966-12-09 1968-12-20
DE2436927A1 (en) * 1974-07-31 1976-02-19 Siemens Ag Electrical contacts mfr from silver-metal oxide powder - by pressing to obtain very low porosity, thus reducing burn-off
DE2625846A1 (en) * 1976-06-09 1977-12-22 Siemens Ag Composite strip for mfg. relay contacts - includes layer of material suitable for high temp. soldering
EP0022980A1 (en) * 1979-07-21 1981-01-28 DORNIER SYSTEM GmbH Process for manufacturing silver powder

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993011550A1 (en) * 1991-12-04 1993-06-10 Siemens Aktiengesellschaft Contact with a silver contact base and process for making it
US5598629A (en) * 1991-12-04 1997-02-04 Siemens Aktiengesellschaft Process for making contact with a silver contact base
US5799771A (en) * 1991-12-04 1998-09-01 Siemens Aktiengesellschaft Contact with a silver contact base and process for making the same
WO1995008833A1 (en) * 1993-09-20 1995-03-30 Siemens Aktiengesellschaft Process for bonding a contact layer of silver-metal oxide material and a metal contact base, and suitable contact layer
CN1047462C (en) * 1993-09-20 1999-12-15 西门子公司 Process for bonding contact layer of silver-metal oxide material and metal contact base and suitable contact layer
EP1387370A1 (en) * 2002-08-03 2004-02-04 INOVAN GmbH &amp; Co. KG Metalle und Bauelemente Semi-finished band-shaped product
WO2010051922A3 (en) * 2008-11-06 2010-07-01 Ami Doduco Gmbh Method for producing a semi-finished part and semi-finished part for electrical contacts and contact piece
RU2497632C2 (en) * 2008-11-06 2013-11-10 Додуко Гмбх Method of making part semis for electric terminals and electric terminal component
US8992826B2 (en) 2008-11-06 2015-03-31 Doduco Gmbh Method for producing a semifinished product and semifinished product for electrical contacts and contact piece
EP2946395A1 (en) * 2013-01-16 2015-11-25 Tyco Electronics Austria GmbH Contact element, relay comprising a contact element and method for producing a contact element

Also Published As

Publication number Publication date
ATE60163T1 (en) 1991-02-15
DE3767487D1 (en) 1991-02-21
EP0299099B1 (en) 1991-01-16

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