EP0286022B1 - Coil bodies and method for producing them - Google Patents

Coil bodies and method for producing them Download PDF

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Publication number
EP0286022B1
EP0286022B1 EP88105255A EP88105255A EP0286022B1 EP 0286022 B1 EP0286022 B1 EP 0286022B1 EP 88105255 A EP88105255 A EP 88105255A EP 88105255 A EP88105255 A EP 88105255A EP 0286022 B1 EP0286022 B1 EP 0286022B1
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EP
European Patent Office
Prior art keywords
pins
solder
soldering pins
injected
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP88105255A
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German (de)
French (fr)
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EP0286022A1 (en
Inventor
Eberhard Dipl.-Ing. Lehmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hohenloher Spulenkoerperfabrik GmbH and Co
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Hohenloher Spulenkoerperfabrik GmbH and Co
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Publication of EP0286022A1 publication Critical patent/EP0286022A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/04—Arrangements of electric connections to coils, e.g. leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings

Definitions

  • the invention relates to a process for the production of injection-molded plastic bobbins with solder pins, in which the solder pins are inserted into the injection mold and then injected into the material of the coil former.
  • the invention further relates to a coil former produced by such a method.
  • solder pins have a thickened head which improves the anchoring of the solder pin in the coil former against axial pull-out forces (e.g. DE-A-33 41 304).
  • solder pins are usually made of copper, bronze, brass, nickel silver or similar metals. Such solder pins are not readily solderable. Therefore, galvanized or hot-dip tinned soldering pins are used in known technology, which are supplied with the tinned surface and inserted into the injection mold. The same applies in the event that the solder pins from a wire roll into the injection mold and cut there. The corresponding wires also have tin-plated surfaces.
  • Coil formers that have to meet higher requirements with regard to the solderability of their soldering pins must therefore either be manufactured with particular care or subjected to thorough testing and sorting with a high rejection rate.
  • connection element for electronic components which is connected to the component by soldering.
  • a solder bead is produced for each connection element, which acts as a spacer before the soldering process.
  • the ends of the connection elements are held in a heat-dissipating manner and the component is immersed in a solder bath together with the end of the connection elements pointing towards the component.
  • the desired solder bead is then formed when the connection element is pulled out.
  • the tinning with the manufacture of the solder pearl can be carried out before, during or after the attachment of the connection element to the component. The free end of the connection elements always remains untinned.
  • the invention has for its object to provide a method with which the bobbin with injected solder pins can be manufactured so that the solder pins with a high security have high soldering requirements.
  • solder pins without surface coating are inserted into the injection mold and then injected into the material of the coil former and that the solder pins are then immersed in a flux and then completely provided with a metal coating outside the coil former will.
  • the above-mentioned object is also achieved with a coil body made of injection-molded plastic with solder pins injected into a terminal block if the solder pins have a non-surface-treated section which projects into the plastic body and, moreover, a hot-dip tinned surface.
  • the bobbins are manufactured in a departure from the process that has been common for decades, namely with loosening pins that have not been surface-treated. It has been shown that a completely flawless surface of the untreated solder pins can be produced if they are immersed in a flux and then provided with the metal coating, preferably by immersion in a lead-zinc bath. Compared to other conceivable methods for applying the metal coating to the injected soldering pins, immersion in the lead-tin bath has the advantage that the coil body can be kept free of the metallic coating in a defined manner without special measures being required for this.
  • solder pins therefore do not have a surface coating, insofar as they are surrounded by the plastic body, but only receive this on the part protruding from the plastic body. Since the preferably hot-dip tinned surface is produced according to the invention in a last manufacturing step, it is not subject to any subsequent mechanical loads and can therefore reach the user completely intact, so that it also meets the highest requirements for solderability.
  • pre-cut solder pins are inserted into the injection mold or the solder pins are fed from a wire roll and are only cut when, before or after the injection mold is closed.
  • the drawing shows a simple exemplary embodiment of a coil former according to the invention, the left side of the symmetrical coil former being shown in a view and the right side in a section.
  • the coil former has flanges 2 on both sides of a winding space 1.
  • a terminal block 3 into which solder pins 4 are injected.
  • the solder pins 4 have a thickened head 5, which makes it difficult to pull the solder pins 4 out of the terminal block 3.
  • solder pins are bare within the terminal block 3, i.e. executed without a surface.
  • the parts of the soldering pins 4 protruding from the coil body, on the other hand, are provided with a subsequently applied surface layer 6, which is produced, for example, by immersing them in a lead-tin bath (lead: tin 40:60 proportions).
  • the immersion depth can be set very precisely, so that the solder pin 4 can be provided with the surface layer 6 practically over the entire length protruding from the terminal block 3.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Molten Solder (AREA)

Description

Die Erfindung betrifft ein Verfahren zur Herstellung von gespritzten Kunststoff-Spulenkörpern mit Lötstiften, bei dem die Lötstifte in die Spritzform eingeführt und anschließend in das Material des Spulenkörpers eingespritzt werden. Die Erfindung betrifft ferner einen nach einem derartigen Verfahren hergestellten Spulenkörper.The invention relates to a process for the production of injection-molded plastic bobbins with solder pins, in which the solder pins are inserted into the injection mold and then injected into the material of the coil former. The invention further relates to a coil former produced by such a method.

Es ist seit vielen Jahren bekannt, derartige Spulenkörper in rationeller Weise dadurch herzustellen, daß die Lötstifte in die Spritzform eingeführt und mit dem Material des Spulenkörpers umspritzt werden, so daß sie bereits durch den Spritzvorgang in dem Spulenkörper fest verankert sind. Zur Verbesserung der Verankerung weisen die Lötstifte üblicherweise einen verdickten Kopf auf, der die Verankerung des Lötstiftes in dem Spulenkörper gegen axiale Auszugskräfte verbessert (z.B. DE-A-33 41 304).It has been known for many years to produce such bobbins in a rational manner by inserting the soldering pins into the injection mold and overmolding with the material of the bobbin so that they are already firmly anchored in the bobbin by the spraying process. To improve the anchoring, the solder pins usually have a thickened head which improves the anchoring of the solder pin in the coil former against axial pull-out forces (e.g. DE-A-33 41 304).

Die Lötstifte bestehen üblicherweise aus Kupfer, Bronze, Messing, Neusilber oder ähnlichen Metallen. Derartige Lötstifte sind nicht ohne weiteres lötfähig. Es werden daher in bekannter Technik galvanisch verzinnte oder feuerverzinnte Lötstifte verwendet, die mit der verzinnten Oberfläche angeliefert und in die Spritzform eingeführt werden. Gleiches gilt für den Fall, daß die Lötstifte von einer Drahtrolle in die Spritzform zugeführt und dort abgeschnitten werden. Die entsprechenden Drähte weisen ebenfalls galvanisch verzinnte Oberflächen auf.The solder pins are usually made of copper, bronze, brass, nickel silver or similar metals. Such solder pins are not readily solderable. Therefore, galvanized or hot-dip tinned soldering pins are used in known technology, which are supplied with the tinned surface and inserted into the injection mold. The same applies in the event that the solder pins from a wire roll into the injection mold and cut there. The corresponding wires also have tin-plated surfaces.

Nähe Untersuchungen haben gezeigt, daß es relativ schwierig ist, Spulenkörper herzustellen, deren Lötstifte höhere Anforderungen an die Lötfähigkeit erfüllen (z. B. MIL-Standard). Die galvanisch verzinnte oder feuerverzinnte Oberfläche wird beim Spritzvorgang leicht mit Kunststoff verunreinigt. Ein eventuelles Abstrahlen des Kunststoffkörpers zum Entgraten führt zu Beschädigungen der Oberfläche. Bereits beim Einsetzen in das Werkzeug können die Oberflächen durch ein schabendes Einschieben beschädigt werden.Close investigations have shown that it is relatively difficult to produce bobbins with solder pins that meet higher soldering requirements (e.g. MIL standard). The galvanized or hot-dip tinned surface is easily contaminated with plastic during the spraying process. Any blasting of the plastic body for deburring will damage the surface. The surfaces can be damaged by being scraped in as soon as they are inserted into the tool.

Spulenkörper, die höheren Anforderungen bezüglich der Lötfähigkeit ihrer Lötstifte erfüllen müssen, müssen daher entweder besonders sorgfältig gefertigt oder einer eingehenden Prüfung und Aussortierung mit einer hohen Ausschußquote unterzogen werden.Coil formers that have to meet higher requirements with regard to the solderability of their soldering pins must therefore either be manufactured with particular care or subjected to thorough testing and sorting with a high rejection rate.

Durch DE-A-24 48 296 ist ein Anschlußelement für elektronische Bauelemente bekannt, das mit dem Bauelement durch Lötung verbunden wird. Um beim Einstecken der Anschlußelemente des Bauelements in eine Lötplatine ein Durchrutschen des Bauelements zu verhindern und einen definierten Abstand zu gewährleisten, wird jedem Anschlußelement eine Lotperle hergestellt, die als Abstandshalter vor dem Lötvorgang fungiert. Für die Herstellung der Lotperle werden die Enden der Anschlußelemente wärmeableitend gehalten und das Bauelement zusammen mit dem zum Bauelement zeigenden Ende der Anschlußelemente in ein Lotbad getaucht. Im Bereich der Oberfläche des Lotbads bildet sich dann beim Herausziehen des Anschlußelements die gewünschte Lotperle aus. Die Verzinnung mit der Herstellung der Lotperle kann vor, bei oder nach der Befestigung des Anschlußelements an dem Bauelement vorgenommen werden. Dabei bleibt das freie Ende der Anschlußelemente immer unverzinnt.From DE-A-24 48 296 a connection element for electronic components is known which is connected to the component by soldering. In order to prevent the component from slipping when inserting the connection elements of the component into a soldering board and to ensure a defined distance, a solder bead is produced for each connection element, which acts as a spacer before the soldering process. For the manufacture of the solder pearl, the ends of the connection elements are held in a heat-dissipating manner and the component is immersed in a solder bath together with the end of the connection elements pointing towards the component. In the area of the surface of the solder bath, the desired solder bead is then formed when the connection element is pulled out. The tinning with the manufacture of the solder pearl can be carried out before, during or after the attachment of the connection element to the component. The free end of the connection elements always remains untinned.

Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren anzugeben, mit dem Spulenkörper mit eingespritzten Lötstiften so gefertigt werden können, daß die Lötstifte mit hoher Sicherheit eine auch hohen Anforderungen gerecht werdende Lötfähigkeit aufweisen.The invention has for its object to provide a method with which the bobbin with injected solder pins can be manufactured so that the solder pins with a high security have high soldering requirements.

Diese Aufgabe wird erfindungsgemäß mit einem Verfahren der eingangs erwähnten Art dadurch gelöst, daß in die Spritzform Lötstifte ohne Oberflächenüberzug eingesetzt und anschließend in das Material des Spulenkörpers eingespritzt werden und daß danach die Lötstifte in ein Fluxmittel getaucht und anschließend außerhalb des Spulenkörpers vollständig mit einem Metallüberzug versehen werden.This object is achieved according to the invention by a method of the type mentioned at the outset that solder pins without surface coating are inserted into the injection mold and then injected into the material of the coil former and that the solder pins are then immersed in a flux and then completely provided with a metal coating outside the coil former will.

Die erwähnte Aufgabe wird ferner mit einem Spulenkörper aus gespritztem Kunststoff mit in einer Anschlußleiste eingespritzten Lötstiften gelöst, wenn die Lötstifte einen nichtoberflächenbehandelten, in den Kunststoffkörper ragenden Abschnitt und im übrigen eine feuerverzinnte Oberfläche aufweisen.The above-mentioned object is also achieved with a coil body made of injection-molded plastic with solder pins injected into a terminal block if the solder pins have a non-surface-treated section which projects into the plastic body and, moreover, a hot-dip tinned surface.

Erfindungsgemäß werden die Spulenkörper in Abkehr von dem seit Jahrzehnten üblichen Verfahren gefertigt, nämlich mit nichtoberflächenbehandelten Löststiften. Es hat sich gezeigt, daß eine völlig einwandfreie Oberfläche der unbehandelten Lötstifte herstellbar ist, wenn diese in ein Fluxmittel getaucht und anschließend mit dem Metallüberzug, vorzugsweise durch Eintauchen in ein Blei-Zinkbad, versehen werden. Gegenüber anderen denkbaren Verfahren zur Aufbringung des Metallüberzugs auf die eingespritzten Lötstifte hat das Eintauchen in das Blei-Zinnbad den Vorteil, daß der Spulenkörper in definierter Weise von dem metallischen Überzug freigehalten werden kann, ohne daß hierfür besondere Maßnahmen erforderlich wären. Die Lötstifte weisen daher - soweit sie von dem Kunststoffkörper umgeben sind - keine Oberflächenbeschichtung auf, sondern erhalten diese lediglich an dem aus dem Kunststoffkörper herausragenden Teil. Da die vorzugsweise feuerverzinnte Oberfläche erfindungsgemäß in einem letzten Herstellungsschritt produziert wird, unterliegt sie keinen anschließenden mechanischen Belastungen und kann daher völlig unversehrt zum Anwender gelangen, so daß sie auch höchsten Anforderungen an die Lötfähigkeit gerecht wird.According to the invention, the bobbins are manufactured in a departure from the process that has been common for decades, namely with loosening pins that have not been surface-treated. It has been shown that a completely flawless surface of the untreated solder pins can be produced if they are immersed in a flux and then provided with the metal coating, preferably by immersion in a lead-zinc bath. Compared to other conceivable methods for applying the metal coating to the injected soldering pins, immersion in the lead-tin bath has the advantage that the coil body can be kept free of the metallic coating in a defined manner without special measures being required for this. The solder pins therefore do not have a surface coating, insofar as they are surrounded by the plastic body, but only receive this on the part protruding from the plastic body. Since the preferably hot-dip tinned surface is produced according to the invention in a last manufacturing step, it is not subject to any subsequent mechanical loads and can therefore reach the user completely intact, so that it also meets the highest requirements for solderability.

Selbstverständlich ist es für das erfindungsgemäße Verfahren völlig unerheblich, ob vorgeschnittene Lötstifte in die Spritzform eingesetzt werden oder die Lötstifte von einer Drahtrolle zugeführt und erst bei, vor oder nach dem Schließen der Spritzform geschnitten werden.It is of course completely irrelevant for the method according to the invention whether pre-cut solder pins are inserted into the injection mold or the solder pins are fed from a wire roll and are only cut when, before or after the injection mold is closed.

Die Zeichnung zeigt ein einfaches Ausführungsbeispiel für einen erfindungsgemäßen Spulenkörper, wobei die linke Seite des symmetrischen Spulenkörpers in einer Ansicht und die rechte Seite in einem Schnitt dargestellt ist.The drawing shows a simple exemplary embodiment of a coil former according to the invention, the left side of the symmetrical coil former being shown in a view and the right side in a section.

Der Spulenkörper weist in üblicher Weise auf beiden Seiten eines Wickelraums 1 Flansche 2 auf. An den unteren Flansch schließt sich eine Anschlußleiste 3 an, in die Lötstifte 4 eingespritzt sind. Am eingespritzten Ende weisen die Lötstifte 4 einen verdickten Kopf 5 auf, der den Auszug der Lötstifte 4 aus der Anschlußleiste 3 erschwert.In the usual way, the coil former has flanges 2 on both sides of a winding space 1. At the lower flange there is a terminal block 3 into which solder pins 4 are injected. At the injected end, the solder pins 4 have a thickened head 5, which makes it difficult to pull the solder pins 4 out of the terminal block 3.

Die Lötstifte sind innerhalb der Anschlußleiste 3 blank, d.h. ohne eine Oberfläche ausgeführt. Die aus dem Spulenkörper herausragenden Teile der Lötstifte 4 sind hingegen mit einer nachträglich aufgebrachten Oberflächenschicht 6 versehen, die beispielsweise durch Eintauchen in ein Blei-Zinnbad (Anteile Blei : Zinn 40 : 60) hergestellt ist.The solder pins are bare within the terminal block 3, i.e. executed without a surface. The parts of the soldering pins 4 protruding from the coil body, on the other hand, are provided with a subsequently applied surface layer 6, which is produced, for example, by immersing them in a lead-tin bath (lead: tin 40:60 proportions).

Die Eintauchtiefe läßt sich sehr genau einstellen, so daß der Lötstift 4 praktisch über die gesamte, aus der Anschlußleiste 3 herausragenden Länge mit der Oberflächenschicht 6 versehen sein kann.The immersion depth can be set very precisely, so that the solder pin 4 can be provided with the surface layer 6 practically over the entire length protruding from the terminal block 3.

Claims (3)

  1. Method of manufacturing injected plastics coil bodies having soldering pins (4), in which the soldering pins (4) are introduced into an injection mould and are then fixed to the material of the coil body by injecting said material, characterized in that soldering pins (4) without a surface coating are inserted in the injection mould, the material of the coil body is then injected, and in that subsequently the soldering pins (4) are immersed in a flux and are then provided on the whole of the outside of the coil body with a metal coating (6).
  2. Method according to Claim 1, characterized in that the soldering pins (4) are immersed in a lead/tin bath after they have been immersed in the flux.
  3. Coil body of injected plastics having soldering pins (4) injected into a terminal strip (3), characterized in that the soldering pins (4) have a section which is not surface-treated and which penetrates into the plastics body, and have in the remaining part a tin-plated surface (6).
EP88105255A 1987-03-31 1988-03-31 Coil bodies and method for producing them Expired - Lifetime EP0286022B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3710783 1987-03-31
DE19873710783 DE3710783A1 (en) 1987-03-31 1987-03-31 BOBBIN AND METHOD FOR THEIR PRODUCTION

Publications (2)

Publication Number Publication Date
EP0286022A1 EP0286022A1 (en) 1988-10-12
EP0286022B1 true EP0286022B1 (en) 1992-08-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP88105255A Expired - Lifetime EP0286022B1 (en) 1987-03-31 1988-03-31 Coil bodies and method for producing them

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EP (1) EP0286022B1 (en)
DE (2) DE3710783A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19913708A1 (en) * 1999-03-26 2000-09-28 Hohenloher Kunststofftechnik G Coil lead terminal for fastening in a body of coil manufacturing by cutting off section of set length and subjecting it to deformation for formation head
DE10148133A1 (en) 2001-09-28 2003-04-24 Ascom Energy Systems Ag Bern Flat transformer with inserted secondary windings

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1763096U (en) * 1958-01-29 1958-03-13 Max Grundig FLANGE COIL BODY FOR COILS, COIL COMBINATIONS, TRANSFORMERS OD. DGL.
DE2448296A1 (en) * 1974-10-10 1976-04-22 Draloric Electronic Leads for electronic components fitting on circuit board - consist of a tinned wire or metal strip with solder bead exceed hole internal diameter
DE3341304C2 (en) * 1983-11-15 1986-03-06 Hohenloher Spulenkörperfabrik, 7110 Öhringen Electrical component and process for its manufacture

Also Published As

Publication number Publication date
EP0286022A1 (en) 1988-10-12
DE3873956D1 (en) 1992-10-01
DE3710783A1 (en) 1988-10-20

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