EP0159873A3 - Coating composition and method for partially soldering a substrate - Google Patents
Coating composition and method for partially soldering a substrate Download PDFInfo
- Publication number
- EP0159873A3 EP0159873A3 EP85302570A EP85302570A EP0159873A3 EP 0159873 A3 EP0159873 A3 EP 0159873A3 EP 85302570 A EP85302570 A EP 85302570A EP 85302570 A EP85302570 A EP 85302570A EP 0159873 A3 EP0159873 A3 EP 0159873A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- coating composition
- substrate
- mask
- coating
- peelable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J191/00—Adhesives based on oils, fats or waxes; Adhesives based on derivatives thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/224—Anti-weld compositions; Braze stop-off compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
- C08L91/06—Waxes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D157/00—Coating compositions based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/008—Temporary coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59954084A | 1984-04-12 | 1984-04-12 | |
US599540 | 1984-04-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0159873A2 EP0159873A2 (en) | 1985-10-30 |
EP0159873A3 true EP0159873A3 (en) | 1987-05-27 |
Family
ID=24400046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP85302570A Withdrawn EP0159873A3 (en) | 1984-04-12 | 1985-04-12 | Coating composition and method for partially soldering a substrate |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0159873A3 (en) |
JP (1) | JPS60229398A (en) |
KR (1) | KR850007266A (en) |
CA (1) | CA1219961A (en) |
PH (1) | PH21221A (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02143489A (en) * | 1988-11-24 | 1990-06-01 | Nippon Avionics Co Ltd | Printed-wiring board |
KR100267229B1 (en) | 1997-09-03 | 2000-10-16 | 윤종용 | Method of preventing pollution in Print Circuit Board which have gold-plated terminals |
JP5695110B2 (en) * | 2012-06-25 | 2015-04-01 | Jeインターナショナル株式会社 | Removal device, coating removal system, removal method, and coating removal method |
US9545011B2 (en) | 2015-05-13 | 2017-01-10 | International Business Machines Corporation | Dry film solder mask composite laminate materials |
FR3133193A1 (en) * | 2022-03-04 | 2023-09-08 | Jet Metal Technologies | COMPOSITION FOR PRODUCING MASK COATING FOR THE MANUFACTURE OF THREE-DIMENSIONAL ARTICLES WITH METAL PATTERN(S) |
WO2023166271A1 (en) * | 2022-03-04 | 2023-09-07 | Jet Metal Technologies | Method for producing selectively metallised three-dimensional items with a masking coating composition |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2740193A (en) * | 1953-07-01 | 1956-04-03 | Rca Corp | Method of soldering printed circuits |
US3322707A (en) * | 1964-06-11 | 1967-05-30 | Union Carbide Corp | Coating compositions |
US3375215A (en) * | 1964-09-18 | 1968-03-26 | Du Pont | Cellophane coating compositions comprising vinylidene chloride copolymer, candelillawax and stearate salt |
US3647730A (en) * | 1969-08-27 | 1972-03-07 | Western Electric Co | Masking compositions |
UST900017I4 (en) * | 1971-03-22 | 1972-07-25 | Defensive publication | |
US4240945A (en) * | 1979-01-31 | 1980-12-23 | Albert Gabrick | Solder mask composition |
-
1985
- 1985-03-29 CA CA000477864A patent/CA1219961A/en not_active Expired
- 1985-04-08 PH PH32101A patent/PH21221A/en unknown
- 1985-04-10 JP JP60076333A patent/JPS60229398A/en active Pending
- 1985-04-12 KR KR1019850002471A patent/KR850007266A/en not_active Application Discontinuation
- 1985-04-12 EP EP85302570A patent/EP0159873A3/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2740193A (en) * | 1953-07-01 | 1956-04-03 | Rca Corp | Method of soldering printed circuits |
US3322707A (en) * | 1964-06-11 | 1967-05-30 | Union Carbide Corp | Coating compositions |
US3375215A (en) * | 1964-09-18 | 1968-03-26 | Du Pont | Cellophane coating compositions comprising vinylidene chloride copolymer, candelillawax and stearate salt |
US3647730A (en) * | 1969-08-27 | 1972-03-07 | Western Electric Co | Masking compositions |
UST900017I4 (en) * | 1971-03-22 | 1972-07-25 | Defensive publication | |
US4240945A (en) * | 1979-01-31 | 1980-12-23 | Albert Gabrick | Solder mask composition |
Also Published As
Publication number | Publication date |
---|---|
EP0159873A2 (en) | 1985-10-30 |
PH21221A (en) | 1987-08-21 |
JPS60229398A (en) | 1985-11-14 |
CA1219961A (en) | 1987-03-31 |
KR850007266A (en) | 1985-12-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Designated state(s): AT BE CH DE FR GB IT LI LU NL SE |
|
17P | Request for examination filed |
Effective date: 19860310 |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE CH DE FR GB IT LI LU NL SE |
|
17Q | First examination report despatched |
Effective date: 19880526 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 19881006 |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: ST. JOHN, FRANK Inventor name: MARTIN, FRANK WAYNE |