EP0157451A2 - Carrier for printed-circuit boards - Google Patents

Carrier for printed-circuit boards Download PDF

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Publication number
EP0157451A2
EP0157451A2 EP85200404A EP85200404A EP0157451A2 EP 0157451 A2 EP0157451 A2 EP 0157451A2 EP 85200404 A EP85200404 A EP 85200404A EP 85200404 A EP85200404 A EP 85200404A EP 0157451 A2 EP0157451 A2 EP 0157451A2
Authority
EP
European Patent Office
Prior art keywords
pins
support
base plate
directional
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP85200404A
Other languages
German (de)
French (fr)
Other versions
EP0157451A3 (en
EP0157451B1 (en
Inventor
Hans Gumbert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Intellectual Property and Standards GmbH
Koninklijke Philips NV
Original Assignee
Philips Patentverwaltung GmbH
Philips Gloeilampenfabrieken NV
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Patentverwaltung GmbH, Philips Gloeilampenfabrieken NV, Koninklijke Philips Electronics NV filed Critical Philips Patentverwaltung GmbH
Priority to AT85200404T priority Critical patent/ATE64060T1/en
Publication of EP0157451A2 publication Critical patent/EP0157451A2/en
Publication of EP0157451A3 publication Critical patent/EP0157451A3/en
Application granted granted Critical
Publication of EP0157451B1 publication Critical patent/EP0157451B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/90—Supporting structure having work holder receiving apertures or projections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems

Definitions

  • the invention relates to a product carrier for printed circuit boards, which are fed to it for processing, in particular assembly with components, the circuit boards being provided with alignment holes, which engage in alignment pins which can be placed on the base plate of the carrier, around the circuit board the product carrier in a certain position and height to the base plate.
  • Printed circuit boards placed on the product carrier are fixed by the alignment pins above the base plate in a processing plane.
  • the product carriers are placed on transport devices and move to the various processing positions with the printed circuit boards on them.
  • From DE-OS 29 15 366 it is known to provide the alignment pins on an assembly tool.
  • the printed circuit board moved into the processing position by a transport device is aligned in the processing position in that alignment pins penetrate into alignment holes in the circuit board.
  • This processing method is relatively imprecise, since tolerances between the alignment holes of the printed circuit board and the alignment pins are not permitted for correct assembly. Aligning the printed circuit boards with the help of alignment pins, which move into them in the processing position, requires the admission of certain tolerances for trouble-free operation.
  • the product carrier is used, for example, for the chip mounting of printed circuit boards, then it turns out that, due to the high work performance of chip mounting machines, it is relatively often necessary to change the board types. Changing a circuit board type makes it necessary to place the alignment pins differently. This can be done by screwing it over. Screwing it around is time-consuming, however, and flexibility in moving the alignment pins is limited. Added to this is the fact that the printed circuit boards may be subjected to excessive bending stress when larger printed circuit boards are only supported at the corners.
  • the object is achieved in that the alignment pins on the base plate are arranged individually lowerable and between the lowerable alignment pins setting fields for support pins are provided, within which the support pins can be placed in each case, from which these pins on the possibly already with specific components assemble the lower side of the circuit board between these components from below to supplement a support level up to the lower assembly side.
  • the alignment pins are placed in such a way that they always engage in the alignment holes provided on the edge of the circuit board, it being sufficient for the circuit board to be supported with two alignment pins.
  • the other alignment pins that do not match the hole arrangement of the circuit board are simply lowered.
  • the support pins which can be placed on a large number of placement points within the placement fields, provide further support for the circuit board. This enables a sufficient number of support points to be found at a sufficient number of placement points.
  • the setting fields can be designed in different ways. According to an advantageous embodiment of the invention, it is provided that the setting fields are determined by bores in the base plate into which the support pins can be inserted.
  • the holes preferably extend in the form of a hole pattern over the base plate.
  • foot pins are inserted into the bores, onto which the support pins can be plugged with a socket provided on their feet. In this way it is always ensured that the upper edges of the support pins come to lie exactly in the support plane.
  • the alignment pins are arranged in vertical guide channels of support blocks, which are releasably attached to the base plate, and that in punctures Straightening pins can be inserted transversely to the guide channels, locking pins which engage in the recesses in the raised position of the straightening pins. By pulling out and reinserting the locking pins, the alignment pins can thus be brought into the support plane or lowered below the support plane.
  • the alignment pins are provided at the support end for the circuit board with a support surface for this plate, from the middle of which a directional projection protrudes, which engages in a directional hole of the circuit board. The contact surfaces of the alignment pins are in the support plane when the pins are raised.
  • the support blocks 3 are located on the edge 7 of the base plate.
  • three support blocks 3 are provided, of which one of the support blocks is provided with two alignment pins 5.
  • Bores are provided between the support blocks 3 and thus also between the alignment pins 5, into which bores can be inserted, which can be seen from FIG. 2.
  • the holes extend in the manner of a grid essentially over the entire base plate or its parts free of support blocks.
  • Fig. 2 shows the base plate 1 in section II-II and screwed onto the base plate two straightening blocks 3.
  • the screwing of the straightening blocks 3 on the base plate 1 is carried out with the help of screws 9.
  • the alignment of the support blocks is provided by connecting pins 11 which extend from the base plate 1 extend into the directional blocks 3.
  • vertical guide channels 13 are provided, in which the directional pins 5 can be pushed up and down.
  • the straightening pins 5 are provided at their support end with a support surface 17, from the middle of which a straightening projection 19 protrudes, which engages in a straightening hole 21 of a printed circuit board 23.
  • Foot pins 25 are inserted into the holes 8 of the base plate, and foot pins 25 of this type are seated in all holes 8 of the setting fields 27.
  • Support pins 29 can be placed on the foot pins 25. These support pins have the diameter of the foot pins 25, and at their foot end they are provided with a plug-in sleeve 31 which can be plugged onto the desired foot pin.
  • the upper end 33 of the support pin 29 comes to lie exactly on the underside 35 of the circuit board 23.
  • the contact surfaces 17 of the raised alignment pins 5 and the upper ends 33 of the support pins 25 fall into the support plane 37 on which the printed circuit board 23 rests flat.
  • As many support pins 29 are used as are necessary for the Support PCB 23 in addition to the support in the alignment pins 5 safely. Since there is a great variability in the setting of the support pins 29, the support pins 29 can be placed with the underside 35 of the circuit board already populated in such a way that they always abut against the underside 35 of the circuit board between existing
  • FIG. 3 shows the height adjustment possibility of the support pins 5 on the basis of the section III-III according to FIG. 1.
  • a locking pin 39 extends transversely to the guide channel 13 with a handle knob 41 and a tip 43.
  • the tip 43 engages in a recess 45 of the directional pin 5 when the directional pin 5 is pulled up into the support position.
  • the locking pin 39 is always pressed in the direction of the guide channel 13 by means of a spring 49.
  • the directional pin 5 is shown in the raised position. This corresponds to the position in Fig. 2, in which the directional pin 5 touches the underside 35 of the circuit board.
  • the directional pin 5 sits with its bottom surface 47 on the upper side 51 of a lower end plate 53, then the directional pin 5 is in the lowered position.
  • This lowered position is the position in FIG. 2 which the right-hand pin 5 shown on the far right assumes.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Jigs For Machine Tools (AREA)
  • Fats And Perfumes (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

The invention relates to a product carrier for circuit boards (23), which are subjected on this carrier to an operation, more particularly to a component mounting operation. The circuit boards (23) are provided for this purpose with location holes (21), into which location pins (5) engage, which can be arranged on the base plate (1) of the carrier in order to fix the circuit board (23) on the product carrier in a given position and at a given height with respect to the base plate (1). The location pins (5) are arranged on the base plate (1) so that they can be individually lowered. Between the location pins (5) there are provided mounting areas (27) for supporting pins (29), from which these pins (29) extend vertically up to the lower side (35) of the circuit board (23) between components which may already be provided at said side to additionally define a supporting plane (37).

Description

Die Erfindung bezieht sich auf einen Produktträger für Leiterplatten, die auf ihm einer Bearbeitung, insbesondere einer Bestückung mit Bauelementen zugeführt werden, wobei die Schaltungsplatten mit Richtlöchern versehen sind, in die Richtstifte eingreifen, die an der Grundplatte des Trägers setzbar sind, um die Schaltungsplatte auf dem Produktträger in einer bestimmten Stellung und Höhe zur Grundplatte festzulegen.The invention relates to a product carrier for printed circuit boards, which are fed to it for processing, in particular assembly with components, the circuit boards being provided with alignment holes, which engage in alignment pins which can be placed on the base plate of the carrier, around the circuit board the product carrier in a certain position and height to the base plate.

Auf den Produktträger aufgesetzte Leiterplatten werden von den Richtstiften oberhalb der Grundplatte in einer Bearbeitungsebene festgelegt. Die Produktträger werden auf Transportvorrichtungen gesetzt und fahren mit den auf ihnen aufliegenden Leiterplatten in verschiedene Bearbeitungspositionen. Aus der DE-OS 29 15 366 ist es bekannt, die Richtstifte an einem Bestückungswerkzeug vorzusehen. Die von einer Transportvorrichtung in die Bearbeitungsposition gefahrene Leiterplatte wird in der Bearbeitungsposition ausgerichtet, indem Richtstifte in Richtlöcher der Leiterplatte eindringen. Diese Bearbeitungsmethode ist relativ ungenau, da für ein einwandfreies Bestücken Toleranzen zwischen den Richtlöchern der Leiterplatte und den Richtstiften unzulässig sind. Ein Ausrichten der Leiterplatten mit Hilfe von Richtstiften, die in der Bearbeitungsposition in diese einfahren, verlangt für einen störungsfreien Betrieb die Zulassung gewisser Toleranzen.Printed circuit boards placed on the product carrier are fixed by the alignment pins above the base plate in a processing plane. The product carriers are placed on transport devices and move to the various processing positions with the printed circuit boards on them. From DE-OS 29 15 366 it is known to provide the alignment pins on an assembly tool. The printed circuit board moved into the processing position by a transport device is aligned in the processing position in that alignment pins penetrate into alignment holes in the circuit board. This processing method is relatively imprecise, since tolerances between the alignment holes of the printed circuit board and the alignment pins are not permitted for correct assembly. Aligning the printed circuit boards with the help of alignment pins, which move into them in the processing position, requires the admission of certain tolerances for trouble-free operation.

Günstiger sind deshalb Produktträger mit Grundplatte und Richtstiften an ihr, da so außerhalb der Bearbeitungsposition ein toleranzfreies und sicheres Aufsetzen der Leiterplatten möglich ist.Product carriers with a base plate and alignment pins on it are therefore cheaper, since it allows tolerance-free and secure placement of the circuit boards outside of the processing position.

Wenn der Produktträger beispielsweise für das Chip-Bestücken von Leiterplatten eingesetzt wird, dann zeigt es sich, daß infolge der hohen Arbeitsleistung von Chip-Bestückungsmaschinen relativ häufig ein Wechsel der Leiterplattentypen notwendig ist. Der Wechsel eines Leiterplattentyps macht es aber notwendig, auch die Richtstifte anders zu plazieren. Dies kann durch ein Umschrauben erfolgen. Ein Umschrauben ist aber zeitaufwendig, und die Flexibilität hinsichtlich des Versetzens der Richtstifte ist begrenzt. Hinzu kommt noch, daß die Leiterplatten beim Bestücken möglicherweise zu sehr auf Biegung beansprucht werden, wenn größere Leiterplatten nur an den Ecken abgestützt sind.If the product carrier is used, for example, for the chip mounting of printed circuit boards, then it turns out that, due to the high work performance of chip mounting machines, it is relatively often necessary to change the board types. Changing a circuit board type makes it necessary to place the alignment pins differently. This can be done by screwing it over. Screwing it around is time-consuming, however, and flexibility in moving the alignment pins is limited. Added to this is the fact that the printed circuit boards may be subjected to excessive bending stress when larger printed circuit boards are only supported at the corners.

Es ist Aufgabe der Erfindung, einen Produktträger zu schaffen, der ohne großen technischen Aufwand kurzfristig und mit wenigen Handgriffen umrüstbar ist für einen anderen Schaltungsplattentyp.It is an object of the invention to provide a product carrier which can be converted for another type of circuit board at short notice and with a few hand movements without great technical effort.

Die gestellte Aufgabe ist erfindungsgemäß dadurch gelost, daß die Richtstifte an der Grundplatte einzeln absenkbar angeordnet und zwischen den absenkbaren Richtstiften Setzfelder für Stützstifte vorgesehen sind, innerhalb der die Stützstifte jeweils an Stellen setzbar sind, von denen aus diese Stifte an der gegebenenfalls bereits mit konkreten Bauelementen bestückten unteren Seite der Schaltungsplatte zwischen diesen Bauelementen hindurch von unten her zur Ergänzung einer Stützebene bis zur unteren Bestückungsseite hoch reichen.The object is achieved in that the alignment pins on the base plate are arranged individually lowerable and between the lowerable alignment pins setting fields for support pins are provided, within which the support pins can be placed in each case, from which these pins on the possibly already with specific components assemble the lower side of the circuit board between these components from below to supplement a support level up to the lower assembly side.

Die Richtstifte werden dabei so plaziert, daß sie immer am Rand der Leiterplatte in dort vorgesehene Richtlöcher eingreifen, wobei es genügt, daß die Leiterplatte mit zwei Richtstiften abgestützt wird. Die anderen Richtstifte, die nicht zu der Lochanordnung der Leiterplatte passen, werden einfach abgesenkt. Die weitere Unterstützung der Leiterplatte übernehmen die Stützstifte, die auf eine große Anzahl von Plazierungsstellen innerhalb der Setzfelder gesetzt werden können. Dadurch lassen sich genügend viele Abstützpunkte an genügend vielen Plazierungsstellen finden.The alignment pins are placed in such a way that they always engage in the alignment holes provided on the edge of the circuit board, it being sufficient for the circuit board to be supported with two alignment pins. The other alignment pins that do not match the hole arrangement of the circuit board are simply lowered. The support pins, which can be placed on a large number of placement points within the placement fields, provide further support for the circuit board. This enables a sufficient number of support points to be found at a sufficient number of placement points.

Die Setzfelder können verschiedenartig ausgestaltet sein. Nach einer vorteilhaften Ausgestaltung der Erfindung ist dazu vorgesehen, daß die Setzfelder von Bohrungen in der Grundplatte bestimmt sind, in die die Stützstifte einsetzbar sind. Die Bohrungen erstrecken sich dabei vorzugsweise in Form eines Lochrasters über die Grundplatte.The setting fields can be designed in different ways. According to an advantageous embodiment of the invention, it is provided that the setting fields are determined by bores in the base plate into which the support pins can be inserted. The holes preferably extend in the form of a hole pattern over the base plate.

Während des Betriebes kann es passieren, daß beispielsweise Bruchstückchen von Schaltungsplatten oder andere Verschmutzungen in die Bohrungen hineinfallen und diese dann mehr oder weniger verstopfen. Um dies zu vermeiden, ist nach einer weiteren Ausgestaltung der Erfindung vorgesehen, daß in den Bohrungen Fußstifte stecken, auf die die Stützstifte mit einer an ihrem Fuß vorgesehenen Steckhülse aufsteckbar sind. Auf diese Weise ist immer sichergestellt, daß die Oberkanten der Stützstifte genau in der Stützebene zu liegen kommen.During operation it can happen that, for example, fragments of circuit boards or other contaminants fall into the bores and then more or less block them. To avoid this, it is provided according to a further embodiment of the invention that foot pins are inserted into the bores, onto which the support pins can be plugged with a socket provided on their feet. In this way it is always ensured that the upper edges of the support pins come to lie exactly in the support plane.

Nach einer weiteren Ausgestaltung der Erfindung ist vorgesehen, daß die Richtstifte in vertikalen Führungskanälen von Stützklötzen angeordnet sind, die auf der Grundplatte lösbar befestigt sind, und daß in Einstiche der Richtstifte quer zu den Führungskanälen Arretierstifte einsteckbar sind, die in die Einstiche in angehobener Stellung der Richtstifte eingreifen. Durch das Herausziehen und wieder Einstecken der Arretierstifte können also die Richtstifte in die Stützebene gebracht oder unter die Stützebene abgesenkt werden. Zur Bestimmung der Stützebene ist nach einer weiteren Ausgestaltung der Erfindung vorgesehen, daß die Richtstifte an dem Auflageende für die Leiterplatte mit einer Auflagefläche für diese Platte versehen sind, aus deren Mitte ein Richtansatz hervorsteht, der in ein Richtloch der Leiterplatte eingreift. Die Auflageflächen der Richtstifte liegen bei angehobenen Stiften in der Stützebene.According to a further embodiment of the invention it is provided that the alignment pins are arranged in vertical guide channels of support blocks, which are releasably attached to the base plate, and that in punctures Straightening pins can be inserted transversely to the guide channels, locking pins which engage in the recesses in the raised position of the straightening pins. By pulling out and reinserting the locking pins, the alignment pins can thus be brought into the support plane or lowered below the support plane. To determine the support plane it is provided according to a further embodiment of the invention that the alignment pins are provided at the support end for the circuit board with a support surface for this plate, from the middle of which a directional projection protrudes, which engages in a directional hole of the circuit board. The contact surfaces of the alignment pins are in the support plane when the pins are raised.

Die Erfindung wird anhand des in der Zeichnung dargestellten Ausführungsbeispieles näher erläutert. Es zeigen:

  • Fig. 1 einen für schnelle Umrüstung geeigneten Produktträger in Draufsicht,
  • Fig. 2 den Produktträger im Schnitt längs der Linie II-II nach Fig. 1 und
  • Fig. 3 einen Schnitt durch den Produktträger nach Fig. 1 längs der Linie III-III zur Erläuterung der Höheneinstellung der Richtstifte.
The invention is explained in more detail with reference to the embodiment shown in the drawing. Show it:
  • 1 is a top view of a product carrier suitable for rapid retrofitting,
  • Fig. 2 shows the product carrier in section along the line II-II of Fig. 1 and
  • Fig. 3 shows a section through the product carrier of FIG. 1 along the line III-III to explain the height adjustment of the straightening pins.

Der Produktträger nach Fig. 1 besteht aus einer Grundplatte 1, auf die Stützklötze 3 für Richtstifte 5 aufgeschraubt sind. Die Stützklötze 3 befinden sich am Rand 7 der Grundplatte. Bei dem Ausführungsbeispiel nach der Zeichnung sind drei Stützklötze 3 vorgesehen, von denen einer der Stützklötze mit zwei Richtstiften 5 versehen ist.1 consists of a base plate 1 onto which support blocks 3 for directional pins 5 are screwed. The support blocks 3 are located on the edge 7 of the base plate. In the embodiment according to the drawing, three support blocks 3 are provided, of which one of the support blocks is provided with two alignment pins 5.

Zwischen den Stützklötzen 3 und damit auch zwischen den Richtstiften 5 sind Bohrungen vorgesehen, in die Stützstifte einsetzbar sind, die aus Fig. 2 zu ersehen sind. Die Bohrungen erstrecken sich nach Art eines Rasters im wesentlichen über die ganze Grundplatte bzw. deren von Stützklötzen freie Teile.Bores are provided between the support blocks 3 and thus also between the alignment pins 5, into which bores can be inserted, which can be seen from FIG. 2. The holes extend in the manner of a grid essentially over the entire base plate or its parts free of support blocks.

Fig. 2 zeigt die Grundplatte 1 im Schnitt II-II und aufgeschraubt auf die Grundplatte zwei Richtklötze 3. Das Festschrauben der Richtklötze 3 an der Grundplatte 1 erfolgt mit Hilfe von Schrauben 9. Die Ausrichtung der Stützklötze besorgen Verbindungsstifte 11, die von der Grundplatte 1 bis in die Richtklötze 3 reichen.Fig. 2 shows the base plate 1 in section II-II and screwed onto the base plate two straightening blocks 3. The screwing of the straightening blocks 3 on the base plate 1 is carried out with the help of screws 9. The alignment of the support blocks is provided by connecting pins 11 which extend from the base plate 1 extend into the directional blocks 3.

In den Richtklötzen sind vertikale Führungskanäle 13 vorgesehen, in denen die Richtstifte 5 auf und ab schiebbar sind. Die Richtstifte 5 sind an ihrem Auflageende mit einer Auflagefläche 17 versehen, aus deren Mitte jeweils ein Richtansatz 19 hervorsteht, der in ein Richtloch 21 einer Leiterplatte 23 eingreift.In the directional blocks, vertical guide channels 13 are provided, in which the directional pins 5 can be pushed up and down. The straightening pins 5 are provided at their support end with a support surface 17, from the middle of which a straightening projection 19 protrudes, which engages in a straightening hole 21 of a printed circuit board 23.

In die Bohrungen 8 der Grundplatte sind Fußstifte 25 eingesetzt, und in allen Bohrungen 8 der Setzfelder 27 sitzen derartige Fußstifte 25. Auf die Fußstifte 25 können Stützstifte 29 aufgesetzt werden. Diese Stützstifte haben den Durchmesser der Fußstifte 25, und an ihrem Fußende sind sie mit einer Steckhülse 31 versehen, die auf den gewünschten Fußstift aufgesteckt werden kann. Das obere Ende 33 des Stützstiftes 29 kommt dabei genau an der Unterseite 35 der Leiterplatte 23 zu liegen. Die Auflageflächen 17 der hochgestellten Richtstifte 5 und die oberen Enden 33 der Stützstifte 25 fallen dabei in die Stützebene 37, auf der die Leiterplatte 23 plan aufliegt Es werden so viele Stützstifte 29 eingesetzt, wie nötig sind, um die Leiterplatte 23 zusätzlich zu der Abstützung in den Richtstiften 5 sicher zu unterstützen. Da eine große Variationsmäglichkeit in dem Setzen der Stützstifte 29 gegeben ist, können die Stützstifte 29 bei bereits bestückter Unterseite 35 der Schaltungsplatte so plaziert werden, daß sie immer zwischen bereits vorhandenen konkreten Bauelementen gegen die Unterseite 35 der Leiterplatte stoßen.Foot pins 25 are inserted into the holes 8 of the base plate, and foot pins 25 of this type are seated in all holes 8 of the setting fields 27. Support pins 29 can be placed on the foot pins 25. These support pins have the diameter of the foot pins 25, and at their foot end they are provided with a plug-in sleeve 31 which can be plugged onto the desired foot pin. The upper end 33 of the support pin 29 comes to lie exactly on the underside 35 of the circuit board 23. The contact surfaces 17 of the raised alignment pins 5 and the upper ends 33 of the support pins 25 fall into the support plane 37 on which the printed circuit board 23 rests flat. As many support pins 29 are used as are necessary for the Support PCB 23 in addition to the support in the alignment pins 5 safely. Since there is a great variability in the setting of the support pins 29, the support pins 29 can be placed with the underside 35 of the circuit board already populated in such a way that they always abut against the underside 35 of the circuit board between existing concrete components.

Fig. 3 zeigt anhand des Schnittes III-III nach Fig. 1 die Höhenverstellmöglichkeit der Stützstifte 5. Durch den Stützklotz 3 erstreckt sich quer zu dem Führungskanal 13 ein Arretierstift 39 mit einem Griffknopf 41 und einer Spitze 43. Die Spitze 43 greift in einen Einstich 45 des Richtstiftes 5 ein, wenn der Richtstift 5 hochgezogen ist in die Unterstützungsposition. Mittels einer Feder 49 wird der Arretierstift 39 immer in Richtung auf den Führungskanal 13 gedrückt. In der Zeichnung nach Fig. 3 ist der Richtstift 5 in angehobener Stellung-dargestellt. Das entspricht der Stellung in Fig. 2, in der der Richtstift 5 die Unterseite 35 der Schaltungsplatte berührt. Sitzt der Richtstift 5 mit seiner Bodenfläche 47 auf der Oberseite 51 einer unteren Abschlußplatte 53 auf, dann befindet sich der Richtstift 5 in der abgesenkten Stellung. Diese abgesenkte Stellung ist in Fig. 2 die Stellung, die der ganz rechts dargestellte Richtstift 5 einnimmt.FIG. 3 shows the height adjustment possibility of the support pins 5 on the basis of the section III-III according to FIG. 1. Through the support block 3, a locking pin 39 extends transversely to the guide channel 13 with a handle knob 41 and a tip 43. The tip 43 engages in a recess 45 of the directional pin 5 when the directional pin 5 is pulled up into the support position. The locking pin 39 is always pressed in the direction of the guide channel 13 by means of a spring 49. 3, the directional pin 5 is shown in the raised position. This corresponds to the position in Fig. 2, in which the directional pin 5 touches the underside 35 of the circuit board. If the directional pin 5 sits with its bottom surface 47 on the upper side 51 of a lower end plate 53, then the directional pin 5 is in the lowered position. This lowered position is the position in FIG. 2 which the right-hand pin 5 shown on the far right assumes.

Claims (6)

1. Produktträger für Leiterplatten, die auf ihm einer Bearbeitung, insbesondere einer Bestückung mit Bauelementen zugeführt werden, wobei die Leiterplatten mit Richtlöchern versehen sind, in die Richtstifte eingreifen, die an der Grundplatte des Trägers setzbar sind, um die Leiterplatte auf dem Produktträger in einer bestimmten Stellung und Hohe zur Grundplatte festzulegen, dadurch gekennzeichnet, daß die Richtstifte (5) an der Grundplatte (1) einzeln absenkbar angeordnet und zwischen den absenkbaren Richtstiften (5) Setzfelder (27) für Stützstifte (29) vorgesehen sind, innerhalb der die Stützstifte (29) jeweils an Stellen setzbar sind, von denen aus diese Stifte (29) an der gegebenenfalls bereits mit konkreten Bauelementen bestückten unteren Seite der Leiterplatte zwischen diesen Bauelementen hindurch von unten her zur Ergänzung einer Stützebene (37) bis zur unteren Bestückungsseite (35) hoch reichen.1.Product carriers for printed circuit boards which are fed to it for processing, in particular assembly with components, the printed circuit boards being provided with alignment holes, engage in the alignment pins which can be placed on the base plate of the carrier in order to mount the printed circuit board on the product carrier in one Determine the specific position and height of the base plate, characterized in that the directional pins (5) are arranged on the base plate (1) so that they can be lowered individually and between the lowerable directional pins (5) there are setting areas (27) for support pins (29) within which the support pins (29) can be placed in each case from which these pins (29) on the lower side of the printed circuit board, which may already be equipped with concrete components, between these components from below to complement a support plane (37) to the lower component side (35) reach high. 2. Produktträger nach Anspruch 1, dadurch gekennzeichnet, daß die Setzfelder (27) von Bohrungen (8) in der Grundplatte (1) bestimmt sind, in die die Stützstifte (29) einsetzbar sind.2. Product carrier according to claim 1, characterized in that the setting fields (27) of bores (8) in the base plate (1) are determined, in which the support pins (29) can be used. 3. Produktträger nach den Ansprüchen 1 und 2, dadurch gekennzeichnet, daß sich die Bohrungen (8) in Form eines Lochrasters über die Grundplatte (1) erstrecken.3. Product carrier according to claims 1 and 2, characterized in that the bores (8) extend in the form of a hole pattern over the base plate (1). 4. Produktträger nach einem oder mehreren der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß in den Bohrungen (8) Fußstifte (25) stecken, auf die die Stützstifte (29) mit einer an ihrem Fuß vorgesehenen Steckhülse (31) aufsteckbar sind.4. Product carrier according to one or more of claims 1 to 3, characterized in that in the bores (8) Insert foot pins (25) onto which the support pins (29) can be plugged with a socket (31) provided on their feet. 5. Produktträger nach einem oder mehreren der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß die Richtstifte (5) in vertikalen F"uhrungskanälen (13) von Stützklötzen (3) angeordnet sind, die auf der Grundplatte (1) lösbar befestigt sind, und daß in Einstiche (45) der Richtstifte (39) quer zu den Führungskanälen (13) Arretierstifte (39) einsteckbar sind, die in die Einstiche in angehobener Stellung der Richtstifte eingreifen.5. Product carrier according to one or more of claims 1 to 4, characterized in that the directional pins (5) are arranged in vertical guide channels (13) of support blocks (3) which are detachably fastened to the base plate (1), and that locking pins (39) can be inserted into recesses (45) of the directional pins (39) transversely to the guide channels (13), which engage in the recesses in the raised position of the directional pins. 6. Produktträger nach den Ansprüchen 1 und 5, dadurch gekennzeichnet, daß die Richtstifte (5) an dem Auflageende für die Schaltungsplatte (23) mit einer Auflagefläche (17) für diese Platte (23) versehen sind, aus deren Mitte ein Richtansatz (19) hervorsteht, der in ein Richtloch (21) der Leiterplatte (23) eingreift.6. Product carrier according to claims 1 and 5, characterized in that the alignment pins (5) at the support end for the circuit board (23) with a support surface (17) for this plate (23) are provided, from the middle of which a directional approach (19th ) protrudes, which engages in a directional hole (21) of the circuit board (23).
EP85200404A 1984-03-20 1985-03-18 Carrier for printed-circuit boards Expired - Lifetime EP0157451B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT85200404T ATE64060T1 (en) 1984-03-20 1985-03-18 PRODUCT CARRIER FOR CIRCUIT BOARDS.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3410130A DE3410130C1 (en) 1984-03-20 1984-03-20 Workpiece carrier for printed circuit boards
DE3410130 1984-03-20

Publications (3)

Publication Number Publication Date
EP0157451A2 true EP0157451A2 (en) 1985-10-09
EP0157451A3 EP0157451A3 (en) 1989-05-03
EP0157451B1 EP0157451B1 (en) 1991-05-29

Family

ID=6231023

Family Applications (1)

Application Number Title Priority Date Filing Date
EP85200404A Expired - Lifetime EP0157451B1 (en) 1984-03-20 1985-03-18 Carrier for printed-circuit boards

Country Status (5)

Country Link
US (1) US5005814A (en)
EP (1) EP0157451B1 (en)
JP (1) JPS60211996A (en)
AT (1) ATE64060T1 (en)
DE (2) DE3410130C1 (en)

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EP0404577A1 (en) * 1989-06-22 1990-12-27 Sanyo Electric Co., Ltd. Assembling apparatus using back-up pins for supporting printed circuit board
GB2246728A (en) * 1990-06-04 1992-02-12 Quantel Ltd Support for a circuit board
US5218753A (en) * 1989-06-22 1993-06-15 Sanyo Electric Co., Ltd. Assembling apparatus using back up pins for supporting printed circuit board
US5249906A (en) * 1991-11-08 1993-10-05 Murata Manufacturing Co., Ltd. Press machine for chip type electronic components
EP1477268A2 (en) * 2003-05-02 2004-11-17 Junker & Partner GmbH Device for holding workpieces which have to be machined or measured
EP2105246A1 (en) * 2007-01-15 2009-09-30 Hirata Corporation Apparatus and method for detecting component attachment

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US5107599A (en) * 1990-08-28 1992-04-28 General Motors Corporation Universal fixture for coordinate measuring machines
DE69107196T2 (en) * 1991-04-05 1995-05-24 Torres Martinez M Machine tool device for clamping and machining.
US5131637A (en) * 1991-05-13 1992-07-21 Vaught James V Work holder for honeycomb structure
DE4139522C1 (en) * 1991-11-30 1992-12-17 Hasco-Normalien Hasenclever Gmbh + Co, 5880 Luedenscheid, De
US5369864A (en) * 1993-05-27 1994-12-06 Built For Speed, Inc. Tool kit for roller skates
US5438740A (en) * 1994-02-28 1995-08-08 Cencorp, Inc. Reconfigurable fixturing pallet for registering and supporting multi-board panels on the table of a programmable routing machine
US5501436A (en) * 1994-03-30 1996-03-26 Miller; Dennis K. Substrate retention fixture
US5516089A (en) * 1994-12-30 1996-05-14 Gerber Systems Corporation Adjustable workpiece locating unit
GB2306904B (en) * 1995-11-06 1999-06-16 Smtech Limited Circuit boards
JP3377351B2 (en) * 1995-12-18 2003-02-17 松下電器産業株式会社 Electronic component mounting machine
US6035522A (en) * 1996-03-13 2000-03-14 Motorola, Inc. Circuit board leveling apparatus
US6945151B1 (en) * 1998-10-20 2005-09-20 Micron Technology, Inc. Integrated circuit package separators
US6277671B1 (en) * 1998-10-20 2001-08-21 Micron Technology, Inc. Methods of forming integrated circuit packages
US6775904B1 (en) * 1999-07-16 2004-08-17 Siemens Aktiengesellschaft Supporting pin for supporting substrates in automatic equipment units
US6164634A (en) * 1999-07-23 2000-12-26 Farlow; Douglas T. Adjustable tooling pins
US6336276B1 (en) 2000-01-18 2002-01-08 Agilent Technologies, Inc. Customizable nest for positioning a device under test
US7204481B2 (en) * 2004-06-04 2007-04-17 Gm Global Technology Operations, Inc. Magnetorheological reconfigurable clamp for a flexible manufacturing system
US20060244190A1 (en) * 2005-04-29 2006-11-02 Gunter Erdmann Pin locking method and apparatus for pin-supported workpieces
FI20070409A0 (en) * 2007-05-24 2007-05-24 Pintavision Oy Process for making circuit boards containing electronic, optical and functional characteristics
US8186661B2 (en) * 2008-09-16 2012-05-29 Memc Electronic Materials, Inc. Wafer holder for supporting a semiconductor wafer during a thermal treatment process
DE102012218322A1 (en) 2012-10-09 2014-04-10 Continental Automotive Gmbh Method for mounting printed circuit board, involves guiding insertion pin into hole with respect to centering pin, pulling out of centering pin from hole, inserting insertion pin into hole, and inserting centering pin into hole by top face
JP5984684B2 (en) 2013-01-10 2016-09-06 三菱日立パワーシステムズ株式会社 Drilling method, drilling jig, and heat exchanger
JP6053528B2 (en) 2013-01-11 2016-12-27 株式会社荏原製作所 Substrate gripping device
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Cited By (8)

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Publication number Priority date Publication date Assignee Title
EP0404577A1 (en) * 1989-06-22 1990-12-27 Sanyo Electric Co., Ltd. Assembling apparatus using back-up pins for supporting printed circuit board
US5218753A (en) * 1989-06-22 1993-06-15 Sanyo Electric Co., Ltd. Assembling apparatus using back up pins for supporting printed circuit board
GB2246728A (en) * 1990-06-04 1992-02-12 Quantel Ltd Support for a circuit board
US5249906A (en) * 1991-11-08 1993-10-05 Murata Manufacturing Co., Ltd. Press machine for chip type electronic components
EP1477268A2 (en) * 2003-05-02 2004-11-17 Junker & Partner GmbH Device for holding workpieces which have to be machined or measured
EP1477268B1 (en) * 2003-05-02 2011-05-25 Junker & Partner GmbH Device for holding workpieces which have to be machined or measured
EP2105246A1 (en) * 2007-01-15 2009-09-30 Hirata Corporation Apparatus and method for detecting component attachment
EP2105246A4 (en) * 2007-01-15 2014-11-19 Hirata Spinning Apparatus and method for detecting component attachment

Also Published As

Publication number Publication date
EP0157451A3 (en) 1989-05-03
EP0157451B1 (en) 1991-05-29
JPS60211996A (en) 1985-10-24
DE3410130C1 (en) 1985-10-10
ATE64060T1 (en) 1991-06-15
US5005814A (en) 1991-04-09
DE3582945D1 (en) 1991-07-04

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