EP0130462A3 - Circuit imprimé - Google Patents

Circuit imprimé Download PDF

Info

Publication number
EP0130462A3
EP0130462A3 EP84107007A EP84107007A EP0130462A3 EP 0130462 A3 EP0130462 A3 EP 0130462A3 EP 84107007 A EP84107007 A EP 84107007A EP 84107007 A EP84107007 A EP 84107007A EP 0130462 A3 EP0130462 A3 EP 0130462A3
Authority
EP
European Patent Office
Prior art keywords
electric circuit
circuit element
printed circuits
fined
erably
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP84107007A
Other languages
German (de)
English (en)
Other versions
EP0130462A2 (fr
Inventor
Richard Earle Seeger, Jr.
Noredin Hassan Morgan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BP Corp North America Inc
Original Assignee
Chomerics Inc
BP Corp North America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/516,677 external-priority patent/US4775439A/en
Application filed by Chomerics Inc, BP Corp North America Inc filed Critical Chomerics Inc
Publication of EP0130462A2 publication Critical patent/EP0130462A2/fr
Publication of EP0130462A3 publication Critical patent/EP0130462A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
EP84107007A 1983-06-24 1984-06-20 Circuit imprimé Withdrawn EP0130462A3 (fr)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US50805683A 1983-06-24 1983-06-24
US51668983A 1983-07-25 1983-07-25
US06/516,677 US4775439A (en) 1983-07-25 1983-07-25 Method of making high metal content circuit patterns on plastic boards
US516689 1983-07-25
US516677 1983-07-25
US61623984A 1984-06-05 1984-06-05
US616239 1984-06-05
US508056 1990-04-11

Publications (2)

Publication Number Publication Date
EP0130462A2 EP0130462A2 (fr) 1985-01-09
EP0130462A3 true EP0130462A3 (fr) 1986-07-30

Family

ID=27504469

Family Applications (1)

Application Number Title Priority Date Filing Date
EP84107007A Withdrawn EP0130462A3 (fr) 1983-06-24 1984-06-20 Circuit imprimé

Country Status (6)

Country Link
EP (1) EP0130462A3 (fr)
JP (1) JPH02191682A (fr)
AU (2) AU579577B2 (fr)
CA (1) CA1217569A (fr)
IL (1) IL72112A (fr)
NZ (1) NZ208621A (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6147760A (ja) * 1984-08-16 1986-03-08 Shin Etsu Polymer Co Ltd 異方導電接着剤
US5045141A (en) * 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
KR20040077655A (ko) * 2001-10-19 2004-09-06 슈페리어 마이크로파우더스 엘엘씨 전자 형상 증착용 테잎 조성물
CN100544551C (zh) * 2004-08-26 2009-09-23 富士胶片株式会社 导电性图案材料的制造方法
JP5657666B2 (ja) 2009-09-04 2015-01-21 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 導電性表面の製造方法
KR101243895B1 (ko) * 2011-01-10 2013-03-25 (주)켐스 도전성 잉크 조성물 및 그 제조방법

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2851380A (en) * 1953-02-09 1958-09-09 Woodmont Products Inc Conductive ink and article coated therewith
US3013913A (en) * 1957-08-30 1961-12-19 Westinghouse Electric Corp Molded printed circuit
GB902142A (en) * 1958-06-16 1962-07-25 Nat Res Dev Process for depositing a metallised surface on an article
GB974919A (en) * 1962-02-12 1964-11-11 Chomerics Inc Improvements in the formation of electrically conductive coatings
US3248474A (en) * 1962-06-06 1966-04-26 Ibm Substrate for integrated electrical connections
FR1566978A (fr) * 1967-09-19 1969-05-09
DE2753901A1 (de) * 1977-12-03 1979-06-07 Preh Elektro Feinmechanik Verfahren zur herstellung einer gedruckten schaltungsplatte
EP0003364A1 (fr) * 1978-02-01 1979-08-08 E.I. Du Pont De Nemours And Company Réalisation de circuits imprimés par un procédé rendant jointives les particules d'images de poudres métalliques
USRE30274E (en) * 1974-09-27 1980-05-13 General Electric Company Method for making a circuit board and article made thereby
US4264477A (en) * 1978-02-21 1981-04-28 Chomerics, Inc. Keyboard
FR2489072A1 (fr) * 1980-08-22 1982-02-26 Ruf Kg Wilhelm Procede pour la fabrication de composants electrotechniques, et resistance variable par rotation ou par glissement d'un curseur fabriquee selon ce procede
GB2094321A (en) * 1981-03-05 1982-09-15 Grace W R & Co Heat curable conductive ink

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5085408A (fr) * 1973-11-29 1975-07-10
JPS5180967A (ja) * 1975-01-14 1976-07-15 Nippon Kokuen Kogyo Kk Purintokibannoseizohoho
US4396666A (en) * 1981-11-02 1983-08-02 Cts Corporation Solderable conductive employing an organic binder

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2851380A (en) * 1953-02-09 1958-09-09 Woodmont Products Inc Conductive ink and article coated therewith
US3013913A (en) * 1957-08-30 1961-12-19 Westinghouse Electric Corp Molded printed circuit
GB902142A (en) * 1958-06-16 1962-07-25 Nat Res Dev Process for depositing a metallised surface on an article
GB974919A (en) * 1962-02-12 1964-11-11 Chomerics Inc Improvements in the formation of electrically conductive coatings
US3248474A (en) * 1962-06-06 1966-04-26 Ibm Substrate for integrated electrical connections
FR1566978A (fr) * 1967-09-19 1969-05-09
USRE30274E (en) * 1974-09-27 1980-05-13 General Electric Company Method for making a circuit board and article made thereby
DE2753901A1 (de) * 1977-12-03 1979-06-07 Preh Elektro Feinmechanik Verfahren zur herstellung einer gedruckten schaltungsplatte
EP0003364A1 (fr) * 1978-02-01 1979-08-08 E.I. Du Pont De Nemours And Company Réalisation de circuits imprimés par un procédé rendant jointives les particules d'images de poudres métalliques
US4264477A (en) * 1978-02-21 1981-04-28 Chomerics, Inc. Keyboard
FR2489072A1 (fr) * 1980-08-22 1982-02-26 Ruf Kg Wilhelm Procede pour la fabrication de composants electrotechniques, et resistance variable par rotation ou par glissement d'un curseur fabriquee selon ce procede
GB2094321A (en) * 1981-03-05 1982-09-15 Grace W R & Co Heat curable conductive ink

Also Published As

Publication number Publication date
AU579577B2 (en) 1988-12-01
IL72112A (en) 1990-04-29
EP0130462A2 (fr) 1985-01-09
AU600937B2 (en) 1990-08-30
JPH02191682A (ja) 1990-07-27
NZ208621A (en) 1988-02-12
CA1217569A (fr) 1987-02-03
AU7224287A (en) 1987-08-27
IL72112A0 (en) 1984-10-31
AU2949384A (en) 1985-01-03

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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AK Designated contracting states

Designated state(s): AT BE CH DE FR GB IT LI NL SE

PUAL Search report despatched

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Designated state(s): AT BE CH DE FR GB IT LI NL SE

17P Request for examination filed

Effective date: 19870114

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: AMOCO CORPORATION

17Q First examination report despatched

Effective date: 19890524

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

18W Application withdrawn

Withdrawal date: 19920206

RIN1 Information on inventor provided before grant (corrected)

Inventor name: SEEGER, RICHARD EARLE, JR.

Inventor name: MORGAN, NOREDIN HASSAN