EP0116802A1 - Zusammenbau komplexer elektronischer Schaltungen sowie Verfahren zur Verbesserung der Zuverlässigkeit eines solchen Zusammenbaus - Google Patents

Zusammenbau komplexer elektronischer Schaltungen sowie Verfahren zur Verbesserung der Zuverlässigkeit eines solchen Zusammenbaus Download PDF

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Publication number
EP0116802A1
EP0116802A1 EP83402542A EP83402542A EP0116802A1 EP 0116802 A1 EP0116802 A1 EP 0116802A1 EP 83402542 A EP83402542 A EP 83402542A EP 83402542 A EP83402542 A EP 83402542A EP 0116802 A1 EP0116802 A1 EP 0116802A1
Authority
EP
European Patent Office
Prior art keywords
circuit
interconnection
box
conductive
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP83402542A
Other languages
English (en)
French (fr)
Inventor
Bernard Dumont
Christian Proponet
Bernard Bancelin
Roland Brucker
Jean-Louis Bories
Christiane Klein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of EP0116802A1 publication Critical patent/EP0116802A1/de
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a structure for assembling complex electronic circuits, a structure comprising the interconnection circuits and the cooling means and constituting, by its shape, the equivalent of a box.
  • This structure improves the reliability of the electronic system and facilitates test or repair interventions, since the electronic circuits are not soldered to the interconnection circuit boards.
  • the invention finds advantages more particularly when the electronic circuits are integrated circuits or hybrid circuits, on a large integration scale, themselves encapsulated in the appropriate packages, depending on whether they are integrated circuits or hybrid circuits, comprising of the order of 40 external access connections, or more.
  • the assembly structure according to the invention is not justified for electronic circuits comprising for example only a few transistors and passive components, each having only a small number of external access connections.
  • DIL type perimeter or hybrid
  • daughter cards which are themselves interconnected on “motherboards”. This results in a chain of connection points, most often by welding, which reduces reliability, especially when faced with operational constraints. such as vibrations and temperature differences.
  • the components are generally soldered by their output connections, which means that the connection and mechanical fixing functions are confused, which makes testing operations on a component - which cannot be dissociated from the card - or its replacement.
  • circuits are cooled by either natural or forced convection, the most common fluid being air because liquids are excluded in most cases, unless special adaptation of certain component housings, and for. certain fixed equipment on the ground;
  • cooling by natural convection is not very effective, and by forced convection it causes pollution of the circuits which are quickly covered with dust.
  • the assembly structure according to the invention provides these advantages. It uses as a rigid support a housing made of a material which is a good conductor of heat, such as copper for example, inside which a cooling fluid circulates in forced convection. On two large opposite faces of the box are positioned two printed circuits, and the components with perimeter or surface outputs are interconnected with the conductive tracks of the printed circuits, solderless, through conductive elastomer.
  • the mechanical fixing and positioning of the integrated circuit boxes against the printed circuits is obtained by means of metal frames screwed into the support box: these frames center the integrated circuit boxes with respect to the printed circuit tracks and, by crushing the conductive elastomer, ensure good electrical contact between the output connections and the conductive tracks, this contact resisting vibrations well.
  • the bosses formed in the support box, passing through the perforated printed circuits suitably for this purpose, ensure direct thermal contact between the cooling fluid and the bottom of the integrated circuit encapsulation boxes, from which a flow follows. good cooling.
  • the advantage of the interconnection circuits mounted on flexible supports is that the electronic circuits supported by the two large faces of the housing can be directly interconnected, by a single interconnection circuit folded around the housing, without using connectors.
  • the assembly structure according to the invention comprises, in its most efficient preferred form, symmetry with respect to the plane of the support housing, the integrated circuits being distributed over the two large faces of this housing, traversed by a cooling fluid.
  • Figure 1 shows an assembly structure by motherboard and daughter cards, according to the known art.
  • the most commonly used method currently for interconnecting a complex system is to make sub-assemblies on daughter cards 1 and 2 which are interconnected on a motherboard 3 via connectors 4 and 5.
  • the whole system is arranged inside a box which ensures both the maintenance of printed circuit boards and their protection. This box is cooled either by natural convection or by blowing air inside.
  • pluggable connectors are undoubtedly recommendable in order to be able to replace daughter cards which present a defect, but on the other hand the connectors themselves are sources of faults and it is preferable, to obtain a very high reliability of the material , to remove these connectors.
  • micro-housings are of the "chip carrier" type or of the hybrid circuit type, they are most generally, especially in professional electronics, made of a ceramic material.
  • ceramics are not flexible, and the vibration tests of daughter cards comprising ceramic boxes fixed by soldering of their outlet connection frequently lead to ruptures of soldering and even to the ejection of components, as a result of the induced voltages. by the welds.
  • FIG. 2 represents an element of the assembly structure according to the invention. It has been said previously that this structure essentially concerns complex systems, therefore which comprises a fairly large number of sub-assemblies such as integrated circuits encapsulated in so-called perimeter or surface packages and under these conditions the representation of a complete structure would be illegible; this is why we have chosen to represent the assembly structure at the level of a component, and as this structure is preferably symmetrical with respect to its central support, FIG. 2 comprises two components.
  • the core of the assembly structure is constituted by a housing 13 made of a good conductive material, such as copper for example, this housing preferably having the shape of a flat parallelepiped which emerges better from FIG. 7.
  • this box the wind box, which in no way implies that fluids such as water or oil cannot browse it.
  • the wind box is the cooling element of the structure. It can be made by assembling, for example by brazing, copper or metal plates, held by spacers 14. But it can also be made from other materials, such as alumina which is fairly good thermal conductor , or in plastics, for example in glass-epoxy fabric laminate, or in polyvinyl chloride: if the materials chosen are less good thermal conductors, metal inserts constitute thermal drains, in the appropriate places, under the micro-housings of integrated circuits.
  • this circuit includes the conductive interconnection tracks between the different active components 16 which are not soldered on the tracks of this interconnection circuit 15.
  • the connection between an integrated circuit 16 and the interconnection circuit 15 is ensured by the compression of the integrated circuit box 16, by means of a frame 17 which supports the integrated circuit on the printed circuit.
  • a conductive elastomer 18 is interposed between the underside of the integrated circuit micro-package 16 and the circuit printed 15.
  • a plate 19 produced in a insulating material, such as for example a glass cloth plate impregnated with epoxy resin, makes it possible to perfectly center the integrated circuit 16 and the conductive elastomer 18 relative to the tracks of the printed circuit 15.
  • This plate 19 is itself positioned by the same means as those which position the metal frame 17 relative to the general reference plane of the assembly.
  • the wind box 13 includes, at the location of each integrated circuit box, a metal boss 20 which, passing through holes suitably made in the printed circuit 15, comes into contact with the bottom of the housing 16.
  • These bosses 20 are themselves reinforced by spacers 21 which stiffen the assembly and serve as thermal drains.
  • the set of parts constituting a stack for fixing and interconnecting the integrated circuit box 16 is fixed by means of screws which pass through the metal frame 17 and through the plate 19 of glass fabric. These screws are inserted into the spacers 14, which means that, if the diagram is suitable and that two boxes of the same dimensions are mounted on the two opposite faces of the wind box 13, the tensile force is exerted symmetrically by two screws screwed into each spacer 14, and there is therefore no deformation of the overall mechanical structure.
  • the screwing system can be replaced by a system of metal stirrups which surrounds each frame 17, in the manner of a clip: these stirrups are inked in the wind box 13 and they effectively fix the integrated circuits and the frames 17 because they are chosen from materials which expand cold: in a first hot phase, they have an austenitic crystal structure and in a second cold phase, they have a martensitic crystal structure which has about 10% elongation. This elongation is sufficient to be able to pivot the stirrups to the side and release the frame and the integrated circuit held in place.
  • the conductive alastomer seal 18 itself has a thickness sufficient for it to work in compression, crushed against the printed circuit 15 by the integrated circuit box 16 and the frame 17.
  • Figure 3 shows a sectional view of part of the structure, showing more precisely than Figure 2 the attachment of a housing and the heat sink. This figure is only partial with respect to the entire structure of the invention since it has been specified previously that this structure comprises a large number of integrated circuit boxes.
  • the box with perimeter connections 16 has lateral output connections folded under the box and this case has been explained above.
  • the “chip carrier” box 16 can also be with surface connections, that is to say that the connections consist of studs which come out of the bottom surface of the box, and which make direct contact with the frame of the conductive elastomer.
  • the hybrid circuit box 22 is provided with external connections 25 which, according to the very foundation of the invention which is to provide contact by crushing and not by welding, are of the folded flat types, in every point comparable to the flat box called "Flat Pack” shown in 23, whose outlet connections 26 are not pluggable as in a DIL box but are flat.
  • the invention provides that the frame 17 which holds the box in place is provided for the fixing screws in the wind box 13 to pass through. outside the perimeter of connections 25 and 26.
  • the flat connections have, given their very small dimensions, a flexibility which would not allow crushing the conductive elastomer 18. This is why, in this case, it is preferable to impart more rigidity to the flat connections by subjecting them to pressure, from the metal frame 17, by means of an insulating part 18 ′, either rigid or elastomeric. The connections are then tightened between two elastomeric parts 18 and 18 ', the compression forces of which are balanced.
  • Figures 5 and 6 give two sectional views of two types of conductive elastomers. Only a linear fraction of these conductive elastomers is shown, while, according to the invention, the conductive elastomer 18 which ensures seamless contact between the integrated circuit 16 and the printed circuit 15 has the shape of a square or of a rectangle, depending on the type of micro-enclosure.
  • the conductive elastomer shown consists of a cord cut from a sandwich formed by the stack of elastomer sheets 27 and metal sheets 28.
  • the metal sheets 28 have a thickness sufficient for contact to be taken by the wafer, on the one hand on the conductive track of a printed circuit 15, on the other hand on the external connection of an integrated circuit box 16.
  • the stack of elastomer layers and metal layers produced are cut, perpendicular to the layers, cords which are then shaped to form the so-called "conductive elastomer" frame 18 necessary for a given housing.
  • FIG. 6 represents a variant of the structure of a conductive elastomer.
  • the so-called conductive elastomer bead is constituted by an elastomer core 29 on which is pressed on at least three faces a flexible sheet 30 which carries conductive metallic tracks 31.
  • the conductive tracks which are formed either by the edge of the sheets 28 or by the tracks 31, are of course at a spacing which corresponds to the standardized spacing of the micro-enclosures for encapsulating integrated circuits.
  • An alternative embodiment of a conductive elastomer is an insulating elastomer, certain parts of which for connections are made conductive by inclusion of conductive elements. Said elements are for example carbon or silver.
  • FIG. 7 represents a three-quarter view in space of an assembly structure according to the invention. This view is open at one end to show its internal structure, and is not limited to its other end: the four integrated circuit boxes shown on the visible side also correspond to four hidden integrated circuit boxes, under the wind box 13 However, it is obvious that only one side of the structure can be used, although this solution is less interesting.
  • FIG. 7 The interest of figure 7 is to show that the interconnection between the micro-housings carried by one face of the structure and the micro-housings carried by the other face of the structure can be produced directly by means of a single flexible connection printed circuit 32 which is folded around the wind box. This case is particularly interesting since it eliminates the connectors between two interconnection circuits 15. Two solutions are possible. Either the two circuits 15 and the link circuit 32 between them are produced in a single flexible circuit. Either the circuits 15 are rigid and multilayer, and include a flexible layer 32: these printed circuits are known by the name flex-rigid.
  • this figure highlights the fact that the centering plate 19, which positions the integrated circuit boxes 16 and the conductive elastomer frames 18, constitutes an external protection of the printed circuit 15. This protection is supplemented by the frames metal 17, inside which appear the metal lids for closing micro-housings 16.
  • the whole structure constitutes in itself an integrated box since it is no longer useful to mount the whole in a protective box.
  • the structure according to the invention therefore realizes an integrated box, which can be used directly, cooled from the inside by a cooling fluid, and produced according to a structure such that there is no interconnection solder between the micro-housings and the printed circuit, which promotes the interchangeability of the micro-housings 16, their tests, their replacements, and considerably improves the reliability in the face of temperature variations and vibrations.
  • the integrated box shown in FIG. 7 is of course supplemented at its two ends by means for introducing a cooling fluid, and by means of connections of the printed circuit 15 with the rest of the electronic system in the production of which between this integrated box.
  • This integrated box also stems from a process for mounting integrated circuits, this process being oriented towards better reliability against vibrations and better adaptation to maintenance and repair.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
EP83402542A 1982-12-30 1983-12-27 Zusammenbau komplexer elektronischer Schaltungen sowie Verfahren zur Verbesserung der Zuverlässigkeit eines solchen Zusammenbaus Ceased EP0116802A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8222075 1982-12-30
FR8222075A FR2538989B1 (fr) 1982-12-30 1982-12-30 Structure d'assemblage de circuits electroniques complexes, et procede d'amelioration de la fiabilite d'un tel assemblage

Publications (1)

Publication Number Publication Date
EP0116802A1 true EP0116802A1 (de) 1984-08-29

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EP83402542A Ceased EP0116802A1 (de) 1982-12-30 1983-12-27 Zusammenbau komplexer elektronischer Schaltungen sowie Verfahren zur Verbesserung der Zuverlässigkeit eines solchen Zusammenbaus

Country Status (3)

Country Link
US (1) US4547834A (de)
EP (1) EP0116802A1 (de)
FR (1) FR2538989B1 (de)

Cited By (4)

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EP0239322A2 (de) * 1986-03-26 1987-09-30 Raymonde Gene Clifford Artus Gekühlte Baugruppe
EP0312802A2 (de) * 1987-09-24 1989-04-26 Elastomeric Technologies, Inc. Selbstmontierendes Gehäuse für ein Halbleiterbauelement
EP0558855A2 (de) * 1992-03-02 1993-09-08 AT&T Corp. Leiterplattenstapel mit neuen cross-over-Zellen
WO1993024955A1 (de) * 1992-05-25 1993-12-09 Mannesmann Ag Fluidgekühlte leistungstransistoranordnung

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EP1590995A1 (de) * 2003-01-29 2005-11-02 Koninklijke Philips Electronics N.V. Wärmeabstrahlanordnung für ein elektronisches gerät
DE102004027788A1 (de) * 2004-06-08 2006-01-05 Infineon Technologies Ag Halbleiterbasisbauteil mit Umverdrahtungssubstrat und Zwischenverdrahtungsplatte für einen Halbleiterbauteilstapel sowie Verfahren zu deren Herstellung
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US7606040B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Memory module system and method
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JP5500936B2 (ja) * 2009-10-06 2014-05-21 イビデン株式会社 回路基板及び半導体モジュール
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FR2331891A1 (fr) * 1975-11-13 1977-06-10 Tektronix Inc Contact electrique et procede de fabrication de celui-ci
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0239322A2 (de) * 1986-03-26 1987-09-30 Raymonde Gene Clifford Artus Gekühlte Baugruppe
EP0239322A3 (en) * 1986-03-26 1989-05-03 Raymonde Gene Clifford Artus Cooled component assembly
EP0312802A2 (de) * 1987-09-24 1989-04-26 Elastomeric Technologies, Inc. Selbstmontierendes Gehäuse für ein Halbleiterbauelement
EP0312802A3 (de) * 1987-09-24 1990-10-10 Elastomeric Technologies, Inc. Selbstmontierendes Gehäuse für ein Halbleiterbauelement
EP0558855A2 (de) * 1992-03-02 1993-09-08 AT&T Corp. Leiterplattenstapel mit neuen cross-over-Zellen
EP0558855A3 (en) * 1992-03-02 1996-05-01 American Telephone & Telegraph Circuit board stack with novel cross-over cells
WO1993024955A1 (de) * 1992-05-25 1993-12-09 Mannesmann Ag Fluidgekühlte leistungstransistoranordnung

Also Published As

Publication number Publication date
FR2538989B1 (fr) 1985-10-04
FR2538989A1 (fr) 1984-07-06
US4547834A (en) 1985-10-15

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