EP0102350A1 - Appareil de test utilisant un lit a pointe - Google Patents

Appareil de test utilisant un lit a pointe

Info

Publication number
EP0102350A1
EP0102350A1 EP19820901209 EP82901209A EP0102350A1 EP 0102350 A1 EP0102350 A1 EP 0102350A1 EP 19820901209 EP19820901209 EP 19820901209 EP 82901209 A EP82901209 A EP 82901209A EP 0102350 A1 EP0102350 A1 EP 0102350A1
Authority
EP
European Patent Office
Prior art keywords
pins
channels
housing
test fixture
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19820901209
Other languages
German (de)
English (en)
Inventor
James T. Malloy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP0102350A1 publication Critical patent/EP0102350A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards

Definitions

  • the present invention relates to a bed-of-pins test fixture and, more particularly, to an in-circuit test fix ⁇ ture for use in making a non-functional electrical inspection of individual components and/or circuit paths on a printed circuit board or wired backpanel assembly.
  • the present invention is concerned with the testing of printed circuit (PC) boards, primarily the testing of PC boards before and after the individual components have been mated thereonto and connected.
  • PC printed circuit
  • PC board testers There are basically only two types of PC board testers, namely in-circuit and functional. All early automatic test systems were functional testers, i.e. connections were made only to the input and output terminals of the board and signals were conducted to the input terminals which simulated the input signals the PC board would experience in an assem ⁇ bled unit. The output terminals were monitored to determine whether or not the entire board was functioning properly.
  • the in-circuit tester does not approach testing on an input/ output basis. Rather, testing is achieved by making con ⁇ tact with each electrical point on a circuit board and sequentially monitoring each and every circuit component and each and every circuit path. In this manner, solder shorts, opens, missing parts, wrong parts, backwards or improperly seated parts, and out-of-tolerance parts may be isolated and identified.
  • a complete in-circuit test system includes a simple sequencer-type controller which switches from component to component on a PC board while monitoring that component's performance. Programming can be done very simply using microprocessors and/or minicomputers.
  • test fixture has the responsibility of making a reliable electrical connection from the controller to every node on the circuit board. This is typically done by using a bed of pressure pins that contact the foil side of the circuit board. A number of schemes exist for keeping the board in contact with the pins during test. This can be done manually or through the use of a vacuum- actuated fixture, both of which are well known in the art and maintain and distribute a holddown force evenly over the board.
  • a typical bed-of-pins fixture uses a blank panel with holes drilled on the same matrix as the PC board to be tested.
  • the hole sizes are large enough to accommodate a sleeve which has a square tail extruded on the end for wire wrapping.
  • a spring-loaded contact pin is inserted into the sleeve for making contact with the PC board.
  • the fixture also has holes drilled on the other end of the board and solid feedthrough-type pins are installed which make contact with a transition head.
  • the transition head usually has contacts which are the same as those which mate with the test PC board. The centers of the contacts on the transition head and feedthrough contacts on the interface part of the fixture are the same so that they will mate.
  • Each sleeve is individually connected by an electrical lead to a corresponding solid pin.
  • the bed-of-pins test fixture provides a reliable method of testing for electrical defects. It provides the user with a simple and highly productive way of testing thousands of circuits in less than a minute in some instances.
  • the main disadvantage with this system is cost ' . In most cases, a bed-of-pins fixture is cost prohibitive due to the high cost of the spring-loaded contacts and necessary accessor ⁇ ies.
  • a bed-of-pins in-circuit test fixture which solves these problems in a manner unknown heretofore.
  • the present in- circuit test fixture is cost effective. It can be used when only small or moderate numbers of PC boards have to be tested.
  • the present bed-of-pins test fixture eliminates the necessity of drilling holes in a support plate. The support plate is put together in modular fashion and highly simplified pins may be utilized.
  • a test fixture constructed in accordance with the teachings of the present invention comprises an elongate, generally rectangular housing made from an insu ⁇ lating material having a plurality of parallel, spaced, at least partially open-sided channels extending perpendicular to the longitudinal dimension thereof, one longitudinal side edge of the housing lying in a given plane, the ends of the channels in the plane being open; a plurality of spring-loaded conductive pins, individual ones of the pins being positioned in individual ones of the channels, the pins extending through the given plane; an elongate, gener ⁇ ally rectangular sheet of flexible, insulating material positioned parallel to the housing and connected to the side thereof adjacent the open sides of the channels, one longitudinal side edge of the sheet being parallel to and adjacent the one side edge of the housing, the sheet includ ⁇ ing a pattern of electrical leads for conducting electrical signals to the pins; and a plurality of parallel/ spaced contacts positioned along the one side edge of the sheet, the spacing between the contacts being the same as the spacing between the channels whereby a contact
  • a cover is connectable to the one side edge of the housing for retaining the pins within the channels in the housing.
  • the sheet includes a series of parallel, spaced terminals positioned along an edge thereof remote from the plurality of contacts, the conductive leads connecting each of the contacts of the plurality of contacts to corresponding ones of the terminals of the plurality of terminals.
  • the test fixture further comprises a second elongate, gen ⁇ erally rectangular housing made from an insulating material having a plurality of parallel, spaced, at least partially open-sided channels extending perpendicular to the longi ⁇ tudinal dimension thereof , one longitudinal side edge of the second housing lying in a second given plane , the ends of the channels in the second plane being open; a second plurality of conductive pins, individual ones of the second plurality of pins being positioned in individual ones of the channels in the second housing, the pins extending through the second given plane, an end of the sheet remote from the end thereof which is connected to the first housing being positioned parallel to the second housing and being connected adjacent the open sides of the channels thereof, the same longitudinal side edge of the sheet being positioned parallel to and adjacent the one side edge of the second housing; and a second plurality of parallel/ spaced contacts positioned along the side edge of the sheet, the spacing between the second contacts being the same as the spacing between the channels in the second housing whereby
  • the object of the present invention to solve the problems which heretofore prevented the manu ⁇ facture of a cost effective, bed-of-pins type in-circuit test fixture. It is a feature of the present invention to solve these problems by the provision of a series of assem ⁇ blies which permit the construction of a bed-of-pins type in-circuit test fixture in modular fashion.
  • An advantage to be derived is a bed-of-pins fixture which does not require holes to be drilled.
  • Another advantage is a bed- of-pins fixture which does not require wire wrapping.
  • Still another advantage is a bed-of-pins fixture which does not require individual connection of a spring contact in the test fixture with a contact in a transition head.
  • a still further advantage is that a manufacturer can draw on pre- raolded compartments of various grids and can fashion fixtures of any design at will.
  • Figure 1 is a perspective view of a bed-of-pins type in-circuit test fixture, including a test head and a transi ⁇ tion head, constructed in accordance with the teachings of the present invention
  • Figure 2 is an enlarged perspective view of an assembly which forms the individual elements of the test fixture of Figure 1;
  • Figure 3 is an enlarged, exploded, perspective view of a portion of the test head of Figure 1;
  • Figure 4 is an enlarged plan view of the test head unit of the assembly of Figure 2;
  • Figure 5 is an enlarged plan view of the transition head unit of the assembly of Figure 2;
  • Figures 6 and 7 are enlarged sectional views taken along the lines 6-6 and 7-7, respectively, in Figures 4 and 5, respectively, and further showing the test head unit and the transition head unit mounted on a base as shown in Figure 14;
  • Figure 8 is an enlarged sectional view taken along the line 8-8 in Figure 6;
  • Figure 9 is a -sectional view taken along the line 9-9 in Figure 8.
  • Figures 10, 11 and 12 are a series of partial perspec- tive views showing the sequence of manufacturing the flexible circuit means of the assembly of Figure 2;
  • Figures 13 and 14 are partial perspective views of por ⁇ tions of test head units constructed in accordance with the teachings of the present invention showing the manner in which a test fixture may be assembled as described herein. 5. DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • test fixture 10 for testing loaded and/or unloaded PC boards (not shown) .
  • test fixture 10 includes a bed-of-pins test head, generally designated 11, for contacting the PC board, and a transition head, gen ⁇ erally designated 12 , for contacting an electronic circuit analyzer.
  • Test fixture 10 is for use in a conventional in-circuit test system including a sequencer/controller and means for holding a PC board against test head 11. Since these components of the test system are well known to those skilled in the art, they will not be discussed further herein.
  • Test head 11 is, generally speaking, of the bed-of-pins type in which a bed-of-pressure pins contact the noncompo- nent side of a PC board. That is, in common with other bed-of-pins test heads, test head 11 includes a bed-of-pins 13 (not shown in Figure 1) , first ends of which are adapted- to contact a PC board, means for supporting pins 13, and means for a.king electrical connection thereto.
  • bed-of-pins 13 not shown in Figure 1
  • first ends of which are adapted- to contact a PC board means for supporting pins 13, and means for a.king electrical connection thereto.
  • test fixture 10 is constructed on a suitable base 14, to be described more fully hereinafter, in modular fashion, using a plurality of assemblies, gen ⁇ erally designated 15, which function as building blocks to form a complete test fixture. Accordingly, prior to describing the manner in which assemblies 15 may be assem ⁇ bled to form a complete test fixture 10, the construction of assemblies 15 will be described in detail.
  • the pins are supported by drilling holes in a support plate on the same matrix as the PC board to be tested. With the present invention, through the use of assemblies 15, the necessity for dril- ling a board is eliminated.
  • Each assembly 15 includes a test head unit 15A and a transition head unit 15B.
  • Each unit 15A and 15B includes a preferably identical housing 17 made from a suitable insulating material. Housings 17 are preferably injection molded from a suitable plastic material.
  • Each housing 17 is an elongate, generally rectangular member having a series of parallel, spaced channels 18 which extend perpendicular to the longitudinal dimension thereof. As shown more clearly in Figures 3, 6 and 7, each housing 17 is a solid member having opposed side surfaces 19 and 20 and opposed top and bottom surfaces 21 and 22, respectively. Channels 18 extend between and parallel to surfaces 19 and 20 and are open at surface 21. Channels 18 may extend only par ⁇ tially through housing 17 and have closed bottom ends. However, for mounting purposes, as will be described more fully hereinafter, channels 18 preferably extend to surface 22. Also, channels 18 preferably have a reduced diameter section 23 near bottom surface 22.
  • each housing 17 is cut away, as shown at 24, removing a portion of side surface 19, adjacent top surface 21, to expose portions of the sides of all of channels 18. While cutaway section 24 may extend from surface 21 all the way to surface 22, having channels 18 only partially exposed on the sides thereof is preferable, for reasons which will appear more fully hereinafter. In any event, cutting a portion of housing 17 away, as shown at 24, forms a ledge 25 in sur ⁇ face 19, as shown. An additional ledge 26 is formed in surface 19, by an offset portion thereof, adjacent bottom surface 22, also for reasons which will appear more fully hereinafter.
  • Top surface 21 of each housing 17 has a plurality of spaced holes 27 therein, which extend parallel to and between channels 18. There is no necessity for a hole 27 between eac -channel 18, only a few holes 27 extending along top surface 21 being required. There is also a groove 28 at either end of the base of each housing 17, at the intersection between bottom surface 22 and the end walls of housing 17, for reasons which will appear more fully hereinafter. Housings 17 of units 15A are adapted for receipt of spring-loaded pins 13. As shown most clearly in Figures 3 and 6, each pin 13 includes a solid shaft 30 having a head 31 at one end thereof which may be of any type suit ⁇ able for making contact with a PC board.
  • the other end of shaft 30 is connected to one end of an increased diameter shaft 32, the other end of which is hollow to form an internal channel 33.
  • Channel 33 receives one end of a spring 34, the other end of which rests on the abutment formed between the upper end of channel 18 and reduced diameter section 23 thereof, This is one of the " functions of reduced diameter section 23.
  • the same function could be performed by closing the bottom ends of channels 18.
  • the dimensions of pin 13 and spring 34 are such that spring 34 applies a longitudinal spring force to pin 13 to urge pin 13 in the direction of head 31 thereof. Furthermore, the dimensions of pin 13 and spring 34 are such that the ledge 35 between shafts 30 and 32 is normally held by spring 34 above top surface 21 of housing 17.
  • shaft 32 An alternative construction is to make shaft 32 a solid member and to taper it from the one end to the other end thereof.
  • the diameter of the other end of shaft 32 would be smaller than the inside diameter of spring 34 so as to extend thereinto.
  • This arrangement would suitably interconnect pin 13 and spring 34 without the necessity of making pin 13 with a hollow shaft.
  • each unit 15A includes a cover, generally designated 37.
  • Each cover 37 is an elongate, generally rectangular, generally planar member, having a lower surface 38 which is adapted to be brought into contact with top surface 21 of housing 17.
  • each cover 37 has a plurality of cylindrical protrusions 39 extending from surface 38, perpendicular thereto, the spacing between adjacent protrusions 39 being the same as the spacing between adjacent holes 27 in housing 17.
  • the diameter of protrusions 39 is approximately the same as the diameters of holes 27 so that a relatively tight, friction fit is achieved.
  • cover 37 has a series of parallel, U- shaped slots 41 therein which extend perpendicular to the longitudinal dimension of cover 37.
  • the spacing between slots 41 is the same as the spacing between channels 18 so that the former are aligned with the latter.
  • the spacing between the sides of slots 41 is greater than the diameter of shaft 30 of pin 13 but less than the diameter of shaft 32 of pin 13.
  • OMPI begin to become compressed.
  • springs 34 are compressed, ledges 35 of pins 13 are brought into a position coplanar with top surface 21 of housing 17, and protrusions 39 are firmly seated in holes 27.
  • each pin 13 is securely held in its corresponding channel 18 and is placed in tension.
  • the lengths of shafts 30 are such that pins 13 are free to move from the position shown in solid lines in Figure 6 to the position shown in phantom as pins 13 of test head unit 15A are brought into contact with a PC board to be tested.
  • test ' head unit 15B includes an identical housing 17 and an identical cover 37.
  • unit 15B of assembly 15 may include a series of solid pins, generally designated 44, each of which includes a shaft 45, one end of which is connected to a head 46, the other end of which is connected to one end of an increased diameter shaft 47.
  • head 46 probably has a different configuration than head 31 and shaft 47 is a solid member.
  • the other end of shaft 47 has a reduced diameter section 48 connected thereto which extends into reduced dia ⁇ meter section 23 of channel 18 for centering of pin 44 in channel 18. This is another function of reduced diameter section 23.
  • test fixture With the present invention, the necessity for drilling a base board is eliminated.
  • a test head 11 and a transition head 12 may be formed in modular fash ⁇ ion. It is obvious that in order to complete a test fixture, electrical connection must be made to each of pins 13 and 44.
  • a flexible circuit means generally designated 50. An under- standing of circuit means 50 may be gathered from an explanation of the method of manufacturing same.
  • circuit means 50 is made by providing a series of circuit traces 51 on an elongate, generally rectangular, generally planar, flexible, insulating sheet 52.
  • Sheet 52 is preferably a thin film of polyester or capton.
  • Circuit traces 51 include a first plurality of parallel, spaced contacts 53 positioned along one longitudinal side edge 54 of sheet 52, adjacent one end thereof, and an identical series of parallel, spaced contacts 56 preferably positioned along side edge 54, ad ⁇ jacent the other end of sheet 52.
  • the spacing between ' each contact 53 and each contact 56 is the same as the spacing between channels 18 so that eventually, a contact 53 and 56 will be aligned with each of channels 18 and each of the pins 13 or 44 therein.
  • the circuit traces 51 also include a series of conductive lines 55, one conductive line 55 connecting one of contacts 53 to one of contacts 56.
  • circuit trace 51 In the preferred method of manufacturing flexible circuit means 50, spring quality berillium copper or phos ⁇ phorous bronze is used to make circuit traces 51. A thin layer of this material is preferably laminated on one side of sheet 52 in a manner well known to those skilled in the art. Using well known photographic etching techniques, the undesired material is etched away to form the circuit pattern shown in Figures 4, 5 and 10. Because spring quality berillium copper or phosphorous bronze is very dens it causes high resistance. To overcome this, circuit trace 51 are preferably plated with a soft copper strike or ducti nickel strike followed by a thin. layer of gold. This allow electrons to flow more easily through circuit traces 51 and eliminates the high resistance.
  • each completed assembly is subjected to a blanking/forming operation in which a blanking tool is used to cut 'out the material in sheet 52 between each of contacts 53 and 56, as shown most clearly at 58 in Figure 12.
  • a blanking tool is used to cut 'out the material in sheet 52 between each of contacts 53 and 56, as shown most clearly at 58 in Figure 12.
  • Each contact 53 and 56 is formed into a finger, preferably in the same operation, by the same blanking tool.
  • the insulating material between the fingers has been cut away, at 58, allowing each finger separate independent action.
  • each finger becomes an independent single beam contact able to move independently of the other fingers. At this time, it is possible to complete assembly 15.
  • a completed flexible circuit means 50 is positioned so that the sides thereof adjacent the opposite ends thereof engage side surfaces 19 of opposed housings 17.
  • Ledges 26 on housings 17 are pro ⁇ vided for location purposes so that the side edge 59 of flexible circuit means 50 opposite to side edge 54 rests on ledge 26. This construction is clearly shown in Figures 2-5.
  • Each spring contact 53 engages the side of a pin 13 in a corresponding channel 18 in a housing 17 of a unit 15A and each spring contact 56 engages the side of a pin 44 in a corresponding channel 18 in a housing 17 of a unit 15B.
  • Assembly 15 is now completed and a perma ⁇ nent electrical connection is formed between each sliding pin 13 and each stationary pin 44.
  • FIG. 1 there is shown the general configuration of a test fixture 10 whereby a plurality of assemblies 15 are stacked with units 15A positioned to form a bed-of-pins test head 11 and units 15B positioned to form a transition head 12.
  • This design allows the transmission of electrical signals from each pin 13 in test head 11 to a corresponding pin 44 in transition head 12.
  • assemblies 15 simulate the common technique of connecting a wire from a test point on a test head to an interface point on an analyzer interface portion on a conventional system.
  • Units ' 15A are used to contact the circuit board under test. Signals are passed through the flexible circuit trace lines 55 to cor- responding pins in units 15B.
  • Transition head 12 is used • to make contact with spring-loaded or solid pins in the analyzer' s interface system. That is to say, when transi ⁇ tion head 12 ' mates with the corresponding pins in an analyzer it automatically makes an electrical connection. Because circuit means 50 is flexible, it can be placed in any desired configuration.
  • assemblies 15 could be provided with test head units 15A only and that each circuit means 50 could terminate in a series of parallel, spaced terminals connected to lines 55, such terminals being spaced along any edge of sheet 52. Connection to these terminals could be made with an edge card connector or any other suitable technique.
  • test head 11 or transition head 12 may be clamped together in a frame including multiple side panels, such as panels 62 and 63 shown in Figure 13. These panels may be clamped together in any suitable manner.
  • spacer blocks 61 and a side panel frame is not the preferred method of assembling test head 11 and transition head 12.
  • the bottoms of channels 18, below reduced diameter sections 23, may be utilized for the mounting of housings 17. It has been found that by using a plurality of press-fit pins 65, which are either solid or split, positioned on a suitable base 66, spacer blocks and frames can be eliminated. That is, when two or three pins 65 are pressed half way into holes in base 66, pins 65 provide a rigid support for hous ⁇ ings 17. All that is necessary is for housings 17 to be positioned as shown in Figures 6 and 7 so that pins 65 extend into selected ones of the bottoms of channels 18. Pins 65 are forced into the bottoms of channels 18 and hous ⁇ ings 17 are pressed downwardly until bottom sur aces 22 engage the top surface of base 66. This establishes per- pendicularity and pins 65 securely support housings 17.
  • grooves 28 at the ends of housings 17 allow housings 17 to be pryed up from base -66 when removal is necessary.
  • An L-shaped removal tool (not
  • O ?I shown can be inserted between the top of groove 28 and base 66 for the purpose of removing housings 17 for recovery This allows assemblies 15 to be reused on other configured fixture devices. It also allows the user to replace defec- tive assemblies 15 without major repair.
  • An advantage to the present invention is that the entire assembly of test head 11 and transition head 12 can be built on a single support plate 14, as is readily seen in Figure 1.
  • the support plate 14 with holes therein having press-fit pins 65 in such holes provides a ready base for installation of assemblies 15.
  • the housings 17 are pressed over the protruding edges of pins 65 by pressing them into the bottoms of channels 18.
  • a single support plate is all that is required.
  • Another advantage of the present system is that even a scrap circuit board can be used to provide a ready drill support plate, and this is what is shown in Figure 14. (Pins 13 are omitted from Figure 14 for clarity. )
  • Base 66 is actually a scrap circuit board of the type test fixture 10 will be used to test.
  • Pins 65 can be pressed into exist ⁇ ing holes in the scrap circuit board. Housings 17 are pressed in place and the other ends are pressed and fastened to a support plate designed for the particular analyzer. These plates can then be attached to base 14 to form test fixture 10. This allows a test fixture to be built on a moments notice without drilling special holes to accommo ⁇ date the design of a given circuit board. The interface portion on the support plate 14 is always the same for each given kind of system. Therefore, this end would be drilled and stacked that way.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

Appareil de test en circuit destiné à être utilisé pour exécuter une inspection électrique non fonctionnelle des composants individuels et/ou des chemins de circuit dans une carte de circuit imprimé ou d'un assemblage par câblage sur la face postérieure. L'appareil de test en circuit ci-décrit est rentable et peut être utilisé lorsqu'il faut tester uniquement de faibles quantités de cartes de circuits imprimés. Cet appareil de test élimine la nécessité de percer des trous dans une plaque de support. Une unité de tête de test (11) et une unité de tête de transition (12) sont reliées de manière modulaire utilisant des assemblages (15) pouvant être positionnés sur des rangées empilées pour obtenir une série bidimensionnelle de canaux (18) de support de pointes (13), de manière à réaliser une tête de test pour l'examen d'un produit bidimensionnel, et pour obtenir une série bidimensionnelle de canaux (18) de supports de pointes (44) de manière à réaliser une tête de transition pour la connexion à un analyseur de circuit électronique.
EP19820901209 1982-03-05 1982-03-05 Appareil de test utilisant un lit a pointe Withdrawn EP0102350A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1982/000269 WO1983003141A1 (fr) 1982-03-05 1982-03-05 Appareil de test utilisant un lit a pointe

Publications (1)

Publication Number Publication Date
EP0102350A1 true EP0102350A1 (fr) 1984-03-14

Family

ID=22167843

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19820901209 Withdrawn EP0102350A1 (fr) 1982-03-05 1982-03-05 Appareil de test utilisant un lit a pointe

Country Status (3)

Country Link
EP (1) EP0102350A1 (fr)
AU (1) AU8336382A (fr)
WO (1) WO1983003141A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3630548A1 (de) * 1986-09-08 1988-03-10 Mania Gmbh Vorrichtung zum elektronischen pruefen von leiterplatten mit kontaktpunkten im 1/20 zoll-raster
JPH0178029U (fr) * 1987-11-13 1989-05-25

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2923911A (en) * 1960-02-02 demurjian
US3969010A (en) * 1974-05-17 1976-07-13 E. I. Du Pont De Nemours And Company Substrate with improved contact terminals
US4119357A (en) * 1975-07-04 1978-10-10 Bonhomme F R Connector for printed circuit boards

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO8303141A1 *

Also Published As

Publication number Publication date
WO1983003141A1 (fr) 1983-09-15
AU8336382A (en) 1983-10-18

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