EP0025092B1 - Transducteur ultrasonore et procédé pour sa fabrication - Google Patents

Transducteur ultrasonore et procédé pour sa fabrication Download PDF

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Publication number
EP0025092B1
EP0025092B1 EP80103708A EP80103708A EP0025092B1 EP 0025092 B1 EP0025092 B1 EP 0025092B1 EP 80103708 A EP80103708 A EP 80103708A EP 80103708 A EP80103708 A EP 80103708A EP 0025092 B1 EP0025092 B1 EP 0025092B1
Authority
EP
European Patent Office
Prior art keywords
transducer elements
metal coating
ultrasonic
transducer
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP80103708A
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German (de)
English (en)
Other versions
EP0025092A1 (fr
Inventor
Heinrich Dr. Diepers
Bertram Sachs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
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Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to AT80103708T priority Critical patent/ATE7083T1/de
Publication of EP0025092A1 publication Critical patent/EP0025092A1/fr
Application granted granted Critical
Publication of EP0025092B1 publication Critical patent/EP0025092B1/fr
Expired legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0611—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile
    • B06B1/0614—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile for generating several frequencies

Definitions

  • the invention relates to an ultrasound transducer arrangement with a matrix of separately controlled ultrasound transducers, each consisting of a matrix of acoustically separated and electrically jointly controlled columnar transducer elements.
  • images are produced from the inside of a body to be examined with the aid of ultrasound pulses, which are emitted by a transducer element which is arranged on the surface of the body.
  • the position of an error location can be derived from the transit time of the ultrasound signal and the echo signal.
  • the ultrasonic transducer arrangement in the form of a so-called array consists of a large number of ultrasonic transducers with transducer elements made of piezo material, which are arranged next to one another at a short distance.
  • the transducer elements can be controlled together or in rows and in groups (US Pat. No. 4,122,725).
  • the entire array can consist of ultrasonic transducers, each of which is divided into transducer elements by so-called fine division, which are acoustically separated and electrically controlled together. This fine division shifts the transverse radiation of the transducer elements, which is also emitted, to higher frequencies, and its influence on the resolution is thus reduced.
  • Several transducer elements can be combined into groups by common electrical control. Each group contact then receives its own control line connection. The formation of additional transverse columns results in a matrix version (German design specification 28 29 570).
  • the invention is therefore based on the object of specifying an ultrasound transducer arrangement with a matrix of ultrasound transducers, each of which is provided in a particularly simple manner with a control connection and with which electronic focusing is possible both in the longitudinal direction and in the transverse direction of the arrangement.
  • the above object is achieved in an ultrasonic transducer arrangement of the type mentioned at the outset with the design features according to the characterizing part of claim 1.
  • the diameter preferably consist of a piezoelectric material with low quality, ie high self-damping.
  • the pulse therefore has a correspondingly broad characteristic and the ultrasonic oscillator thus has approximately the same sensitivity in a relatively wide frequency range.
  • Suitable material for such broadband transducer elements is, for example, lead metanobate Pb (Nb0 3 ) 2 or lead zirconate titanate Pb (Zr, Ti10 3) , which is generally referred to as PZT.
  • the strips created by the fine division are arranged at a very short distance from one another, so that the gap formed by the separation practically disappears.
  • a thin plastic interlayer with a thickness of a few can be used as a precaution.
  • the transducer elements can be polarized before the transducer plate is divided or after the transducer elements have been attached to the common electrical contact.
  • FIG. 1 schematically illustrates part of an ultrasonic transducer arrangement according to the invention.
  • FIG. 2 shows a section of an areal array. A section through part of FIG. 2 is shown in FIG. 3.
  • the transducer elements 2 are each provided on their lower end face with a metallization 8, which is made, for example, of a chromium or platinum and gold-containing alloy or can also consist of chrome and gold and chrome-nickel.
  • the transducer elements 2 are fastened with the aid of a solder layer 12 to a metal foil 14, which can be made of silver, for example, and which forms a common electrical connecting conductor for all transducer elements of the entire transducer arrangement.
  • the metal layer 14 is fastened on a damping body 18 with the aid of an adhesive layer 16.
  • the electrical connection conductor 2 of the ultrasonic oscillator 21 connected to the upper end face of the transducer elements is not shown in the figure.
  • a square area of the transducer elements 2 with a length 1 of, for example, approximately 3 mm is obtained.
  • the distances a in the y direction i.e. the spaces between the transducer elements, parallel to the x-direction according to FIG. 1, are kept considerably smaller by the stacking technique of the strips. For example, they can only be approximately 5 .mu.m and will generally not exceed 10 .mu.m accordingly.
  • the extent of the oscillators 21 in the y-direction is correspondingly smaller.
  • the transducer arrangement according to Fi. 2 can consist, for example, of a matrix of 324 transducers, which are arranged in columns 19 and rows 20 and each contain a matrix of 64 transducer elements, as is indicated in the ultrasound transducer 21 for clarification by a grid, although the individual transducer elements in the practical embodiment the arrangement are not visible.
  • the transducer elements of the individual ultrasonic transducers can be controlled in succession with two or more different frequencies.
  • the near-far field boundary referred to as the natural focus can thus be optimally shifted in the depth of an object to be examined by electronically selecting the size of the two-dimensional oscillating field. This is particularly advantageous if you focus electronically because the focus point is in the near-far field boundary or shorter.
  • the individual oscillators 21 to 26 of each of the rows 20 are each provided with a separate connecting conductor, which are designated 36 to 41 for the oscillators of the row 20 in the figure.
  • the individual transducers of the remaining lines are each provided with a connecting conductor, not shown in the figure.
  • this embodiment of the transducer arrangement as a matrix both electronic focusing in the x direction and electronic focusing in the y direction are possible.
  • this embodiment has the advantage that an electronic magnifying glass can be implemented. With a sufficiently large array and a sufficient line density, for example in a first step an object can be rough, i.e. at a larger spatial distance between the volume elements.
  • a detected error with increased line density in this area and reduced line density in its surroundings with a constant total number of lines can then be considered.
  • the two-dimensionally shaped focus can be fixed on this area and an additional optimization is then carried out by the choice of frequency. Since at the same time the area around the fault location is roughly scanned, the overview is always retained.
  • a flat body made of piezoelectric material is metallized on both flat sides and then releasably fastened on a base with one flat side.
  • the body is then moved in its longitudinal direction, i.e. finely divided by cuts parallel to the x-direction according to FIG. 1.
  • the columns 4 thus produced as strips are then connected to one another on the other flat side by a common metal support 14, for example with the aid of the solder layer 12.
  • This metal support 14 is then attached to the damping body 18, for example by means of the adhesive layer 16. Then the strip-like body from his original work pad, which is now on top of the matrix.
  • the fine division takes place in the transverse direction, i.e. parallel to the y-direction, and the matrix of the transducer elements 2 is created.
  • the metallization of the piezoelectric body is also separated in each case and the metal supports are formed on the end faces of the transducer elements, the lower ones of which are shown in FIG. 1 and designated by 8 are.
  • the metal pad 14 serving as a common electrical connection conductor for all transducer elements can preferably consist of the metallization of a plastic film, in particular of polyimide (Kapton), the thickness of which can be, for example, approximately 2 to 10 ⁇ m.
  • the distances between the individual oscillators 21 to 26 and 31 to 35 can correspond to the sawing gaps of the subdivision. In the practical embodiment, these distances are preferably kept as small, for example by stacking technology, as the distances between the individual transducer elements 2 of the ultrasonic transducers.
  • the matrix of transducer elements can also be produced in that the flat body made of piezoelectric material, which is metallized on both flat sides, first in strips with a length of 1 Transducer elements disassembled and then these strips are separated into sections, the length of which is equal to the width b of the transducer elements 2. Then the columnar transducer elements 2 produced in this way are lined up with their separating surfaces both in the x- and in the y-direction at a very short distance and fastened on a metal base, which is then applied to the damping body. With this stacking technique, the spaces c between the transducer elements 2 according to FIG. 1 can also be kept very small.
  • the ultrasonic vibrators using this method, it is expedient to manufacture one of the metal supports on the end faces of the transducer elements 2 from ferromagnetic material.
  • the individual transducer elements 2 can then be transferred to the metal support 14 with the aid of magnetic forces.
  • the individual transducer elements 2 that are already finished can also be transferred, for example, with the aid of an adhesive tape.
  • the transducer elements 2 can also be strung together directly on a stretchable work surface as a matrix. The minimum distance required for decoupling is then established by stretching the work surface. Under certain circumstances, it may be expedient to choose the metal pad 14 serving as a common electrical contact or also the metallization of a plastic film as the working base.
  • the transducer elements 2 according to FIG. 3 are provided on one end face with a common connecting conductor, the metal support 14, while on the opposite end face only the transducer elements of the matrix of the relevant ultrasonic vibrator 21 are provided with a Connection conductor are provided, which can preferably be carried out in the form of a conductor track.
  • a common cover 42 made of plastic, in particular polyimide (Kapton) is provided on its lower flat side in the region of the matrix of the vibrator 21 with a metallization 44, which can consist, for example, of a chrome-silver alloy. This metallization can preferably be evaporated onto the film.
  • the cover 42 is provided with an opening 46. Then the upper flat side of the cover 42 is provided with conductor tracks which represent the connecting conductors 36, 37 and 38. In each case one of these conductor tracks leads to one of the openings in the cover 42 and thus establishes the electrical connection with a control line (not shown in more detail).
  • the metal pad 44 can then be provided with a solder layer 52, which can preferably be vapor-deposited, and with the aid of this solder layer 52, the cover 42 with the connecting conductors 315 to 38 is fastened on the metal pads 48 of the transducer elements 2.
  • solder layer 52 for example an electrically conductive adhesive, a so-called conductive adhesive, can also be used to fasten the cover 42 with the conductor tracks on the transducer elements 2.
  • the entire upper flat side of the cover 42 can be provided with a metal coating, from which the parts which are not required as connecting leads are then removed, for example by means of photoetching technology.
  • the conductor tracks of the connecting conductors 36 to 38 can also be applied to the surface of the cover 42 using mask technology.
  • the oscillators of several lines for example the oscillators of six successive lines 20, 30, 40, 50, 60 and 70 can be combined into a transducer matrix.
  • This matrix can be scanned linearly in the x direction over the entire oscillator field in order to build up an image line sequence.
  • electronic focusing can also be achieved in the transverse direction in both the x and y directions by delaying the delay of the echo pulses or the echo and transmit pulses.
  • the common connecting conductor 14 serving as counter contact is arranged on the underside of the converter elements 2. This common counter contact can also be provided on the top of the transducer elements 2. In this embodiment, the connecting conductors for the individual ultrasonic vibrators are then arranged between the transducer elements and the damping body 18.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)

Claims (12)

1. Transducteur ultrasonore comportant une matrice d'oscillateurs ultrasonores (21 à 26) commandés de façon séparée qui sont respectivement constitués par une matrice d'éléments transducteurs colonnaires séparés entre eux et du point de vue acoustique, commandés de façon commune du point de vue électrique, caractérisé par le fait que tous les oscillateurs ultrasonores (21 à 26 et 31 à 35) sont munis sur une face frontale d'un conducteur de raccordement électrique commun (14) et que sur l'autre face frontale seuls les éléments transducteurs (2) des oscillateurs ultrasonores individuels (21 à 26 ainsi que 31 à 35) sont respectivement munis d'un revêtement métallique (4) servant de connexion électrique commune pour les conducteurs, et qu'il est prévu un cache (42) en matière svnthétiaue qui est respectivement muni d'une ouverture (46) dans la région des oscillateurs ultrasonores (21 à 26 et 31 à 35) et qui est muni du revêtement métallique (44) sur une face plate et, sur l'autre face plate, de voies conductrices qui sont prévues comme conducteurs de raccordement (36 à 41) pour les éléments transducteurs (2) respectivement d'un des oscillateurs ultrasonores (21 à 26 et 31 à 35) et qui sont reliées, respectivement par une des ouvertures (46), au revêtement métallique (44) associé à l'oscillateur ultrasonore correspondant (21 à 26 et 31 à 35).
2. Transducteur ultrasonore suivant la revendication 1, caractérisé par le fait qu'une couche intermédiare isolante du point de vue électrique est disposée entre les éléments transducteurs individuels (2).
3. Procédé pour la fabrication d'un transducteur ultrasonore suivant la revendication 1 ou 2, caractérisé par le fait qu'un corps plat en matériau piézoélectrique, dont l'épaisseur est au moins approximativement égale à la hauteur (h) des éléments transducteurs (2), est métallisé sur les deux faces plates (8, 48) et est alors fixé de façon amovible, au niveau d'une face plate, sur une base de travail et est ensuite finement subdivisé transversalement par rapport à sa direction longitudinale, et qu'alors les bandes ainsi fabriquées sont réunies les unes aux autres du point de vue électrique, sur leur autre face plate, par le revêtement métallique commun (14), et que les bandes sont alors séparées de leur base de travail et sont fixées sur un corps d'amortissement (18) au niveau de leur revêtement métallique (14) et qu'ensuite les bandes sont finement subdivisées parallèlement à sa direction longitudinale.
4. Procédé suivant la revendication 3, caractérisé par le fait qu'on utilise une feuille en matière synthétique métallisée comme revêtement métallique (14).
5. Procédé suivant la revendication 3, caractérisé par le fait que les bandes fabriquées à partir du corps plat sont disposées les unes à côté des autres de manière que leurs surfaces de séparation soient à une très faible distance, et sont alors munies du'revêtement métallique commun (14) sur une face frontale.
6. Procédé pour la fabrication d'un transducteur ultrasonore suivant la revendication 1 ou 2, caractérisé par le fait qu'un corps plat en matériau piézoélectrique, dont l'épaisseur est au moins approximativement égale à la hauteur (h) des éléments transducteurs (2), est métallisé sur les deux faces plates (8, 48), et est alors ensuite décomposé en bandes dont la largeur est égale à la longueur .(n des éléments transducteurs (2), et qu'ensuite les bandes sont séparées en sections dont la longueur est égale à la largeur (b) des éléments transducteurs (2), et que les éléments transducteurs (2) ainsi fabriqués sont transférés sur le revêtement métallique commun (14) et y sont disposés les uns à côté des autres sous le forme d'une matrice de manière que leurs surfaces de séparation soient à une très faible distance (a, c) et sont alors reliés au revêtement métallique commun (14) qui est fixé sur un corps d'amortissement (18), et qu'ensuite les faces frontales libres des éléments transducteurs (2) des oscillateurs individuels (21 à 26 ou 31 à 35) sont munis du conducteur de raccordement électrique commun (36 à 41).
7. Procédé suivant la revendication 6, caractérisé par le fait que les éléments transducteurs (2) sont transférés au moyen d'une bande adhésive.
8. Procédé suivant l'une des revendications 3 à 7, caractérisé par le fait que le cache (42) des faces frontales libres des éléments transducteurs (2) est respectivement muni d'une ouverture (46) dans la région des oscillateurs ultrasonores individuels et est alors respectivement muni dans ces régions, sur une des faces plates, du revêtement métallique (44), et qu'ensuite la face plate opposée est munie des voies conductrices qui servent de conducteurs de raccordement diélectriques (36 à 41) et dont chacune (par exemple 36) est reliée, par une des ouvertures (46), au revêtement métallique (44) de l'oscillateur ultrasonore associé (21 à 26 et 31 à 35) qui est relié de façon conductrice du point de vue électrique aux faces frontales des éléments transducteurs (2), et qu'ensuite la surface plate opposée est recouverte d'une couche adaptatrice (54) (figure 3).
9. Procédé suivant la revendication 8, caractérisé par le fait que la liaison conductrice du point de vue électrique entre le revêtement métallique (44) et les éléments transducteurs (2) est établie par une couche de brasure (52).
10. Procédé suivant la revendication 9, caractérisé par le fait que la couche de brasure (52) est réalisée par dépôt par évaporation.
11. Procédé suivant la revendication 8, caractérisé par le fait que la liaison conductrice du point de vue électrique entre le revêtement métallique (44) et les éléments transducteurs (2) est établie par une colle conductrice.
12. Procédé suivant la revendication 8, caractérisé par le fait que pour fabriquer les voies conductrices (36 à 41), toute la surface plate du cache (42) est métallisée et qu'ensuite les parties non nécessaires de la couche métallique sont éliminées par la technique de photogravure.
EP80103708A 1979-07-20 1980-06-30 Transducteur ultrasonore et procédé pour sa fabrication Expired EP0025092B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT80103708T ATE7083T1 (de) 1979-07-20 1980-06-30 Ultraschallwandleranordnung und verfahren zu ihrer herstellung.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19792929541 DE2929541A1 (de) 1979-07-20 1979-07-20 Ultraschallwandleranordnung
DE2929541 1979-07-20

Publications (2)

Publication Number Publication Date
EP0025092A1 EP0025092A1 (fr) 1981-03-18
EP0025092B1 true EP0025092B1 (fr) 1984-04-11

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Application Number Title Priority Date Filing Date
EP80103708A Expired EP0025092B1 (fr) 1979-07-20 1980-06-30 Transducteur ultrasonore et procédé pour sa fabrication

Country Status (5)

Country Link
US (1) US4371805A (fr)
EP (1) EP0025092B1 (fr)
JP (1) JPS5620400A (fr)
AT (1) ATE7083T1 (fr)
DE (2) DE2929541A1 (fr)

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JP3883823B2 (ja) * 2001-06-19 2007-02-21 日本電波工業株式会社 マトリクス型の超音波探触子及びその製造方法
US7567016B2 (en) * 2005-02-04 2009-07-28 Siemens Medical Solutions Usa, Inc. Multi-dimensional ultrasound transducer array
US8176787B2 (en) * 2008-12-17 2012-05-15 General Electric Company Systems and methods for operating a two-dimensional transducer array
US9142752B2 (en) * 2012-05-01 2015-09-22 Piezotech Llc Low frequency broad band ultrasonic transducers
FR3051693B1 (fr) * 2016-05-31 2018-05-11 Imasonic Reseau d'elements transducteurs ultrasonores
JP7145799B2 (ja) * 2019-03-19 2022-10-03 株式会社東芝 超音波検査装置

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Also Published As

Publication number Publication date
US4371805A (en) 1983-02-01
DE2929541A1 (de) 1981-02-05
ATE7083T1 (de) 1984-04-15
JPS5620400A (en) 1981-02-25
DE3067426D1 (en) 1984-05-17
EP0025092A1 (fr) 1981-03-18

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