EP0025092B1 - Transducteur ultrasonore et procédé pour sa fabrication - Google Patents
Transducteur ultrasonore et procédé pour sa fabrication Download PDFInfo
- Publication number
- EP0025092B1 EP0025092B1 EP80103708A EP80103708A EP0025092B1 EP 0025092 B1 EP0025092 B1 EP 0025092B1 EP 80103708 A EP80103708 A EP 80103708A EP 80103708 A EP80103708 A EP 80103708A EP 0025092 B1 EP0025092 B1 EP 0025092B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- transducer elements
- metal coating
- ultrasonic
- transducer
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000011159 matrix material Substances 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000004020 conductor Substances 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 19
- 238000000576 coating method Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 8
- 238000013016 damping Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000001259 photo etching Methods 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims 2
- 239000000057 synthetic resin Substances 0.000 claims 2
- 230000008021 deposition Effects 0.000 claims 1
- 238000002604 ultrasonography Methods 0.000 description 9
- 239000010410 layer Substances 0.000 description 7
- 238000001465 metallisation Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000005352 clarification Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0611—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile
- B06B1/0614—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile for generating several frequencies
Definitions
- the invention relates to an ultrasound transducer arrangement with a matrix of separately controlled ultrasound transducers, each consisting of a matrix of acoustically separated and electrically jointly controlled columnar transducer elements.
- images are produced from the inside of a body to be examined with the aid of ultrasound pulses, which are emitted by a transducer element which is arranged on the surface of the body.
- the position of an error location can be derived from the transit time of the ultrasound signal and the echo signal.
- the ultrasonic transducer arrangement in the form of a so-called array consists of a large number of ultrasonic transducers with transducer elements made of piezo material, which are arranged next to one another at a short distance.
- the transducer elements can be controlled together or in rows and in groups (US Pat. No. 4,122,725).
- the entire array can consist of ultrasonic transducers, each of which is divided into transducer elements by so-called fine division, which are acoustically separated and electrically controlled together. This fine division shifts the transverse radiation of the transducer elements, which is also emitted, to higher frequencies, and its influence on the resolution is thus reduced.
- Several transducer elements can be combined into groups by common electrical control. Each group contact then receives its own control line connection. The formation of additional transverse columns results in a matrix version (German design specification 28 29 570).
- the invention is therefore based on the object of specifying an ultrasound transducer arrangement with a matrix of ultrasound transducers, each of which is provided in a particularly simple manner with a control connection and with which electronic focusing is possible both in the longitudinal direction and in the transverse direction of the arrangement.
- the above object is achieved in an ultrasonic transducer arrangement of the type mentioned at the outset with the design features according to the characterizing part of claim 1.
- the diameter preferably consist of a piezoelectric material with low quality, ie high self-damping.
- the pulse therefore has a correspondingly broad characteristic and the ultrasonic oscillator thus has approximately the same sensitivity in a relatively wide frequency range.
- Suitable material for such broadband transducer elements is, for example, lead metanobate Pb (Nb0 3 ) 2 or lead zirconate titanate Pb (Zr, Ti10 3) , which is generally referred to as PZT.
- the strips created by the fine division are arranged at a very short distance from one another, so that the gap formed by the separation practically disappears.
- a thin plastic interlayer with a thickness of a few can be used as a precaution.
- the transducer elements can be polarized before the transducer plate is divided or after the transducer elements have been attached to the common electrical contact.
- FIG. 1 schematically illustrates part of an ultrasonic transducer arrangement according to the invention.
- FIG. 2 shows a section of an areal array. A section through part of FIG. 2 is shown in FIG. 3.
- the transducer elements 2 are each provided on their lower end face with a metallization 8, which is made, for example, of a chromium or platinum and gold-containing alloy or can also consist of chrome and gold and chrome-nickel.
- the transducer elements 2 are fastened with the aid of a solder layer 12 to a metal foil 14, which can be made of silver, for example, and which forms a common electrical connecting conductor for all transducer elements of the entire transducer arrangement.
- the metal layer 14 is fastened on a damping body 18 with the aid of an adhesive layer 16.
- the electrical connection conductor 2 of the ultrasonic oscillator 21 connected to the upper end face of the transducer elements is not shown in the figure.
- a square area of the transducer elements 2 with a length 1 of, for example, approximately 3 mm is obtained.
- the distances a in the y direction i.e. the spaces between the transducer elements, parallel to the x-direction according to FIG. 1, are kept considerably smaller by the stacking technique of the strips. For example, they can only be approximately 5 .mu.m and will generally not exceed 10 .mu.m accordingly.
- the extent of the oscillators 21 in the y-direction is correspondingly smaller.
- the transducer arrangement according to Fi. 2 can consist, for example, of a matrix of 324 transducers, which are arranged in columns 19 and rows 20 and each contain a matrix of 64 transducer elements, as is indicated in the ultrasound transducer 21 for clarification by a grid, although the individual transducer elements in the practical embodiment the arrangement are not visible.
- the transducer elements of the individual ultrasonic transducers can be controlled in succession with two or more different frequencies.
- the near-far field boundary referred to as the natural focus can thus be optimally shifted in the depth of an object to be examined by electronically selecting the size of the two-dimensional oscillating field. This is particularly advantageous if you focus electronically because the focus point is in the near-far field boundary or shorter.
- the individual oscillators 21 to 26 of each of the rows 20 are each provided with a separate connecting conductor, which are designated 36 to 41 for the oscillators of the row 20 in the figure.
- the individual transducers of the remaining lines are each provided with a connecting conductor, not shown in the figure.
- this embodiment of the transducer arrangement as a matrix both electronic focusing in the x direction and electronic focusing in the y direction are possible.
- this embodiment has the advantage that an electronic magnifying glass can be implemented. With a sufficiently large array and a sufficient line density, for example in a first step an object can be rough, i.e. at a larger spatial distance between the volume elements.
- a detected error with increased line density in this area and reduced line density in its surroundings with a constant total number of lines can then be considered.
- the two-dimensionally shaped focus can be fixed on this area and an additional optimization is then carried out by the choice of frequency. Since at the same time the area around the fault location is roughly scanned, the overview is always retained.
- a flat body made of piezoelectric material is metallized on both flat sides and then releasably fastened on a base with one flat side.
- the body is then moved in its longitudinal direction, i.e. finely divided by cuts parallel to the x-direction according to FIG. 1.
- the columns 4 thus produced as strips are then connected to one another on the other flat side by a common metal support 14, for example with the aid of the solder layer 12.
- This metal support 14 is then attached to the damping body 18, for example by means of the adhesive layer 16. Then the strip-like body from his original work pad, which is now on top of the matrix.
- the fine division takes place in the transverse direction, i.e. parallel to the y-direction, and the matrix of the transducer elements 2 is created.
- the metallization of the piezoelectric body is also separated in each case and the metal supports are formed on the end faces of the transducer elements, the lower ones of which are shown in FIG. 1 and designated by 8 are.
- the metal pad 14 serving as a common electrical connection conductor for all transducer elements can preferably consist of the metallization of a plastic film, in particular of polyimide (Kapton), the thickness of which can be, for example, approximately 2 to 10 ⁇ m.
- the distances between the individual oscillators 21 to 26 and 31 to 35 can correspond to the sawing gaps of the subdivision. In the practical embodiment, these distances are preferably kept as small, for example by stacking technology, as the distances between the individual transducer elements 2 of the ultrasonic transducers.
- the matrix of transducer elements can also be produced in that the flat body made of piezoelectric material, which is metallized on both flat sides, first in strips with a length of 1 Transducer elements disassembled and then these strips are separated into sections, the length of which is equal to the width b of the transducer elements 2. Then the columnar transducer elements 2 produced in this way are lined up with their separating surfaces both in the x- and in the y-direction at a very short distance and fastened on a metal base, which is then applied to the damping body. With this stacking technique, the spaces c between the transducer elements 2 according to FIG. 1 can also be kept very small.
- the ultrasonic vibrators using this method, it is expedient to manufacture one of the metal supports on the end faces of the transducer elements 2 from ferromagnetic material.
- the individual transducer elements 2 can then be transferred to the metal support 14 with the aid of magnetic forces.
- the individual transducer elements 2 that are already finished can also be transferred, for example, with the aid of an adhesive tape.
- the transducer elements 2 can also be strung together directly on a stretchable work surface as a matrix. The minimum distance required for decoupling is then established by stretching the work surface. Under certain circumstances, it may be expedient to choose the metal pad 14 serving as a common electrical contact or also the metallization of a plastic film as the working base.
- the transducer elements 2 according to FIG. 3 are provided on one end face with a common connecting conductor, the metal support 14, while on the opposite end face only the transducer elements of the matrix of the relevant ultrasonic vibrator 21 are provided with a Connection conductor are provided, which can preferably be carried out in the form of a conductor track.
- a common cover 42 made of plastic, in particular polyimide (Kapton) is provided on its lower flat side in the region of the matrix of the vibrator 21 with a metallization 44, which can consist, for example, of a chrome-silver alloy. This metallization can preferably be evaporated onto the film.
- the cover 42 is provided with an opening 46. Then the upper flat side of the cover 42 is provided with conductor tracks which represent the connecting conductors 36, 37 and 38. In each case one of these conductor tracks leads to one of the openings in the cover 42 and thus establishes the electrical connection with a control line (not shown in more detail).
- the metal pad 44 can then be provided with a solder layer 52, which can preferably be vapor-deposited, and with the aid of this solder layer 52, the cover 42 with the connecting conductors 315 to 38 is fastened on the metal pads 48 of the transducer elements 2.
- solder layer 52 for example an electrically conductive adhesive, a so-called conductive adhesive, can also be used to fasten the cover 42 with the conductor tracks on the transducer elements 2.
- the entire upper flat side of the cover 42 can be provided with a metal coating, from which the parts which are not required as connecting leads are then removed, for example by means of photoetching technology.
- the conductor tracks of the connecting conductors 36 to 38 can also be applied to the surface of the cover 42 using mask technology.
- the oscillators of several lines for example the oscillators of six successive lines 20, 30, 40, 50, 60 and 70 can be combined into a transducer matrix.
- This matrix can be scanned linearly in the x direction over the entire oscillator field in order to build up an image line sequence.
- electronic focusing can also be achieved in the transverse direction in both the x and y directions by delaying the delay of the echo pulses or the echo and transmit pulses.
- the common connecting conductor 14 serving as counter contact is arranged on the underside of the converter elements 2. This common counter contact can also be provided on the top of the transducer elements 2. In this embodiment, the connecting conductors for the individual ultrasonic vibrators are then arranged between the transducer elements and the damping body 18.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT80103708T ATE7083T1 (de) | 1979-07-20 | 1980-06-30 | Ultraschallwandleranordnung und verfahren zu ihrer herstellung. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19792929541 DE2929541A1 (de) | 1979-07-20 | 1979-07-20 | Ultraschallwandleranordnung |
DE2929541 | 1979-07-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0025092A1 EP0025092A1 (fr) | 1981-03-18 |
EP0025092B1 true EP0025092B1 (fr) | 1984-04-11 |
Family
ID=6076340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP80103708A Expired EP0025092B1 (fr) | 1979-07-20 | 1980-06-30 | Transducteur ultrasonore et procédé pour sa fabrication |
Country Status (5)
Country | Link |
---|---|
US (1) | US4371805A (fr) |
EP (1) | EP0025092B1 (fr) |
JP (1) | JPS5620400A (fr) |
AT (1) | ATE7083T1 (fr) |
DE (2) | DE2929541A1 (fr) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1162336B (it) * | 1979-06-22 | 1987-03-25 | Consiglio Nazionale Ricerche | Procedimento per la realizzazione di trasduttori ultraacustici a cortina di linee o a matrice di punti e trasduttori ottenuti |
EP0040374A1 (fr) * | 1980-05-21 | 1981-11-25 | Siemens Aktiengesellschaft | Transducteur ultrasonique et procédé de fabrication dudit transducteur |
DE3021449A1 (de) * | 1980-06-06 | 1981-12-24 | Siemens AG, 1000 Berlin und 8000 München | Ultraschallwandleranordnung und verfahren zu seiner herstellung |
EP0043195A1 (fr) * | 1980-06-26 | 1982-01-06 | United Kingdom Atomic Energy Authority | Transducteurs ultrasoniques |
US4519260A (en) * | 1982-02-18 | 1985-05-28 | The Board Of Trustees Of The Leland Stanford Junior University | Ultrasonic transducers and applications thereof |
US4431936A (en) * | 1982-02-18 | 1984-02-14 | The Board Of Trustees Of The Leland Stanford Junior University | Transducer structure for generating uniform and focused ultrasonic beams and applications thereof |
EP0142215A3 (fr) * | 1983-05-26 | 1987-03-11 | Advanced Technology Laboratories, Inc. | Transducteur ultrasonore ayant des modes vibratoires améliorées |
JPS6024800A (ja) * | 1983-07-21 | 1985-02-07 | Toshiba Corp | 超音波探触子 |
DE3678635D1 (de) * | 1985-05-20 | 1991-05-16 | Matsushita Electric Ind Co Ltd | Ultraschallwandler. |
JP2545861B2 (ja) * | 1987-06-12 | 1996-10-23 | 富士通株式会社 | 超音波探触子の製造方法 |
DE3811052C1 (fr) * | 1988-03-31 | 1989-08-24 | Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De | |
WO1990016087A2 (fr) * | 1989-06-07 | 1990-12-27 | Interspec, Inc. | Dispositif piezo-electrique a entaille remplie d'air |
US5065068A (en) * | 1989-06-07 | 1991-11-12 | Oakley Clyde G | Ferroelectric ceramic transducer |
US5099459A (en) * | 1990-04-05 | 1992-03-24 | General Electric Company | Phased array ultrosonic transducer including different sized phezoelectric segments |
US5091893A (en) * | 1990-04-05 | 1992-02-25 | General Electric Company | Ultrasonic array with a high density of electrical connections |
US5160870A (en) * | 1990-06-25 | 1992-11-03 | Carson Paul L | Ultrasonic image sensing array and method |
US5191796A (en) * | 1990-08-10 | 1993-03-09 | Sekisui Kaseihin Koygo Kabushiki Kaisha | Acoustic-emission sensor |
WO1996003777A1 (fr) * | 1994-07-22 | 1996-02-08 | Loral Infrared & Imaging Systems, Inc. | Reseau pour imagerie ultrasonore |
US5677491A (en) * | 1994-08-08 | 1997-10-14 | Diasonics Ultrasound, Inc. | Sparse two-dimensional transducer array |
US5550792A (en) * | 1994-09-30 | 1996-08-27 | Edo Western Corp. | Sliced phased array doppler sonar system |
US6012779A (en) * | 1997-02-04 | 2000-01-11 | Lunar Corporation | Thin film acoustic array |
FR2770932B1 (fr) * | 1997-11-07 | 2001-11-16 | Thomson Csf | Procede de fabrication d'une sonde acoustique |
US5977691A (en) * | 1998-02-10 | 1999-11-02 | Hewlett-Packard Company | Element interconnections for multiple aperture transducers |
JP3883823B2 (ja) * | 2001-06-19 | 2007-02-21 | 日本電波工業株式会社 | マトリクス型の超音波探触子及びその製造方法 |
US7567016B2 (en) * | 2005-02-04 | 2009-07-28 | Siemens Medical Solutions Usa, Inc. | Multi-dimensional ultrasound transducer array |
US8176787B2 (en) * | 2008-12-17 | 2012-05-15 | General Electric Company | Systems and methods for operating a two-dimensional transducer array |
US9142752B2 (en) * | 2012-05-01 | 2015-09-22 | Piezotech Llc | Low frequency broad band ultrasonic transducers |
FR3051693B1 (fr) * | 2016-05-31 | 2018-05-11 | Imasonic | Reseau d'elements transducteurs ultrasonores |
JP7145799B2 (ja) * | 2019-03-19 | 2022-10-03 | 株式会社東芝 | 超音波検査装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4122725A (en) * | 1976-06-16 | 1978-10-31 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Length mode piezoelectric ultrasonic transducer for inspection of solid objects |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2700895A (en) * | 1949-04-06 | 1955-02-01 | Babcock & Wilcox Co | Apparatus for ultrasonic examination of bodies |
US2844809A (en) * | 1955-01-05 | 1958-07-22 | Raytheon Mfg Co | Compressional wave transducers |
US3329408A (en) * | 1965-03-29 | 1967-07-04 | Branson Instr | Transducer mounting arrangement |
JPS5512254B2 (fr) * | 1973-07-03 | 1980-03-31 | ||
JPS5419151B2 (fr) * | 1974-06-06 | 1979-07-12 | ||
US3979711A (en) * | 1974-06-17 | 1976-09-07 | The Board Of Trustees Of Leland Stanford Junior University | Ultrasonic transducer array and imaging system |
JPS5257847A (en) * | 1975-11-07 | 1977-05-12 | Oki Electric Ind Co Ltd | Ultrasonic transmitter and receiver array |
JPS5353393A (en) * | 1976-10-25 | 1978-05-15 | Matsushita Electric Ind Co Ltd | Ultrasonic probe |
US4170142A (en) * | 1977-07-15 | 1979-10-09 | Electric Power Research Institute, Inc. | Linear transducer array and method for both pulse-echo and holographic acoustic imaging |
FR2405484A1 (fr) * | 1977-10-05 | 1979-05-04 | Labo Electronique Physique | Systeme electronique d'exploration et de focalisation au moyen d'ondes ultrasonores |
US4138304A (en) * | 1977-11-03 | 1979-02-06 | General Electric Company | Wafer sawing technique |
JPS54151397U (fr) * | 1978-04-14 | 1979-10-20 | ||
AU529113B2 (en) * | 1978-04-19 | 1983-05-26 | Commonwealth Of Australia, The | Ultrasonic transducer array |
DE2829570C2 (de) * | 1978-07-05 | 1979-12-20 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Ultraschallkopf |
DE2829612C2 (de) * | 1978-07-05 | 1980-01-10 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung von Ultraschallköpfen |
DE2829561B1 (de) * | 1978-07-05 | 1979-04-26 | Siemens Ag | Verfahren zur Herstellung von Ultraschallkoepfen |
DE2829581C2 (de) * | 1978-07-05 | 1980-01-17 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung von Ultraschallköpfen |
US4211948A (en) * | 1978-11-08 | 1980-07-08 | General Electric Company | Front surface matched piezoelectric ultrasonic transducer array with wide field of view |
-
1979
- 1979-07-20 DE DE19792929541 patent/DE2929541A1/de not_active Withdrawn
-
1980
- 1980-06-30 AT AT80103708T patent/ATE7083T1/de not_active IP Right Cessation
- 1980-06-30 DE DE8080103708T patent/DE3067426D1/de not_active Expired
- 1980-06-30 EP EP80103708A patent/EP0025092B1/fr not_active Expired
- 1980-07-10 US US06/168,243 patent/US4371805A/en not_active Expired - Lifetime
- 1980-07-21 JP JP9975480A patent/JPS5620400A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4122725A (en) * | 1976-06-16 | 1978-10-31 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Length mode piezoelectric ultrasonic transducer for inspection of solid objects |
Also Published As
Publication number | Publication date |
---|---|
US4371805A (en) | 1983-02-01 |
DE2929541A1 (de) | 1981-02-05 |
ATE7083T1 (de) | 1984-04-15 |
JPS5620400A (en) | 1981-02-25 |
DE3067426D1 (en) | 1984-05-17 |
EP0025092A1 (fr) | 1981-03-18 |
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Legal Events
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