EA201001075A1 - COOLING DEVICE FOR ELECTRICAL EQUIPMENT - Google Patents

COOLING DEVICE FOR ELECTRICAL EQUIPMENT

Info

Publication number
EA201001075A1
EA201001075A1 EA201001075A EA201001075A EA201001075A1 EA 201001075 A1 EA201001075 A1 EA 201001075A1 EA 201001075 A EA201001075 A EA 201001075A EA 201001075 A EA201001075 A EA 201001075A EA 201001075 A1 EA201001075 A1 EA 201001075A1
Authority
EA
Eurasian Patent Office
Prior art keywords
air outlet
electrical equipment
vortex chamber
cooling device
heat
Prior art date
Application number
EA201001075A
Other languages
Russian (ru)
Other versions
EA014801B1 (en
Inventor
Александр Николаевич Соколов
Original Assignee
Александр Николаевич Соколов
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Александр Николаевич Соколов filed Critical Александр Николаевич Соколов
Priority to EA201001075A priority Critical patent/EA201001075A1/en
Priority to PCT/RU2011/000023 priority patent/WO2012008868A1/en
Publication of EA014801B1 publication Critical patent/EA014801B1/en
Publication of EA201001075A1 publication Critical patent/EA201001075A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/02—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect
    • F25B9/04—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect using vortex effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08—Fluid driving means, e.g. pumps, fans
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Задача изобретения заключается в интенсификации конвективной составляющей теплообмена, что приводит к увеличению энергетической эффективности теплообменного устройства, снижению его веса и стоимости. Устройство охлаждения содержит вентилятор с направленным воздушным выходом из корпуса, вихревую камеру (1) с входом (2, 3), обеспечивающим закрутку воздуха в камере (1), которым соединена с воздушным выходом из корпуса вентилятора, и с отверстием (10, 11) на торце для выхода воздуха, теплопроводящий элемент (12), расположенный во внутреннем объёме вихревой камеры (1) и выполненный с возможностью взаимодействия для охлаждения с расположенным снаружи вихревой камеры (1) элементом электроаппаратуры.The objective of the invention is to intensify the convective component of heat transfer, which leads to an increase in the energy efficiency of the heat exchanging device, reducing its weight and cost. The cooling device contains a fan with a directed air outlet from the housing, a vortex chamber (1) with an inlet (2, 3) providing air twist in the chamber (1), which is connected to the air outlet from the fan housing, and with an opening (10, 11) at the end of the air outlet, a heat-conducting element (12) located in the inner volume of the vortex chamber (1) and designed to cooperate for cooling with an element of electrical equipment located outside the vortex chamber (1).

EA201001075A 2010-07-16 2010-07-16 COOLING DEVICE FOR ELECTRICAL EQUIPMENT EA201001075A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EA201001075A EA201001075A1 (en) 2010-07-16 2010-07-16 COOLING DEVICE FOR ELECTRICAL EQUIPMENT
PCT/RU2011/000023 WO2012008868A1 (en) 2010-07-16 2011-01-20 Cooling device for electrical equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EA201001075A EA201001075A1 (en) 2010-07-16 2010-07-16 COOLING DEVICE FOR ELECTRICAL EQUIPMENT

Publications (2)

Publication Number Publication Date
EA014801B1 EA014801B1 (en) 2011-02-28
EA201001075A1 true EA201001075A1 (en) 2011-02-28

Family

ID=43778132

Family Applications (1)

Application Number Title Priority Date Filing Date
EA201001075A EA201001075A1 (en) 2010-07-16 2010-07-16 COOLING DEVICE FOR ELECTRICAL EQUIPMENT

Country Status (2)

Country Link
EA (1) EA201001075A1 (en)
WO (1) WO2012008868A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2580675C2 (en) * 2014-03-25 2016-04-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Казанский национальный исследовательский технический университет им. А.Н. Туполева-КАИ" (КНИТУ-КАИ) Cooling device for heat dissipating equipment

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EA201100856A1 (en) * 2011-06-09 2012-12-28 Александр Николаевич Соколов LIQUID COOLING UNIT FOR ELECTRICAL EQUIPMENT (OPTIONS)
RU2700660C1 (en) * 2018-12-04 2019-09-18 Антон Андреевич Румянцев Combined cooling system
WO2024010486A1 (en) * 2022-07-07 2024-01-11 Yandex Limited Liability Company A heat exchanger for an electronic component of a server

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU519880A1 (en) * 1974-07-02 1976-06-30 Предприятие П/Я Г-4371 Device for cooling radioelectrode devices
SU1274165A1 (en) * 1984-01-25 1986-11-30 Казанский Ордена Трудового Красного Знамени И Ордена Дружбы Народов Авиационный Институт Им.А.Н.Туполева Case assembly for electronic equipment
RU2207472C2 (en) * 2001-07-05 2003-06-27 Зайченко Федор Николаевич Vortex pipe
FI115872B (en) * 2003-01-07 2005-07-29 Oseir Oy Method and apparatus for temperature control of an optoelectronic semiconductor component
RU2305230C2 (en) * 2004-04-08 2007-08-27 Юрий Григорьевич Белостоцкий Cooling apparatus operation method and cooling apparatus
RU2294489C1 (en) * 2005-06-16 2007-02-27 Владимир Михайлович Криловецкий Isobaric vortex conditioner
RU2275764C1 (en) * 2005-08-08 2006-04-27 Сергей Анатольевич Ермаков Thermal pipe with forced liquid circulation and thermal pipe for cooling notebooks
CA2625431A1 (en) * 2005-10-10 2007-04-19 Mg Innovations Corp. Phase change material heat exchanger
RU2334378C1 (en) * 2007-05-16 2008-09-20 Азат Геннадьевич Коченков Device of cooling of elements of heat-removing electrical equipment
JP2009117631A (en) * 2007-11-07 2009-05-28 Panasonic Corp Cooling apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2580675C2 (en) * 2014-03-25 2016-04-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Казанский национальный исследовательский технический университет им. А.Н. Туполева-КАИ" (КНИТУ-КАИ) Cooling device for heat dissipating equipment

Also Published As

Publication number Publication date
EA014801B1 (en) 2011-02-28
WO2012008868A1 (en) 2012-01-19

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Legal Events

Date Code Title Description
MM4A Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s)

Designated state(s): AM MD TM

MM4A Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s)

Designated state(s): AZ BY KZ KG TJ

MM4A Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s)

Designated state(s): RU