DK643688D0 - BLOOD-EXHAUSTABLE THIN FILM IN A SINGLE OR MULTIPLE METALLIZATION - Google Patents
BLOOD-EXHAUSTABLE THIN FILM IN A SINGLE OR MULTIPLE METALLIZATIONInfo
- Publication number
- DK643688D0 DK643688D0 DK643688A DK643688A DK643688D0 DK 643688 D0 DK643688 D0 DK 643688D0 DK 643688 A DK643688 A DK 643688A DK 643688 A DK643688 A DK 643688A DK 643688 D0 DK643688 D0 DK 643688D0
- Authority
- DK
- Denmark
- Prior art keywords
- exhaustable
- blood
- thin film
- multiple metallization
- metallization
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Die Bonding (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DD30916687A DD274967A3 (en) | 1987-11-18 | 1987-11-18 | Solderable thin film in a single or multi-layer metallization |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DK643688D0 true DK643688D0 (en) | 1988-11-17 |
| DK643688A DK643688A (en) | 1989-05-19 |
Family
ID=5594019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK643688A DK643688A (en) | 1987-11-18 | 1988-11-17 | BLOOD-EXHAUSTABLE THIN FILM IN A SINGLE OR MULTIPLE METALLIZATION |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0316950A3 (en) |
| DD (1) | DD274967A3 (en) |
| DK (1) | DK643688A (en) |
| FI (1) | FI885350A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5476726A (en) * | 1992-01-22 | 1995-12-19 | Hitachi, Ltd. | Circuit board with metal layer for solder bonding and electronic circuit device employing the same |
| US5969423A (en) | 1997-07-15 | 1999-10-19 | Micron Technology, Inc. | Aluminum-containing films derived from using hydrogen and oxygen gas in sputter deposition |
| US6222271B1 (en) | 1997-07-15 | 2001-04-24 | Micron Technology, Inc. | Method of using hydrogen gas in sputter deposition of aluminum-containing films and aluminum-containing films derived therefrom |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4463059A (en) * | 1982-06-30 | 1984-07-31 | International Business Machines Corporation | Layered metal film structures for LSI chip carriers adapted for solder bonding and wire bonding |
| JPS60214544A (en) * | 1984-04-06 | 1985-10-26 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Method of bonding by contacting metal with insulating material |
-
1987
- 1987-11-18 DD DD30916687A patent/DD274967A3/en not_active IP Right Cessation
-
1988
- 1988-11-17 DK DK643688A patent/DK643688A/en not_active Application Discontinuation
- 1988-11-18 EP EP19880119241 patent/EP0316950A3/en not_active Withdrawn
- 1988-11-18 FI FI885350A patent/FI885350A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0316950A3 (en) | 1990-12-05 |
| EP0316950A2 (en) | 1989-05-24 |
| FI885350A (en) | 1989-05-19 |
| DK643688A (en) | 1989-05-19 |
| DD274967A3 (en) | 1990-01-10 |
| FI885350A0 (en) | 1988-11-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AHB | Application shelved due to non-payment |