DK3636988T3 - LIGHTING DEVICE EQUIPPED WITH FOLDABLE CIRCUIT LINE AND LED, AS WELL AS PROCEDURE FOR MANUFACTURE OF THE SAME - Google Patents
LIGHTING DEVICE EQUIPPED WITH FOLDABLE CIRCUIT LINE AND LED, AS WELL AS PROCEDURE FOR MANUFACTURE OF THE SAME Download PDFInfo
- Publication number
- DK3636988T3 DK3636988T3 DK18919402.0T DK18919402T DK3636988T3 DK 3636988 T3 DK3636988 T3 DK 3636988T3 DK 18919402 T DK18919402 T DK 18919402T DK 3636988 T3 DK3636988 T3 DK 3636988T3
- Authority
- DK
- Denmark
- Prior art keywords
- led
- procedure
- manufacture
- well
- lighting device
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
- F21V33/008—Leisure, hobby or sport articles, e.g. toys, games or first-aid kits; Hand tools; Toolboxes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
- G03B15/02—Illuminating scene
- G03B15/03—Combinations of cameras with lighting apparatus; Flash units
- G03B15/05—Combinations of cameras with electronic flash apparatus; Electronic flash units
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2215/00—Special procedures for taking photographs; Apparatus therefor
- G03B2215/05—Combinations of cameras with electronic flash units
- G03B2215/0514—Separate unit
- G03B2215/0517—Housing
- G03B2215/0521—Housing movable housing, e.g. bounce-light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2215/00—Special procedures for taking photographs; Apparatus therefor
- G03B2215/05—Combinations of cameras with electronic flash units
- G03B2215/0564—Combinations of cameras with electronic flash units characterised by the type of light source
- G03B2215/0567—Solid-state light source, e.g. LED, laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Planar Illumination Modules (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180095151A KR102009346B1 (en) | 2018-08-14 | 2018-08-14 | Lighting device with collapsible circuit wire and led, method of manufacturing the same |
PCT/KR2018/011475 WO2020036255A1 (en) | 2018-08-14 | 2018-09-28 | Lighting device equipped with foldable circuit wire and led, and method for manufacturing same |
Publications (1)
Publication Number | Publication Date |
---|---|
DK3636988T3 true DK3636988T3 (en) | 2021-09-13 |
Family
ID=67624649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK18919402.0T DK3636988T3 (en) | 2018-08-14 | 2018-09-28 | LIGHTING DEVICE EQUIPPED WITH FOLDABLE CIRCUIT LINE AND LED, AS WELL AS PROCEDURE FOR MANUFACTURE OF THE SAME |
Country Status (8)
Country | Link |
---|---|
US (1) | US10916528B1 (en) |
EP (1) | EP3636988B1 (en) |
JP (1) | JP6948411B2 (en) |
KR (1) | KR102009346B1 (en) |
CN (1) | CN111051979A (en) |
DK (1) | DK3636988T3 (en) |
ES (1) | ES2886257T3 (en) |
WO (1) | WO2020036255A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110383367A (en) * | 2017-03-02 | 2019-10-25 | 米蒂尔格拉夫迪波特公司 | For showing the separately controllable light-emitting diode (LED) module of the pattern limited |
CN109599477B (en) * | 2018-11-28 | 2020-06-02 | 武汉华星光电技术有限公司 | Mesh manufacturing method |
KR102582383B1 (en) * | 2021-07-30 | 2023-09-25 | 상명대학교산학협력단 | LED textile fabrication methods and light emitting wearable devices using the same |
WO2023149744A1 (en) * | 2022-02-04 | 2023-08-10 | 주식회사 오딧세이글로벌 | Plant-growing lighting device |
JP2024095270A (en) * | 2022-12-28 | 2024-07-10 | 大日本印刷株式会社 | LED sheet, LED sheet assembly and culture system |
Family Cites Families (30)
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JP4067801B2 (en) * | 2001-09-18 | 2008-03-26 | 松下電器産業株式会社 | Lighting device |
JP2004290626A (en) * | 2003-03-25 | 2004-10-21 | Tamurakku:Kk | Lighting device for portable storage tool |
JP2005268648A (en) * | 2004-03-19 | 2005-09-29 | Auto Network Gijutsu Kenkyusho:Kk | Circuit structure |
JP2006127993A (en) * | 2004-10-29 | 2006-05-18 | Toshiba Lighting & Technology Corp | Luminaire |
ATE381250T1 (en) * | 2005-05-13 | 2007-12-15 | Sefar Ag | CIRCUIT BOARD AND METHOD FOR THE PRODUCTION THEREOF |
CN100469220C (en) * | 2007-06-14 | 2009-03-11 | 江南大学 | A method for making elastic circuit with the non-weaving cloth as base |
US8030676B2 (en) * | 2008-03-31 | 2011-10-04 | Yuan Lin | Substrate structrue for light-emitting diode |
EP2430652B1 (en) * | 2009-05-12 | 2019-11-20 | The Board of Trustees of the University of Illionis | Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays |
JP5031011B2 (en) * | 2009-10-21 | 2012-09-19 | エイテックス株式会社 | Flexible light emitting device and manufacturing method thereof |
EP2547952A2 (en) * | 2010-03-16 | 2013-01-23 | Koninklijke Philips Electronics N.V. | Light-emitting textile-based architectural element |
EP2620042A1 (en) * | 2010-09-21 | 2013-07-31 | Koninklijke Philips Electronics N.V. | Electronic textile and method of manufacturing an electronic textile |
DE102010054068A1 (en) * | 2010-12-10 | 2012-06-14 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic component and component |
US8585243B2 (en) * | 2011-06-28 | 2013-11-19 | Osram Sylvania Inc. | LED lighting apparatus, systems and methods of manufacture |
KR101120460B1 (en) | 2011-08-29 | 2012-03-13 | (주)현대포멕스 | Foldable type led lighting device having superior portability |
US20140048824A1 (en) * | 2012-08-15 | 2014-02-20 | Epistar Corporation | Light-emitting device |
JP2015028918A (en) * | 2013-06-27 | 2015-02-12 | 株式会社半導体エネルギー研究所 | Light-emitting device and camera |
KR101627186B1 (en) | 2014-04-04 | 2016-06-13 | 송창환 | Flexible LED lighting for studio system |
CN203967124U (en) * | 2014-07-24 | 2014-11-26 | 王定锋 | A kind of LED lamp of flip-chip packaged multifaceted light-emitting |
CN204300734U (en) * | 2014-10-31 | 2015-04-29 | 胡兴伟 | A kind of LED intelligent illumination woven fabric |
KR102182521B1 (en) * | 2014-12-30 | 2020-11-24 | 코오롱글로텍주식회사 | Barrier fabric substrate with high flexibility and manufacturing method thereof |
GB201501297D0 (en) * | 2015-01-27 | 2015-03-11 | Mas Active Trading Pvt Ltd | Device |
US20180038578A1 (en) * | 2015-02-24 | 2018-02-08 | Teddykorea Co., Ltd. | Flexible lighting panel |
KR101708550B1 (en) * | 2015-02-24 | 2017-02-21 | 송인실 | Flexible illumination panel |
JP6414485B2 (en) * | 2015-02-27 | 2018-10-31 | 日亜化学工業株式会社 | Light emitting device |
US10553540B2 (en) * | 2015-08-20 | 2020-02-04 | Apple Inc. | Fabric-based items with electrical component arrays |
US9936581B1 (en) * | 2016-10-11 | 2018-04-03 | Flex Ltd. | Mechanical and electrical interconnects between conductive threads in fabrics to PCB, FPC, and rigid-flex circuits |
JP6776855B2 (en) * | 2016-12-06 | 2020-10-28 | 日亜化学工業株式会社 | Light emitting device |
JP6989403B2 (en) * | 2018-02-12 | 2022-01-05 | セーレン株式会社 | Light emitting member |
US10490507B1 (en) * | 2018-05-31 | 2019-11-26 | Loomia Technologies, Inc. | Electronic components for soft, flexible circuitry layers and methods therefor |
US10593852B2 (en) * | 2018-06-20 | 2020-03-17 | Innolux Corporation | Display device having a plurality of main pads, a plurality of redundant pads, and a light-emitting device |
-
2018
- 2018-08-14 KR KR1020180095151A patent/KR102009346B1/en active IP Right Grant
- 2018-09-28 ES ES18919402T patent/ES2886257T3/en active Active
- 2018-09-28 CN CN201880034140.7A patent/CN111051979A/en active Pending
- 2018-09-28 EP EP18919402.0A patent/EP3636988B1/en active Active
- 2018-09-28 JP JP2019566956A patent/JP6948411B2/en active Active
- 2018-09-28 US US16/313,250 patent/US10916528B1/en active Active
- 2018-09-28 WO PCT/KR2018/011475 patent/WO2020036255A1/en unknown
- 2018-09-28 DK DK18919402.0T patent/DK3636988T3/en active
Also Published As
Publication number | Publication date |
---|---|
KR102009346B1 (en) | 2019-08-12 |
US10916528B1 (en) | 2021-02-09 |
CN111051979A (en) | 2020-04-21 |
JP2021509754A (en) | 2021-04-01 |
EP3636988B1 (en) | 2021-07-14 |
WO2020036255A1 (en) | 2020-02-20 |
ES2886257T3 (en) | 2021-12-16 |
EP3636988A1 (en) | 2020-04-15 |
US20210020612A1 (en) | 2021-01-21 |
JP6948411B2 (en) | 2021-10-13 |
EP3636988A4 (en) | 2020-06-17 |
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