DK204982A - PRINTED CIRCUIT AND PROCEDURE FOR ITS PREPARATION - Google Patents

PRINTED CIRCUIT AND PROCEDURE FOR ITS PREPARATION Download PDF

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Publication number
DK204982A
DK204982A DK204982A DK204982A DK204982A DK 204982 A DK204982 A DK 204982A DK 204982 A DK204982 A DK 204982A DK 204982 A DK204982 A DK 204982A DK 204982 A DK204982 A DK 204982A
Authority
DK
Denmark
Prior art keywords
procedure
preparation
printed circuit
printed
circuit
Prior art date
Application number
DK204982A
Other languages
Danish (da)
Inventor
E Serras-Paulet
Original Assignee
Serras Paulet Edouard
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9245779&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK204982(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Serras Paulet Edouard filed Critical Serras Paulet Edouard
Publication of DK204982A publication Critical patent/DK204982A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
DK204982A 1980-09-09 1982-05-06 PRINTED CIRCUIT AND PROCEDURE FOR ITS PREPARATION DK204982A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8019462A FR2490059A1 (en) 1980-09-09 1980-09-09 PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF
PCT/FR1981/000109 WO1982000938A1 (en) 1980-09-09 1981-08-28 Printed circuit and manufacturing process thereof

Publications (1)

Publication Number Publication Date
DK204982A true DK204982A (en) 1982-05-06

Family

ID=9245779

Family Applications (1)

Application Number Title Priority Date Filing Date
DK204982A DK204982A (en) 1980-09-09 1982-05-06 PRINTED CIRCUIT AND PROCEDURE FOR ITS PREPARATION

Country Status (11)

Country Link
EP (1) EP0059206B1 (en)
JP (1) JPS57501353A (en)
AU (1) AU7537981A (en)
BE (1) BE890272A (en)
CA (1) CA1171549A (en)
DK (1) DK204982A (en)
ES (1) ES505299A0 (en)
FR (1) FR2490059A1 (en)
IT (1) IT1138586B (en)
NO (1) NO821481L (en)
WO (1) WO1982000938A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2527036A1 (en) * 1982-05-14 1983-11-18 Radiotechnique Compelec METHOD FOR CONNECTING A SEMICONDUCTOR TO ELEMENTS OF A SUPPORT, PARTICULARLY A PORTABLE CARD
US4747211A (en) * 1987-02-09 1988-05-31 Sheldahl, Inc. Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films
IT1224236B (en) * 1988-05-03 1990-09-26 Cisel Spa ELECTRIC CIRCUIT, FOR ELECTRONIC MACHINES, SERIGRAPHICALLY PRINTED ON POLYESTER FILM, HAVING MULTILAYER STRUCTURE
KR100339767B1 (en) * 1993-12-09 2002-11-30 메소드 일렉트로닉스 인코포레이티드 Electrical connector for electric signal transmission and its manufacturing method
IT1396077B1 (en) * 2009-10-16 2012-11-09 Automotive Lighting Italia Spa LIGHTING DEVICE FOR VEHICLES, IN PARTICULAR VEHICLES, USING LED DIODES
DE102010040867A1 (en) * 2010-09-16 2012-03-22 Robert Bosch Gmbh Electronic component with improved line structure
US20220007520A1 (en) * 2018-10-25 2022-01-06 Jabil Inc. Printing of multilayer circuits on graphics
CN118039460B (en) * 2024-04-15 2024-06-28 绵阳新能智造科技有限公司 Method for thickening silicon wafer

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4876059A (en) * 1972-01-14 1973-10-13
GB1565207A (en) * 1975-09-05 1980-04-16 Sinclair Radionics Printed circuits
DE2724399A1 (en) * 1977-05-28 1978-11-30 Martin Marietta Corp Multilayer circuit board with integral flexible appendages - uses array of flexible circuit layers bonded between rigid layers having suitable electrical connections
DE2831984A1 (en) * 1977-07-21 1979-02-01 Sharp Kk ELECTRICAL CONNECTION BETWEEN TWO ELECTRICAL CIRCUITS APPLIED TO SEPARATE CARRIERS
FR2402379A1 (en) * 1977-08-31 1979-03-30 Cayrol Pierre Henri IMPROVEMENTS TO PRINTED CIRCUITS

Also Published As

Publication number Publication date
WO1982000938A1 (en) 1982-03-18
EP0059206B1 (en) 1985-07-31
CA1171549A (en) 1984-07-24
IT8123851A0 (en) 1981-09-09
JPS57501353A (en) 1982-07-29
FR2490059B1 (en) 1984-07-27
IT1138586B (en) 1986-09-17
BE890272A (en) 1982-03-08
NO821481L (en) 1982-05-05
FR2490059A1 (en) 1982-03-12
ES8302403A1 (en) 1983-01-01
AU7537981A (en) 1982-04-08
EP0059206A1 (en) 1982-09-08
ES505299A0 (en) 1983-01-01

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