DK151459C - Fremgangsmaade til overtraekning af en metalgenstand i et kantomraade - Google Patents
Fremgangsmaade til overtraekning af en metalgenstand i et kantomraadeInfo
- Publication number
- DK151459C DK151459C DK515479A DK515479A DK151459C DK 151459 C DK151459 C DK 151459C DK 515479 A DK515479 A DK 515479A DK 515479 A DK515479 A DK 515479A DK 151459 C DK151459 C DK 151459C
- Authority
- DK
- Denmark
- Prior art keywords
- covering
- procedure
- metal object
- office area
- office
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09581—Applying an insulating coating on the walls of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1438—Treating holes after another process, e.g. coating holes after coating the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
- ing And Chemical Polishing (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE7812499A SE435343B (sv) | 1978-12-05 | 1978-12-05 | Forfarande vid beleggning vid skarpa kanter pa metallforemal |
SE7812499 | 1978-12-05 |
Publications (3)
Publication Number | Publication Date |
---|---|
DK515479A DK515479A (da) | 1980-06-06 |
DK151459B DK151459B (da) | 1987-12-07 |
DK151459C true DK151459C (da) | 1988-05-30 |
Family
ID=20336533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK515479A DK151459C (da) | 1978-12-05 | 1979-12-04 | Fremgangsmaade til overtraekning af en metalgenstand i et kantomraade |
Country Status (14)
Country | Link |
---|---|
US (1) | US4321290A (da) |
JP (1) | JPS6014627B2 (da) |
AT (1) | AT370012B (da) |
AU (1) | AU525331B2 (da) |
BE (1) | BE880447A (da) |
CA (1) | CA1145207A (da) |
CH (1) | CH645042A5 (da) |
DE (1) | DE2948940C2 (da) |
DK (1) | DK151459C (da) |
FR (1) | FR2443519A1 (da) |
GB (1) | GB2040186B (da) |
IT (1) | IT1119588B (da) |
NL (1) | NL7908794A (da) |
SE (1) | SE435343B (da) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5763294A (en) * | 1980-10-06 | 1982-04-16 | Fuji Photo Film Co Ltd | Photosensitive printing plate for lithography |
JPS59102237U (ja) * | 1982-12-25 | 1984-07-10 | 筒井 将裕 | 端面を防蝕加工した塩ビ鋼板 |
US4601916A (en) * | 1984-07-18 | 1986-07-22 | Kollmorgen Technologies Corporation | Process for bonding metals to electrophoretically deposited resin coatings |
DE3517796A1 (de) * | 1985-05-17 | 1986-11-20 | Hoechst Ag, 6230 Frankfurt | Verfahren zur herstellung von elektrisch isolierendem basismaterial fuer die fertigung von durchkontaktierten leiterplatten |
US4714646A (en) * | 1986-03-24 | 1987-12-22 | International Business Machines Corporation | Electrophoretic insulation of metal circuit board core |
US5422167A (en) * | 1993-09-17 | 1995-06-06 | Infosight Corporation | High temperature-resistant, thermally-printable label for attachment to hot metal stock and method thereof |
US5590460A (en) | 1994-07-19 | 1997-01-07 | Tessera, Inc. | Method of making multilayer circuit |
US5714234A (en) * | 1996-06-10 | 1998-02-03 | Infosight Corporation | Identification tag with preform attachment |
US6423907B1 (en) | 1998-02-09 | 2002-07-23 | Tessera, Inc. | Components with releasable leads |
US6492201B1 (en) | 1998-07-10 | 2002-12-10 | Tessera, Inc. | Forming microelectronic connection components by electrophoretic deposition |
US6951707B2 (en) * | 2001-03-08 | 2005-10-04 | Ppg Industries Ohio, Inc. | Process for creating vias for circuit assemblies |
US7000313B2 (en) * | 2001-03-08 | 2006-02-21 | Ppg Industries Ohio, Inc. | Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
US6713587B2 (en) | 2001-03-08 | 2004-03-30 | Ppg Industries Ohio, Inc. | Electrodepositable dielectric coating compositions and methods related thereto |
US6588095B2 (en) | 2001-04-27 | 2003-07-08 | Hewlett-Packard Development Company, Lp. | Method of processing a device by electrophoresis coating |
JP2005531160A (ja) * | 2002-06-27 | 2005-10-13 | ピーピージー インダストリーズ オハイオ, インコーポレイテッド | 窪んだかまたは広がったブレイクアウェイタブを有する単層または多層のプリント回路基板およびその製造方法 |
US20060213685A1 (en) * | 2002-06-27 | 2006-09-28 | Wang Alan E | Single or multi-layer printed circuit board with improved edge via design |
US8211622B2 (en) * | 2005-05-19 | 2012-07-03 | Hydro Aluminium Deutschland Gmbh | Conditioning of a litho strip |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US813618A (en) * | 1905-07-10 | 1906-02-27 | Arlington Company | Coated strip and method of making the same. |
US3218187A (en) * | 1962-04-16 | 1965-11-16 | Anaconda Wire & Cable Co | Coating method |
DE1764612C3 (de) * | 1967-07-04 | 1975-01-23 | Fuji Shashin Film K.K., Ashigara, Kanagawa (Japan) | Verfahren zur Herstellung eines magnetischen Aufzeichnungsmaterials |
GB1144844A (en) * | 1967-08-03 | 1969-03-12 | Pyrene Co Ltd | Coating of metals |
US3682785A (en) * | 1971-03-30 | 1972-08-08 | Rca Corp | Process for forming an isolated circuit pattern on a conductive substrate |
-
1978
- 1978-12-05 SE SE7812499A patent/SE435343B/sv not_active IP Right Cessation
-
1979
- 1979-11-29 CA CA000340850A patent/CA1145207A/en not_active Expired
- 1979-12-03 US US06/099,754 patent/US4321290A/en not_active Expired - Lifetime
- 1979-12-03 FR FR7929634A patent/FR2443519A1/fr active Granted
- 1979-12-04 AU AU53422/79A patent/AU525331B2/en not_active Ceased
- 1979-12-04 DK DK515479A patent/DK151459C/da not_active IP Right Cessation
- 1979-12-04 IT IT69336/79A patent/IT1119588B/it active
- 1979-12-05 DE DE2948940A patent/DE2948940C2/de not_active Expired
- 1979-12-05 NL NL7908794A patent/NL7908794A/nl not_active Application Discontinuation
- 1979-12-05 BE BE0/198436A patent/BE880447A/fr not_active IP Right Cessation
- 1979-12-05 GB GB7942020A patent/GB2040186B/en not_active Expired
- 1979-12-05 CH CH1080679A patent/CH645042A5/de not_active IP Right Cessation
- 1979-12-05 JP JP54156951A patent/JPS6014627B2/ja not_active Expired
- 1979-12-05 AT AT0771079A patent/AT370012B/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
FR2443519B1 (da) | 1984-01-13 |
SE435343B (sv) | 1984-09-24 |
DK515479A (da) | 1980-06-06 |
DK151459B (da) | 1987-12-07 |
JPS55116469A (en) | 1980-09-08 |
BE880447A (fr) | 1980-04-01 |
DE2948940C2 (de) | 1986-02-27 |
SE7812499L (sv) | 1980-06-06 |
GB2040186A (en) | 1980-08-28 |
ATA771079A (de) | 1982-07-15 |
DE2948940A1 (de) | 1980-06-19 |
GB2040186B (en) | 1983-01-26 |
AU5342279A (en) | 1980-06-12 |
IT1119588B (it) | 1986-03-10 |
FR2443519A1 (fr) | 1980-07-04 |
CA1145207A (en) | 1983-04-26 |
IT7969336A0 (it) | 1979-12-04 |
AU525331B2 (en) | 1982-10-28 |
AT370012B (de) | 1983-02-25 |
US4321290A (en) | 1982-03-23 |
JPS6014627B2 (ja) | 1985-04-15 |
NL7908794A (nl) | 1980-06-09 |
CH645042A5 (de) | 1984-09-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PBP | Patent lapsed |