DK148919C - Pulverformig stamblanding til fremstilling af en sensibiliseringsoploesning - Google Patents

Pulverformig stamblanding til fremstilling af en sensibiliseringsoploesning

Info

Publication number
DK148919C
DK148919C DK316171A DK316171A DK148919C DK 148919 C DK148919 C DK 148919C DK 316171 A DK316171 A DK 316171A DK 316171 A DK316171 A DK 316171A DK 148919 C DK148919 C DK 148919C
Authority
DK
Denmark
Prior art keywords
sensibilization
preparing
solution
stem mixture
powder stem
Prior art date
Application number
DK316171A
Other languages
Danish (da)
English (en)
Other versions
DK148919B (da
Inventor
Rudolph John Zeblisky
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of DK148919B publication Critical patent/DK148919B/da
Application granted granted Critical
Publication of DK148919C publication Critical patent/DK148919C/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
DK316171A 1970-06-29 1971-06-28 Pulverformig stamblanding til fremstilling af en sensibiliseringsoploesning DK148919C (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5091870A 1970-06-29 1970-06-29
US5091870 1970-06-29

Publications (2)

Publication Number Publication Date
DK148919B DK148919B (da) 1985-11-18
DK148919C true DK148919C (da) 1986-07-14

Family

ID=21968302

Family Applications (1)

Application Number Title Priority Date Filing Date
DK316171A DK148919C (da) 1970-06-29 1971-06-28 Pulverformig stamblanding til fremstilling af en sensibiliseringsoploesning

Country Status (12)

Country Link
US (1) US3672923A (de)
JP (1) JPS5515544B1 (de)
AT (2) AT314306B (de)
CA (1) CA934902A (de)
CH (1) CH571577A5 (de)
DK (1) DK148919C (de)
ES (1) ES392729A1 (de)
FR (1) FR2100042A5 (de)
GB (1) GB1349666A (de)
IT (1) IT954171B (de)
NL (1) NL169757C (de)
SE (1) SE427190B (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3874882A (en) * 1972-02-09 1975-04-01 Shipley Co Catalyst solution for electroless deposition of metal on substrate
US3960573A (en) * 1972-08-07 1976-06-01 Photocircuits Division Of Kollmorgan Corporation Novel precious metal sensitizing solutions
US4187198A (en) * 1972-08-07 1980-02-05 Kollmorgen Technologies Corp. Novel precious metal sensitizing solutions
US3841881A (en) * 1972-09-13 1974-10-15 Rca Corp Method for electroless deposition of metal using improved colloidal catalyzing solution
US3917486A (en) * 1973-07-24 1975-11-04 Kollmorgen Photocircuits Immersion tin bath composition and process for using same
US4027055A (en) * 1973-07-24 1977-05-31 Photocircuits Division Of Kollmorgan Corporation Process of tin plating by immersion
CA1021761A (en) * 1973-08-01 1977-11-29 Kollmorgen Corporation Sensitizers for electroless metal deposition
US3961109A (en) * 1973-08-01 1976-06-01 Photocircuits Division Of Kollmorgen Corporation Sensitizers and process for electroless metal deposition
US4321285A (en) * 1974-10-04 1982-03-23 Surface Technology, Inc. Electroless plating
US3993848A (en) * 1975-02-18 1976-11-23 Surface Technology, Inc. Catalytic primer
US4212768A (en) * 1975-05-05 1980-07-15 Jameson Melvin N Electroless plating of nonconductive substrates
US4061588A (en) * 1975-09-30 1977-12-06 Shipley Company Inc. Catalyst composition and method of preparation
US4020009A (en) * 1975-09-30 1977-04-26 Shipley Company, Inc. Catalyst composition and method of preparation
ZA764709B (en) * 1976-01-26 1978-02-22 Borg Warner Catalytically active composition for electroless plating
ZA77897B (en) * 1976-04-13 1977-12-28 Kollmorgen Corp Liquid seeders and catalyzation processes for electroless metal deposition
US4082899A (en) * 1976-09-07 1978-04-04 Nathan Feldstein Method of applying catalysts for electroless deposition and article
ZA774561B (en) * 1976-09-20 1978-06-28 Kollmorgen Tech Corp Preparation of solid precious metal sensitizing compositions
JPS58189365A (ja) * 1982-04-28 1983-11-05 Okuno Seiyaku Kogyo Kk 化学メッキ用アンダーコート組成物
US4762560A (en) * 1982-09-27 1988-08-09 Learonal, Inc. Copper colloid and method of activating insulating surfaces for subsequent electroplating
US4681630A (en) * 1982-09-27 1987-07-21 Learonal, Inc. Method of making copper colloid for activating insulating surfaces
SE454250B (sv) * 1984-09-24 1988-04-18 Asea Ab Industrirobot med linjera drivanordningar
US4717421A (en) * 1986-04-28 1988-01-05 Mcgean-Rohco, Inc. Solid tin-palladium catalyst for electroless deposition incorporating stannous salts of organic acids
DE19524601C1 (de) * 1995-07-06 1996-03-21 Deutsche Automobilgesellsch Verfahren zum Aktivieren von Kunststoffoberflächen auf der Basis von Pd/Sn mit photometrischer Reifungskontrolle
JP3689096B2 (ja) * 2002-10-02 2005-08-31 学校法人神奈川大学 薄膜の形成方法
US9765251B2 (en) 2012-12-18 2017-09-19 University Of South Florida Encapsulation of thermal energy storage media

Also Published As

Publication number Publication date
IT954171B (it) 1973-08-30
ATA643273A (de) 1975-02-15
CA934902A (en) 1973-10-09
JPS5515544B1 (de) 1980-04-24
DE2132863B2 (de) 1974-02-28
FR2100042A5 (de) 1972-03-17
AT326443B (de) 1975-12-10
SE427190B (sv) 1983-03-14
NL169757C (nl) 1982-08-16
US3672923A (en) 1972-06-27
DK148919B (da) 1985-11-18
AT314306B (de) 1974-03-25
NL169757B (nl) 1982-03-16
CH571577A5 (de) 1976-01-15
DE2132863A1 (de) 1972-01-05
NL7109004A (de) 1971-12-31
GB1349666A (en) 1974-04-10
ES392729A1 (es) 1973-07-16

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