DK1220314T3 - The power semiconductor module - Google Patents

The power semiconductor module

Info

Publication number
DK1220314T3
DK1220314T3 DK01129785T DK01129785T DK1220314T3 DK 1220314 T3 DK1220314 T3 DK 1220314T3 DK 01129785 T DK01129785 T DK 01129785T DK 01129785 T DK01129785 T DK 01129785T DK 1220314 T3 DK1220314 T3 DK 1220314T3
Authority
DK
Denmark
Prior art keywords
sandwich
power semiconductor
semiconductor module
centralized
ground plate
Prior art date
Application number
DK01129785T
Other languages
Danish (da)
Inventor
Christian Kroneder
Original Assignee
Semikron Elektronik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik Gmbh filed Critical Semikron Elektronik Gmbh
Application granted granted Critical
Publication of DK1220314T3 publication Critical patent/DK1220314T3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Bipolar Transistors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A power semiconductor module consists of a ground plate, at least one electrical connecting element separated from the ground plate by a first electrically isolating substrate and at least one overlying sandwich composed of a semiconductor element (11) sandwiched between two flat metal bodies (10, 12), preferably made of molybdenum. At least one pressure element and at least a second electrical connecting element and a housing are also included. <??>The sandwich is centralized on the electrical connection element using a centralizing frame (9) preferably composed of non-conducting plastic so that the second flat metal body (10) is secured against falling out using lugs. The semiconductor element is held by a groove which runs central and parallel to the surface of the centralizing frame (9). <??>The centralizing frame ensures that all the components of the sandwich are centralized in a pressure-free manner.
DK01129785T 2000-12-28 2001-12-14 The power semiconductor module DK1220314T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10065495A DE10065495C2 (en) 2000-12-28 2000-12-28 The power semiconductor module

Publications (1)

Publication Number Publication Date
DK1220314T3 true DK1220314T3 (en) 2008-01-28

Family

ID=7669289

Family Applications (1)

Application Number Title Priority Date Filing Date
DK01129785T DK1220314T3 (en) 2000-12-28 2001-12-14 The power semiconductor module

Country Status (7)

Country Link
EP (1) EP1220314B1 (en)
JP (1) JP4002758B2 (en)
CN (1) CN1259717C (en)
AT (1) ATE373874T1 (en)
DE (2) DE10065495C2 (en)
DK (1) DK1220314T3 (en)
ES (1) ES2292524T3 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL1651789T3 (en) 2003-07-29 2011-03-31 Voestalpine Stahl Gmbh Method for producing hardened parts from sheet steel
DE102004054063B3 (en) * 2004-11-05 2006-06-08 Danfoss Silicon Power Gmbh Process to produce a crack free connection between two components of different thermal coefficients of expansion such a power semiconductor and heat sink uses hot gas spray
DE102005053398B4 (en) * 2005-11-09 2008-12-24 Semikron Elektronik Gmbh & Co. Kg The power semiconductor module
EP1833088A1 (en) 2006-03-07 2007-09-12 Danfoss Silicon Power GmbH Method of forming a crack-free connection between a heat sink and a substrate plate
FR2900766B1 (en) * 2006-05-04 2008-09-26 Converteam Sas DEVICE AND METHOD FOR CENTERING A SEMICONDUCTOR ELEMENT FOR INSERTION IN A PRESSED STACK ASSEMBLY AND PRESSED STACK ASSEMBLY COMPRISING SUCH A DEVICE
DE102008033410B4 (en) 2008-07-16 2011-06-30 SEMIKRON Elektronik GmbH & Co. KG, 90431 Power electronic connection device with a power semiconductor component and manufacturing method for this purpose
DE102008058189A1 (en) 2008-11-20 2010-07-22 Semikron Elektronik Gmbh & Co. Kg Moisture-proof power semiconductor module with centering device
DE102009022660B3 (en) 2009-05-26 2010-09-16 Semikron Elektronik Gmbh & Co. Kg Attachment of a component to a substrate and / or a connection element to the component and / or to the substrate by pressure sintering
DE102009034138B4 (en) 2009-07-22 2011-06-01 Semikron Elektronik Gmbh & Co. Kg Power semiconductor module with a sandwich with a power semiconductor device
WO2014184061A1 (en) * 2013-05-13 2014-11-20 Abb Technology Ag Spacer system for a semiconductor switching device
CN110383463B (en) 2017-01-17 2023-05-02 日立能源瑞士股份公司 Semiconductor switching device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CS166520B1 (en) * 1973-11-19 1976-02-27
DE3308661A1 (en) * 1983-03-11 1984-09-20 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg SEMICONDUCTOR ELEMENT
DE3421672A1 (en) * 1984-06-09 1985-12-12 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg INTERCHANGEABLE RESISTANT, SWITCHABLE SEMICONDUCTOR COMPONENT
JP3031171B2 (en) * 1994-07-27 2000-04-10 株式会社日立製作所 Semiconductor device, package structure thereof, and power conversion device
DE19627426A1 (en) * 1996-07-08 1998-01-15 Asea Brown Boveri Light-triggered power thyristor using free-floating technology
DE19651632C2 (en) * 1996-12-12 2000-12-14 Semikron Elektronik Gmbh Power semiconductor module

Also Published As

Publication number Publication date
EP1220314A2 (en) 2002-07-03
CN1259717C (en) 2006-06-14
JP2002289630A (en) 2002-10-04
DE50113028D1 (en) 2007-10-31
DE10065495C2 (en) 2002-11-14
CN1362738A (en) 2002-08-07
EP1220314B1 (en) 2007-09-19
ES2292524T3 (en) 2008-03-16
DE10065495A1 (en) 2002-07-18
JP4002758B2 (en) 2007-11-07
ATE373874T1 (en) 2007-10-15
EP1220314A3 (en) 2005-03-30

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