DK117360B - Fremgangsmåde til fremstilling af en trykt kredsløbskomponent. - Google Patents
Fremgangsmåde til fremstilling af en trykt kredsløbskomponent.Info
- Publication number
- DK117360B DK117360B DK610863AA DK610863A DK117360B DK 117360 B DK117360 B DK 117360B DK 610863A A DK610863A A DK 610863AA DK 610863 A DK610863 A DK 610863A DK 117360 B DK117360 B DK 117360B
- Authority
- DK
- Denmark
- Prior art keywords
- manufacturing
- printed circuit
- circuit component
- component
- printed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K3/00—Details of windings
- H02K3/04—Windings characterised by the conductor shape, form or construction, e.g. with bar conductors
- H02K3/26—Windings characterised by the conductor shape, form or construction, e.g. with bar conductors consisting of printed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Windings For Motors And Generators (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US267982A US3264152A (en) | 1963-03-26 | 1963-03-26 | Method for fabricating electrical circuit components |
Publications (1)
Publication Number | Publication Date |
---|---|
DK117360B true DK117360B (da) | 1970-04-20 |
Family
ID=23020953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK610863AA DK117360B (da) | 1963-03-26 | 1963-12-30 | Fremgangsmåde til fremstilling af en trykt kredsløbskomponent. |
Country Status (7)
Country | Link |
---|---|
US (1) | US3264152A (da) |
AT (1) | AT256217B (da) |
CH (1) | CH424890A (da) |
DE (1) | DE1521770B2 (da) |
DK (1) | DK117360B (da) |
ES (1) | ES293970A1 (da) |
GB (1) | GB1000269A (da) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3396457A (en) * | 1965-12-02 | 1968-08-13 | Teletype Corp | Method of making an electrode structure |
US4085502A (en) * | 1977-04-12 | 1978-04-25 | Advanced Circuit Technology, Inc. | Jumper cable |
US4521262A (en) * | 1983-01-10 | 1985-06-04 | Pellegrino Peter P | Method for mass producing printed circuit boards |
US4631100A (en) * | 1983-01-10 | 1986-12-23 | Pellegrino Peter P | Method and apparatus for mass producing printed circuit boards |
JPS612552A (ja) * | 1984-06-15 | 1986-01-08 | 日本写真印刷株式会社 | フイルム状コイル及びその製造方法 |
US5064476A (en) * | 1990-09-17 | 1991-11-12 | Recine Sr Leonard J | Thermoelectric cooler and fabrication method |
DE69123692T2 (de) * | 1990-10-05 | 1997-07-24 | Toshiba Kawasaki Kk | Verfahren zur Herstellung einer keramischen Leiterplatte |
US6182359B1 (en) | 1997-01-31 | 2001-02-06 | Lear Automotive Dearborn, Inc. | Manufacturing process for printed circuits |
ES2125821B1 (es) * | 1997-01-31 | 1999-12-01 | Mecanismos Aux Ind | Un procedimiento de fabricacion de circuitos impresos. |
KR20010015829A (ko) * | 1997-12-05 | 2001-02-26 | 리어 오토모티브 디어본 , 인코포레이티드. | 인쇄회로와 제조방법 |
US6855738B2 (en) * | 2003-06-06 | 2005-02-15 | Dow Global Technologies Inc. | Nanoporous laminates |
JP6593274B2 (ja) * | 2016-08-03 | 2019-10-23 | 株式会社豊田自動織機 | 多層基板 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2974284A (en) * | 1961-03-07 | Rotors for electrical indicating instruments | ||
FR1260804A (fr) * | 1960-03-31 | 1961-05-12 | Electronique & Automatisme Sa | Procédé de réalisation de circuits imprimés |
US3177103A (en) * | 1961-09-18 | 1965-04-06 | Sauders Associates Inc | Two pass etching for fabricating printed circuitry |
US3131103A (en) * | 1962-02-26 | 1964-04-28 | Ney Co J M | Method of making circuit components |
-
1963
- 1963-03-26 US US267982A patent/US3264152A/en not_active Expired - Lifetime
- 1963-11-28 ES ES0293970A patent/ES293970A1/es not_active Expired
- 1963-12-17 DE DE19631521770 patent/DE1521770B2/de active Pending
- 1963-12-19 CH CH1568063A patent/CH424890A/de unknown
- 1963-12-19 AT AT1024263A patent/AT256217B/de active
- 1963-12-30 DK DK610863AA patent/DK117360B/da unknown
- 1963-12-30 GB GB51127/63A patent/GB1000269A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE1521770B2 (de) | 1971-12-30 |
CH424890A (de) | 1966-11-30 |
DE1521770A1 (de) | 1969-09-18 |
US3264152A (en) | 1966-08-02 |
GB1000269A (en) | 1965-08-04 |
ES293970A1 (es) | 1964-04-16 |
AT256217B (de) | 1967-08-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DK104246C (da) | Fremgangsmåde til fremstilling af trykte kredsløb på et isolerende underlag. | |
DK122554B (da) | Fremgangsmåde til fremstilling af et halvlederorgan. | |
DK135071B (da) | Fremgangsmåde til fremstilling af halvlederelementer. | |
CH428877A (de) | Eingeebnete, gedruckte Schaltung | |
DK117360B (da) | Fremgangsmåde til fremstilling af en trykt kredsløbskomponent. | |
DK116701B (da) | Fremgangsmåde til overtrækning af et metalunderlag. | |
DK121389B (da) | Fremgangsmåde til fremstilling af et galvanisk tørelement. | |
DK140869B (da) | Fremgangsmåde til fremstilling af et integreret monolitkredsløb. | |
DK106834C (da) | Fremgangsmåde til fremstilling af et kobberrør. | |
DK118780B (da) | Kobberbelagt plastplade til fremstilling af trykte kredsløb. | |
DK111654B (da) | Maskine til lodning af dåseemner. | |
DK119334B (da) | Fremgangsmåde til fremstilling af en elektrode. | |
DK117362B (da) | Fremgangsmåde til etablering af en loddet forbindelse på en trykt kredsløbsplade. | |
DK105423C (da) | Fremgangsmåde til fremstilling af trådnet. | |
DK116949B (da) | Fremgangsmåde til fremstilling af halvlederorganer. | |
DK118097B (da) | Fremgangsmåde til fremstilling af et vortefjernelsesmiddel. | |
DK116072B (da) | Fremgangsmåde til fremstilling af en højspændingsensretter. | |
DK112602B (da) | Fremgangsmåde til fremstilling af et strømgennemføringsorgan. | |
DK119932B (da) | Elektrisk komponent til trykte kredsløb. | |
DK114845B (da) | Fremgangsmåde til anbringelse af trykte kredsløb på lagdelte sammenpressede stofter. | |
DK123287B (da) | Fremgangsmåde til fremstilling af kasseformede pakninger med rektangulært tværsnit. | |
DK129420B (da) | Fremgangsmåde til fremstilling af glideflader på maskinelementer. | |
DK103189C (da) | Fremgangsmåde til fremstilling af en trykkeplade. | |
DK119933B (da) | Fremgangsmåde til fremstilling af halvlederkomponenter. | |
DK111054B (da) | Fremgangsmåde til fremstilling af et elektrisk impedansorgan. |