DK0915189T3 - Elektropletteringsapparat - Google Patents

Elektropletteringsapparat

Info

Publication number
DK0915189T3
DK0915189T3 DK98304973T DK98304973T DK0915189T3 DK 0915189 T3 DK0915189 T3 DK 0915189T3 DK 98304973 T DK98304973 T DK 98304973T DK 98304973 T DK98304973 T DK 98304973T DK 0915189 T3 DK0915189 T3 DK 0915189T3
Authority
DK
Denmark
Prior art keywords
electroplating
Prior art date
Application number
DK98304973T
Other languages
English (en)
Inventor
Paul Henington
Chun Pan Fung
Kwok Wah Li
Chi Chung Lee
Original Assignee
Process Automation Int Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB9721245.0A external-priority patent/GB9721245D0/en
Application filed by Process Automation Int Ltd filed Critical Process Automation Int Ltd
Application granted granted Critical
Publication of DK0915189T3 publication Critical patent/DK0915189T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
DK98304973T 1997-10-07 1998-06-24 Elektropletteringsapparat DK0915189T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9721245.0A GB9721245D0 (en) 1997-10-07 1997-10-07 An electroplating apparatus
GB9810764A GB2330151A (en) 1997-10-07 1998-05-19 An electroplating apparatus with movable diaphragms

Publications (1)

Publication Number Publication Date
DK0915189T3 true DK0915189T3 (da) 2004-01-26

Family

ID=26312381

Family Applications (1)

Application Number Title Priority Date Filing Date
DK98304973T DK0915189T3 (da) 1997-10-07 1998-06-24 Elektropletteringsapparat

Country Status (6)

Country Link
EP (1) EP0915189B1 (da)
CN (1) CN1126829C (da)
DE (1) DE69818779T2 (da)
DK (1) DK0915189T3 (da)
ES (1) ES2207796T3 (da)
GB (1) GB2330151A (da)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19932785C1 (de) * 1999-07-14 2000-11-16 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum präzisen Justieren von Abschirmmasken bei der elektrochemischen Behandlung von stabförmigem Behandlungsgut
CN102337578B (zh) * 2010-07-19 2014-04-02 北大方正集团有限公司 一种双面电镀槽、板件及电镀方法
ES2637799T3 (es) 2011-11-15 2017-10-17 Ashwin-Ushas Corporation, Inc. Dispositivo electrocrómico con polímeros complementarios
US9207515B2 (en) 2013-03-15 2015-12-08 Ashwin-Ushas Corporation, Inc. Variable-emittance electrochromic devices and methods of preparing the same
US9632059B2 (en) 2015-09-03 2017-04-25 Ashwin-Ushas Corporation, Inc. Potentiostat/galvanostat with digital interface
US9482880B1 (en) 2015-09-15 2016-11-01 Ashwin-Ushas Corporation, Inc. Electrochromic eyewear
US9945045B2 (en) 2015-12-02 2018-04-17 Ashwin-Ushas Corporation, Inc. Electrochemical deposition apparatus and methods of using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55145199A (en) * 1979-04-25 1980-11-12 Hitachi Ltd Shielding board for plating
DE3726571C1 (en) * 1987-08-10 1989-03-23 Siemens Ag Screening and positioning frame
US4879007B1 (en) * 1988-12-12 1999-05-25 Process Automation Int L Ltd Shield for plating bath
DE9007542U1 (de) * 1990-02-20 1992-06-25 Schering Ag Berlin Und Bergkamen, 1000 Berlin Vorrichtung zum Abblenden von Feldlinien in einer Galvanikanlage
DE4106733A1 (de) * 1991-03-02 1992-09-03 Schering Ag Vorrichtung zum abblenden von feldlinien in einer galvanikanlage (iii)
GB9325297D0 (en) * 1993-12-10 1994-02-16 Process Automation Internation Improvements in or relating to clamps and the use thereof
FR2745823B1 (fr) * 1996-03-07 1998-06-12 Toulouse Inst Nat Polytech Dispositif de production en continu de particules enrobees de metal electrolysable

Also Published As

Publication number Publication date
DE69818779T2 (de) 2004-08-19
EP0915189A2 (en) 1999-05-12
GB9810764D0 (en) 1998-07-15
CN1126829C (zh) 2003-11-05
EP0915189A3 (en) 2000-05-10
EP0915189B1 (en) 2003-10-08
DE69818779D1 (de) 2003-11-13
CN1213714A (zh) 1999-04-14
GB2330151A (en) 1999-04-14
ES2207796T3 (es) 2004-06-01

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