DE9412192U1 - Floating central attachment, especially for large sputter cathodes - Google Patents

Floating central attachment, especially for large sputter cathodes

Info

Publication number
DE9412192U1
DE9412192U1 DE9412192U DE9412192U DE9412192U1 DE 9412192 U1 DE9412192 U1 DE 9412192U1 DE 9412192 U DE9412192 U DE 9412192U DE 9412192 U DE9412192 U DE 9412192U DE 9412192 U1 DE9412192 U1 DE 9412192U1
Authority
DE
Germany
Prior art keywords
central attachment
sputter cathodes
floating central
large sputter
floating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9412192U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balzers und Leybold Deutschland Holding AG
Original Assignee
Leybold AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold AG filed Critical Leybold AG
Priority to DE9412192U priority Critical patent/DE9412192U1/en
Publication of DE9412192U1 publication Critical patent/DE9412192U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
DE9412192U 1994-07-28 1994-07-28 Floating central attachment, especially for large sputter cathodes Expired - Lifetime DE9412192U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9412192U DE9412192U1 (en) 1994-07-28 1994-07-28 Floating central attachment, especially for large sputter cathodes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9412192U DE9412192U1 (en) 1994-07-28 1994-07-28 Floating central attachment, especially for large sputter cathodes

Publications (1)

Publication Number Publication Date
DE9412192U1 true DE9412192U1 (en) 1994-09-29

Family

ID=6911713

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9412192U Expired - Lifetime DE9412192U1 (en) 1994-07-28 1994-07-28 Floating central attachment, especially for large sputter cathodes

Country Status (1)

Country Link
DE (1) DE9412192U1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19805471A1 (en) * 1998-02-11 1999-08-12 Leybold Materials Gmbh Method for repairing target base plates

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19805471A1 (en) * 1998-02-11 1999-08-12 Leybold Materials Gmbh Method for repairing target base plates

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