DE9313120U1 - Aperture to avoid the coating of device parts and / or substrate parts during the coating process in the vacuum chamber of a sputtering system - Google Patents

Aperture to avoid the coating of device parts and / or substrate parts during the coating process in the vacuum chamber of a sputtering system

Info

Publication number
DE9313120U1
DE9313120U1 DE19939313120 DE9313120U DE9313120U1 DE 9313120 U1 DE9313120 U1 DE 9313120U1 DE 19939313120 DE19939313120 DE 19939313120 DE 9313120 U DE9313120 U DE 9313120U DE 9313120 U1 DE9313120 U1 DE 9313120U1
Authority
DE
Germany
Prior art keywords
coating
aperture
avoid
vacuum chamber
sputtering system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE19939313120
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balzers und Leybold Deutschland Holding AG
Original Assignee
Leybold AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold AG filed Critical Leybold AG
Priority to DE19939313120 priority Critical patent/DE9313120U1/en
Publication of DE9313120U1 publication Critical patent/DE9313120U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3447—Collimators, shutters, apertures
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
DE19939313120 1993-09-01 1993-09-01 Aperture to avoid the coating of device parts and / or substrate parts during the coating process in the vacuum chamber of a sputtering system Expired - Lifetime DE9313120U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19939313120 DE9313120U1 (en) 1993-09-01 1993-09-01 Aperture to avoid the coating of device parts and / or substrate parts during the coating process in the vacuum chamber of a sputtering system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19939313120 DE9313120U1 (en) 1993-09-01 1993-09-01 Aperture to avoid the coating of device parts and / or substrate parts during the coating process in the vacuum chamber of a sputtering system

Publications (1)

Publication Number Publication Date
DE9313120U1 true DE9313120U1 (en) 1993-11-25

Family

ID=6897509

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19939313120 Expired - Lifetime DE9313120U1 (en) 1993-09-01 1993-09-01 Aperture to avoid the coating of device parts and / or substrate parts during the coating process in the vacuum chamber of a sputtering system

Country Status (1)

Country Link
DE (1) DE9313120U1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634064A (en) * 1986-06-24 1988-01-09 Mitsubishi Electric Corp Vacuum forming device for thin film
JPH02115367A (en) * 1988-10-25 1990-04-27 Nec Corp Sputtering device
US5074985A (en) * 1989-10-06 1991-12-24 Hitachi, Ltd. Film forming apparatus
US5135629A (en) * 1989-06-12 1992-08-04 Nippon Mining Co., Ltd. Thin film deposition system
US5202008A (en) * 1990-03-02 1993-04-13 Applied Materials, Inc. Method for preparing a shield to reduce particles in a physical vapor deposition chamber

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634064A (en) * 1986-06-24 1988-01-09 Mitsubishi Electric Corp Vacuum forming device for thin film
JPH02115367A (en) * 1988-10-25 1990-04-27 Nec Corp Sputtering device
US5135629A (en) * 1989-06-12 1992-08-04 Nippon Mining Co., Ltd. Thin film deposition system
US5074985A (en) * 1989-10-06 1991-12-24 Hitachi, Ltd. Film forming apparatus
US5202008A (en) * 1990-03-02 1993-04-13 Applied Materials, Inc. Method for preparing a shield to reduce particles in a physical vapor deposition chamber

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