DE9310299U1 - Multiple substrate - Google Patents
Multiple substrateInfo
- Publication number
- DE9310299U1 DE9310299U1 DE9310299U DE9310299U DE9310299U1 DE 9310299 U1 DE9310299 U1 DE 9310299U1 DE 9310299 U DE9310299 U DE 9310299U DE 9310299 U DE9310299 U DE 9310299U DE 9310299 U1 DE9310299 U1 DE 9310299U1
- Authority
- DE
- Germany
- Prior art keywords
- multiple substrate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9310299U DE9310299U1 (en) | 1993-06-16 | 1993-06-16 | Multiple substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4319944A DE4319944C2 (en) | 1993-06-03 | 1993-06-16 | Multiple substrate and process for its manufacture |
DE9310299U DE9310299U1 (en) | 1993-06-16 | 1993-06-16 | Multiple substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
DE9310299U1 true DE9310299U1 (en) | 1994-02-03 |
Family
ID=25926815
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE9310299U Expired - Lifetime DE9310299U1 (en) | 1993-06-16 | 1993-06-16 | Multiple substrate |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE9310299U1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3211666A1 (en) | 2016-02-26 | 2017-08-30 | Infineon Technologies AG | Multiple substrate |
EP3217428A1 (en) | 2016-03-07 | 2017-09-13 | Infineon Technologies AG | Substrate and multiple substrate comprising a plurality of same and method for the production of same |
EP3361839A1 (en) | 2017-02-14 | 2018-08-15 | Infineon Technologies AG | Multiple substrate and method for its fabrication |
-
1993
- 1993-06-16 DE DE9310299U patent/DE9310299U1/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3211666A1 (en) | 2016-02-26 | 2017-08-30 | Infineon Technologies AG | Multiple substrate |
EP3217428A1 (en) | 2016-03-07 | 2017-09-13 | Infineon Technologies AG | Substrate and multiple substrate comprising a plurality of same and method for the production of same |
US10206279B2 (en) | 2016-03-07 | 2019-02-12 | Infineon Technologies Ag | Substrate and multiple substrate, and method for producing thereof |
EP3217428B1 (en) * | 2016-03-07 | 2022-09-07 | Infineon Technologies AG | Multiple substrate and method for the production of same |
EP3361839A1 (en) | 2017-02-14 | 2018-08-15 | Infineon Technologies AG | Multiple substrate and method for its fabrication |
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