DE708421C - Process for metallizing electrically stressed insulating materials - Google Patents

Process for metallizing electrically stressed insulating materials

Info

Publication number
DE708421C
DE708421C DES129444D DES0129444D DE708421C DE 708421 C DE708421 C DE 708421C DE S129444 D DES129444 D DE S129444D DE S0129444 D DES0129444 D DE S0129444D DE 708421 C DE708421 C DE 708421C
Authority
DE
Germany
Prior art keywords
insulating materials
electrically stressed
metal
metallizing electrically
metallizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DES129444D
Other languages
German (de)
Inventor
Dr-Ing Andreas Ebinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens and Halske AG
Siemens AG
Original Assignee
Siemens and Halske AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens and Halske AG, Siemens AG filed Critical Siemens and Halske AG
Priority to DES129444D priority Critical patent/DE708421C/en
Application granted granted Critical
Publication of DE708421C publication Critical patent/DE708421C/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • C23C14/024Deposition of sublayers, e.g. to promote adhesion of the coating
    • C23C14/025Metallic sublayers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Description

Verfahren zum Metallisieren von elektrisch beanspruchten Isolierstoffen Die Erfindung bezieht sich auf ein Verfahren zur Herstellung von Metallschichten auf elektrisch beanspruchten Isolierstoffen, insbesondere zur Herstellung leitender Beläge auf Kondensatordielektrika. .Process for metallizing electrically stressed insulating materials The invention relates to a method for producing metal layers on electrically stressed insulating materials, especially for the production of conductive ones Deposits on capacitor dielectrics. .

Unter den vielen Vorschlägen, die für die Herstellung solcher metallischer Überzüge gemacht wurden, ist auch angegeben, Metalle thermisch aufzudampfen und den Metallnebel auf den Isolierstoff niederzuschlagen oder die Metalle durch die Einwirkung .eines Hochspannungsfeldes zu zerstäuben. Diese beiden Verfahren haben je ihre Vor- und Nachteile; die bestimmend für die Wahl des gerade ,anzuwendenden Verfahrens sind. Unter anderem ist z. B. das Metallaufdampfver£ahren wegen der zur Verdampfung notwendigen Temperatur bei thermisch sehr unbeständigen Stoffen nicht anzuwenden, während das Kathodenzerstäubungsverfahren, 'das an sich mit geringeren Temperaturen arbeitet, verhältnismäßig unwirtschaftlich ist. Bei der Herstellung von hochwertigen elektrischen Kondensatoren ist es wegen der Einschlußfreiheit von Fremdstoffen zwischen Belag und Dielektrikum erforderlich, hochwertige Metallisierungsverfahren, zu denen auch die beiden genannten rerhneln, .anzuwenden.Among the many proposals that have been made for the manufacture of such metallic Coatings were made is also indicated to be thermally vapor deposited and metals to deposit the metal mist on the insulating material or the metals through the To atomize exposure to a high voltage field. These two procedures have each its advantages and disadvantages; the determining factor for the choice of the one to be used Procedural are. Among other things, z. B. the Metallaufdampfver £ ahren because of the Evaporation required temperature for thermally very unstable materials is not apply while the sputtering process, 'that in itself with lesser Temperatures works, is relatively uneconomical. In the preparation of of high quality electrical capacitors it is because of the freedom from inclusion of Foreign matter required between coating and dielectric, high-quality metallization process, to which the two mentioned are similar to. to apply.

Die Erfindung benutzt ebenfalls derartige Metallisierungsverfahren und schlägt vor, die auf den elektrisch beanspruchten Isolierstoff aufzubringende Metallschicht ,aus zwei Schichten durch thermisches Aufdampfen eines Metallles mit niedrigem Schmelzpunkt, wie z. B. Zink, 'und durch nachfolgende Bestäubung mittels Kathodenzerstäubung korrosionsfester Metalle, wie z. B. Nickel und Chrom, herzustellen.The invention also uses such metallization processes and suggests that to be applied to the electrically stressed insulating material Metal layer, made of two layers by thermal vapor deposition of a metal with low melting point, such as. B. zinc, 'and by subsequent pollination means Cathodic sputtering of corrosion-resistant metals, such as B. nickel and chromium to produce.

Dieses kombinierte Verfahren hat gegenüber dem einen oder dem anderen Verfahrensehr große Vorteile. Lediglich durch Aufdampfen hergestellte Schichten z. B. sind zwar wirtschaftlich aufzubringen, haften gut und bilden infolge der atomaren Struktur des Metallnebels einen dichten, zusammenhiingenden Überzug, jedoch kommen für die Bildung des Metallnebels wegen der notwendigen Temperatur hauptsiichlich solche Metalle in Frage, die nicht korrosionsfest sind und die keine große mechanische Widerstandsfähigkeit aufweisen. Das Aufdampfen einer zweiten, chemisch und mechanisch widerstandsfähigeren Schicht würde erhebliche Schwierigkeiten bereiten, da sich derartige Metalle gar nicht oder nur unter ganz bestimmten Voraussetzungen und besonderen Maßnahmen verdampfen lassen. Die Herstellung der Schicht selbst würde, abgesehen von der großen Heizleistung, durch die Wahl hochwertiger Metalle verteuert werden.This combined method has over one or the other Procedural great benefits. Manufactured solely by vapor deposition Layers z. B. are economical to apply, adhere well and form as a result the atomic structure of the metal mist creates a dense, cohesive coating, however, come for the formation of the metal mist because of the necessary temperature mainly those metals in question, which are not corrosion-resistant and which are not have great mechanical resistance. The evaporation of a second, chemically and mechanically more resistant layer would cause considerable difficulties prepare, since such metals are not at all or only under very specific conditions and take special measures to allow it to evaporate. The production of the layer itself would, apart from the large heating capacity, the choice of high-quality metals makes it more expensive will.

Das Kathodenzerstäubungsverfahren allein anzuwenden, um dadurch bei geringeren Temperaturen die für den guten Kontakt mit der Stromzuführung notwendigen korrosionsfesten und mechanisch widerstandsfähigen Metalle aufzubringen; ist äußerst unwirtschaftlich und ergibt, da die Schicht nicht aus atomaren Teilen, sondern aus ganzen Molekülverbänden aufgebaut wird, in dielektrischer Beziehung keine so guten Beläge.To use the sputtering process alone to thereby help lower temperatures necessary for good contact with the power supply apply corrosion-resistant and mechanically resistant metals; is extreme uneconomical and results because the layer is not made up of atomic parts, but from whole molecular assemblies is built up, not so good in dielectric relation Toppings.

Erst die aufeinanderfolgende Anwendung der beiden Verfahren, zweckmäßigerweise im gleichen Verdampfungsgefäß, gibt die Möglichkeit, Isolierstoffe, insbesondere Dielektrika, mit einer in jeder Beziehung günstigen Metallauflage zu versehen, wobei jeder, selbst der schärfsten Forderung in irgendeiner Dezieliung nachgekommen werden kann. Only the successive use of the two methods, expediently in the same evaporation vessel, gives the possibility of providing insulating materials, especially dielectrics, with a metal coating that is favorable in every respect, whereby each, even the most stringent requirement, can be met in any way.

Claims (1)

PATENTANSPRUCH: Verfahren zum 'Metallisieren von eIektrisch beanspruchten Isolierstoltcli, insbesondere zur Herstellung leitender Beläge auf Kondensatordielektrika, dadurch gekennzeichnet, daß die aus zwei Schichten bestehende Metallschicht durch thermisches Aufdampfen eines Metalls mit niedrigem Schmelzpunkt und nachfolgende Bestäubung mittels Kathodenzerstäubung eines korrosionsfesten Metalls hergestellt wird.PATENT CLAIM: Process for 'metallizing electrically stressed Isolierstoltcli, especially for the production of conductive coatings on capacitor dielectrics, characterized in that the two-layer metal layer through thermal vapor deposition of a low melting point metal and subsequent Dusting produced by cathodic sputtering of a corrosion-resistant metal will.
DES129444D 1937-11-07 1937-11-07 Process for metallizing electrically stressed insulating materials Expired DE708421C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DES129444D DE708421C (en) 1937-11-07 1937-11-07 Process for metallizing electrically stressed insulating materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES129444D DE708421C (en) 1937-11-07 1937-11-07 Process for metallizing electrically stressed insulating materials

Publications (1)

Publication Number Publication Date
DE708421C true DE708421C (en) 1941-07-21

Family

ID=7538134

Family Applications (1)

Application Number Title Priority Date Filing Date
DES129444D Expired DE708421C (en) 1937-11-07 1937-11-07 Process for metallizing electrically stressed insulating materials

Country Status (1)

Country Link
DE (1) DE708421C (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0073555A2 (en) * 1981-08-24 1983-03-09 Bolmet Incorporated Metallized capacitor with improved bilayer electrodes
FR2536423A1 (en) * 1982-11-19 1984-05-25 Thomson Csf Process for the deposition of electrodes on a substrate made of organic material and devices obtained by this process.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0073555A2 (en) * 1981-08-24 1983-03-09 Bolmet Incorporated Metallized capacitor with improved bilayer electrodes
EP0073555A3 (en) * 1981-08-24 1984-10-17 General Electric Company Metallized capacitor with improved bilayer electrodes
FR2536423A1 (en) * 1982-11-19 1984-05-25 Thomson Csf Process for the deposition of electrodes on a substrate made of organic material and devices obtained by this process.

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