DE708421C - Process for metallizing electrically stressed insulating materials - Google Patents
Process for metallizing electrically stressed insulating materialsInfo
- Publication number
- DE708421C DE708421C DES129444D DES0129444D DE708421C DE 708421 C DE708421 C DE 708421C DE S129444 D DES129444 D DE S129444D DE S0129444 D DES0129444 D DE S0129444D DE 708421 C DE708421 C DE 708421C
- Authority
- DE
- Germany
- Prior art keywords
- insulating materials
- electrically stressed
- metal
- metallizing electrically
- metallizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 10
- 239000011810 insulating material Substances 0.000 title description 6
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 238000010410 dusting Methods 0.000 claims 1
- 150000002739 metals Chemical class 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000003595 mist Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000010152 pollination Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
- C23C14/025—Metallic sublayers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Description
Verfahren zum Metallisieren von elektrisch beanspruchten Isolierstoffen Die Erfindung bezieht sich auf ein Verfahren zur Herstellung von Metallschichten auf elektrisch beanspruchten Isolierstoffen, insbesondere zur Herstellung leitender Beläge auf Kondensatordielektrika. .Process for metallizing electrically stressed insulating materials The invention relates to a method for producing metal layers on electrically stressed insulating materials, especially for the production of conductive ones Deposits on capacitor dielectrics. .
Unter den vielen Vorschlägen, die für die Herstellung solcher metallischer Überzüge gemacht wurden, ist auch angegeben, Metalle thermisch aufzudampfen und den Metallnebel auf den Isolierstoff niederzuschlagen oder die Metalle durch die Einwirkung .eines Hochspannungsfeldes zu zerstäuben. Diese beiden Verfahren haben je ihre Vor- und Nachteile; die bestimmend für die Wahl des gerade ,anzuwendenden Verfahrens sind. Unter anderem ist z. B. das Metallaufdampfver£ahren wegen der zur Verdampfung notwendigen Temperatur bei thermisch sehr unbeständigen Stoffen nicht anzuwenden, während das Kathodenzerstäubungsverfahren, 'das an sich mit geringeren Temperaturen arbeitet, verhältnismäßig unwirtschaftlich ist. Bei der Herstellung von hochwertigen elektrischen Kondensatoren ist es wegen der Einschlußfreiheit von Fremdstoffen zwischen Belag und Dielektrikum erforderlich, hochwertige Metallisierungsverfahren, zu denen auch die beiden genannten rerhneln, .anzuwenden.Among the many proposals that have been made for the manufacture of such metallic Coatings were made is also indicated to be thermally vapor deposited and metals to deposit the metal mist on the insulating material or the metals through the To atomize exposure to a high voltage field. These two procedures have each its advantages and disadvantages; the determining factor for the choice of the one to be used Procedural are. Among other things, z. B. the Metallaufdampfver £ ahren because of the Evaporation required temperature for thermally very unstable materials is not apply while the sputtering process, 'that in itself with lesser Temperatures works, is relatively uneconomical. In the preparation of of high quality electrical capacitors it is because of the freedom from inclusion of Foreign matter required between coating and dielectric, high-quality metallization process, to which the two mentioned are similar to. to apply.
Die Erfindung benutzt ebenfalls derartige Metallisierungsverfahren und schlägt vor, die auf den elektrisch beanspruchten Isolierstoff aufzubringende Metallschicht ,aus zwei Schichten durch thermisches Aufdampfen eines Metallles mit niedrigem Schmelzpunkt, wie z. B. Zink, 'und durch nachfolgende Bestäubung mittels Kathodenzerstäubung korrosionsfester Metalle, wie z. B. Nickel und Chrom, herzustellen.The invention also uses such metallization processes and suggests that to be applied to the electrically stressed insulating material Metal layer, made of two layers by thermal vapor deposition of a metal with low melting point, such as. B. zinc, 'and by subsequent pollination means Cathodic sputtering of corrosion-resistant metals, such as B. nickel and chromium to produce.
Dieses kombinierte Verfahren hat gegenüber dem einen oder dem anderen Verfahrensehr große Vorteile. Lediglich durch Aufdampfen hergestellte Schichten z. B. sind zwar wirtschaftlich aufzubringen, haften gut und bilden infolge der atomaren Struktur des Metallnebels einen dichten, zusammenhiingenden Überzug, jedoch kommen für die Bildung des Metallnebels wegen der notwendigen Temperatur hauptsiichlich solche Metalle in Frage, die nicht korrosionsfest sind und die keine große mechanische Widerstandsfähigkeit aufweisen. Das Aufdampfen einer zweiten, chemisch und mechanisch widerstandsfähigeren Schicht würde erhebliche Schwierigkeiten bereiten, da sich derartige Metalle gar nicht oder nur unter ganz bestimmten Voraussetzungen und besonderen Maßnahmen verdampfen lassen. Die Herstellung der Schicht selbst würde, abgesehen von der großen Heizleistung, durch die Wahl hochwertiger Metalle verteuert werden.This combined method has over one or the other Procedural great benefits. Manufactured solely by vapor deposition Layers z. B. are economical to apply, adhere well and form as a result the atomic structure of the metal mist creates a dense, cohesive coating, however, come for the formation of the metal mist because of the necessary temperature mainly those metals in question, which are not corrosion-resistant and which are not have great mechanical resistance. The evaporation of a second, chemically and mechanically more resistant layer would cause considerable difficulties prepare, since such metals are not at all or only under very specific conditions and take special measures to allow it to evaporate. The production of the layer itself would, apart from the large heating capacity, the choice of high-quality metals makes it more expensive will.
Das Kathodenzerstäubungsverfahren allein anzuwenden, um dadurch bei geringeren Temperaturen die für den guten Kontakt mit der Stromzuführung notwendigen korrosionsfesten und mechanisch widerstandsfähigen Metalle aufzubringen; ist äußerst unwirtschaftlich und ergibt, da die Schicht nicht aus atomaren Teilen, sondern aus ganzen Molekülverbänden aufgebaut wird, in dielektrischer Beziehung keine so guten Beläge.To use the sputtering process alone to thereby help lower temperatures necessary for good contact with the power supply apply corrosion-resistant and mechanically resistant metals; is extreme uneconomical and results because the layer is not made up of atomic parts, but from whole molecular assemblies is built up, not so good in dielectric relation Toppings.
Erst die aufeinanderfolgende Anwendung der beiden Verfahren, zweckmäßigerweise
im gleichen Verdampfungsgefäß, gibt die Möglichkeit, Isolierstoffe, insbesondere
Dielektrika, mit einer in jeder Beziehung günstigen Metallauflage zu versehen, wobei
jeder, selbst der schärfsten Forderung in irgendeiner Dezieliung nachgekommen werden
kann.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES129444D DE708421C (en) | 1937-11-07 | 1937-11-07 | Process for metallizing electrically stressed insulating materials |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES129444D DE708421C (en) | 1937-11-07 | 1937-11-07 | Process for metallizing electrically stressed insulating materials |
Publications (1)
Publication Number | Publication Date |
---|---|
DE708421C true DE708421C (en) | 1941-07-21 |
Family
ID=7538134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DES129444D Expired DE708421C (en) | 1937-11-07 | 1937-11-07 | Process for metallizing electrically stressed insulating materials |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE708421C (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0073555A2 (en) * | 1981-08-24 | 1983-03-09 | Bolmet Incorporated | Metallized capacitor with improved bilayer electrodes |
FR2536423A1 (en) * | 1982-11-19 | 1984-05-25 | Thomson Csf | Process for the deposition of electrodes on a substrate made of organic material and devices obtained by this process. |
-
1937
- 1937-11-07 DE DES129444D patent/DE708421C/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0073555A2 (en) * | 1981-08-24 | 1983-03-09 | Bolmet Incorporated | Metallized capacitor with improved bilayer electrodes |
EP0073555A3 (en) * | 1981-08-24 | 1984-10-17 | General Electric Company | Metallized capacitor with improved bilayer electrodes |
FR2536423A1 (en) * | 1982-11-19 | 1984-05-25 | Thomson Csf | Process for the deposition of electrodes on a substrate made of organic material and devices obtained by this process. |
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