DE69939877D1 - Mechanische strukturierung einer bauelementschicht - Google Patents

Mechanische strukturierung einer bauelementschicht

Info

Publication number
DE69939877D1
DE69939877D1 DE69939877T DE69939877T DE69939877D1 DE 69939877 D1 DE69939877 D1 DE 69939877D1 DE 69939877 T DE69939877 T DE 69939877T DE 69939877 T DE69939877 T DE 69939877T DE 69939877 D1 DE69939877 D1 DE 69939877D1
Authority
DE
Germany
Prior art keywords
device layer
construction layer
mechanical structuring
stamp
structuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69939877T
Other languages
English (en)
Inventor
Ewald Karl Michael Guenther
Zhong Chen
Brian Cotterell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Agency for Science Technology and Research Singapore
Original Assignee
Osram Opto Semiconductors GmbH
Institute of Materials Research and Engineering
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH, Institute of Materials Research and Engineering filed Critical Osram Opto Semiconductors GmbH
Application granted granted Critical
Publication of DE69939877D1 publication Critical patent/DE69939877D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/03—Processes for manufacturing substrate-free structures
    • B81C2201/036—Hot embossing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/821—Patterning of a layer by embossing, e.g. stamping to form trenches in an insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Magnetic Heads (AREA)
  • Golf Clubs (AREA)
  • Braking Arrangements (AREA)
  • Laying Of Electric Cables Or Lines Outside (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE69939877T 1999-07-09 1999-07-09 Mechanische strukturierung einer bauelementschicht Expired - Lifetime DE69939877D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG1999/000074 WO2001004938A1 (en) 1999-07-09 1999-07-09 Mechanical patterning of a device layer

Publications (1)

Publication Number Publication Date
DE69939877D1 true DE69939877D1 (de) 2008-12-18

Family

ID=20430227

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69939877T Expired - Lifetime DE69939877D1 (de) 1999-07-09 1999-07-09 Mechanische strukturierung einer bauelementschicht

Country Status (11)

Country Link
US (1) US6797211B1 (de)
EP (1) EP1133789B1 (de)
JP (1) JP2003504821A (de)
KR (1) KR20010106470A (de)
CN (1) CN1191609C (de)
AT (1) ATE413362T1 (de)
AU (1) AU4951399A (de)
CA (1) CA2343227A1 (de)
DE (1) DE69939877D1 (de)
TW (1) TW529182B (de)
WO (1) WO2001004938A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1112674B1 (de) 1999-07-09 2009-09-09 Institute of Materials Research & Engineering Laminate für einkapselung von oled-vorrichtungen
WO2001004963A1 (en) 1999-07-09 2001-01-18 Osram Opto Semiconductors Gmbh & Co. Ohg Encapsulation of a device
US6949880B1 (en) 1999-12-17 2005-09-27 Osram Opto Semiconductors Gmbh Encapsulation for organic LED device
EP1242849B1 (de) 1999-12-17 2007-02-21 Osram Opto Semiconductors GmbH Verbesserte kapselung organischer led-vorrichtungen
JP2003523046A (ja) 1999-12-17 2003-07-29 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 有機ｌｅｄ装置
US7394153B2 (en) 1999-12-17 2008-07-01 Osram Opto Semiconductors Gmbh Encapsulation of electronic devices
US6987613B2 (en) * 2001-03-30 2006-01-17 Lumileds Lighting U.S., Llc Forming an optical element on the surface of a light emitting device for improved light extraction
US6936856B2 (en) 2002-01-15 2005-08-30 Osram Opto Semiconductors Gmbh Multi substrate organic light emitting devices
KR100827617B1 (ko) * 2002-02-22 2008-05-07 엘지디스플레이 주식회사 유기전계 발광소자 제조방법 및 이의 고분자 유기막 패턴 형성방법
KR100537722B1 (ko) * 2002-10-11 2005-12-20 강신일 미세형상 구조물의 연속 성형장치 및 방법 그리고 그 미세형상의 성형을 위한 스탬퍼 제작방법
FR2851346B1 (fr) * 2003-02-13 2005-07-01 Gabriel Pascal Joseph Simon Ecran interactif d'acquisition et de restitution d'informations graphiques saisies manuellement
DE10330456B9 (de) * 2003-07-05 2007-11-08 Erich Thallner Vorrichtung zum Erstellen einer Oberflächenstruktur auf einem Wafer
US7524920B2 (en) 2004-12-16 2009-04-28 Eastman Chemical Company Biaxially oriented copolyester film and laminates thereof
GB0523163D0 (en) * 2005-11-14 2005-12-21 Suisse Electronique Microtech Patterning of conductive layers with underlying compressible spacer layer or spacer layer stack
GB2432722A (en) * 2005-11-25 2007-05-30 Seiko Epson Corp Electrochemical cell and method of manufacture
GB2432721B (en) * 2005-11-25 2011-06-22 Seiko Epson Corp Electrochemical cell structure and method of fabrication
GB2432723B (en) * 2005-11-25 2010-12-08 Seiko Epson Corp Electrochemical cell and method of manufacture
US7667383B2 (en) 2006-02-15 2010-02-23 Osram Opto Semiconductors Gmbh Light source comprising a common substrate, a first led device and a second led device
KR101534848B1 (ko) * 2008-07-21 2015-07-27 엘지이노텍 주식회사 발광 다이오드 및 그 제조방법. 그리고 발광 소자 및 그발광 소자 제조방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4720432A (en) 1987-02-11 1988-01-19 Eastman Kodak Company Electroluminescent device with organic luminescent medium
JPH0580530A (ja) 1991-09-24 1993-04-02 Hitachi Ltd 薄膜パターン製造方法
DE69524247T2 (de) 1995-08-04 2002-08-08 Ibm Stempel für lithographie-verfahren
US5669303A (en) * 1996-03-04 1997-09-23 Motorola Apparatus and method for stamping a surface
JP3942715B2 (ja) * 1998-01-06 2007-07-11 パイオニア株式会社 有機ｅｌディスプレイパネル及びその製造方法

Also Published As

Publication number Publication date
CN1191609C (zh) 2005-03-02
US6797211B1 (en) 2004-09-28
CA2343227A1 (en) 2001-01-18
ATE413362T1 (de) 2008-11-15
KR20010106470A (ko) 2001-11-29
EP1133789B1 (de) 2008-11-05
WO2001004938A1 (en) 2001-01-18
JP2003504821A (ja) 2003-02-04
CN1317148A (zh) 2001-10-10
EP1133789A1 (de) 2001-09-19
TW529182B (en) 2003-04-21
AU4951399A (en) 2001-01-30

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH, S, SG

Owner name: OSRAM OPTO SEMICONDUCTORS GMBH, 93055 REGENSBU, DE

8328 Change in the person/name/address of the agent

Representative=s name: EPPING HERMANN FISCHER, PATENTANWALTSGESELLSCHAFT

8364 No opposition during term of opposition