DE69937949D1 - Verfahren und gerät zum abnehmen von clips von einem wafer und zum transportieren der clips zu einer aufnahmestation - Google Patents
Verfahren und gerät zum abnehmen von clips von einem wafer und zum transportieren der clips zu einer aufnahmestationInfo
- Publication number
- DE69937949D1 DE69937949D1 DE69937949T DE69937949T DE69937949D1 DE 69937949 D1 DE69937949 D1 DE 69937949D1 DE 69937949 T DE69937949 T DE 69937949T DE 69937949 T DE69937949 T DE 69937949T DE 69937949 D1 DE69937949 D1 DE 69937949D1
- Authority
- DE
- Germany
- Prior art keywords
- clips
- wafer
- transporting
- recording station
- station
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1105—Delaminating process responsive to feed or shape at delamination
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1906—Delaminating means responsive to feed or shape at delamination
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
- Y10T156/1983—Poking delaminating means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
- Y10T29/49819—Disassembling with conveying of work or disassembled work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
- Y10T29/49822—Disassembling by applying force
- Y10T29/49824—Disassembling by applying force to elastically deform work part or connector
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/025,564 US5976306A (en) | 1998-02-18 | 1998-02-18 | Method and apparatus for removing die from an expanded wafer and conveying die to a pickup location |
PCT/US1999/003385 WO1999042289A1 (en) | 1998-02-18 | 1999-02-17 | Method and apparatus for removing die from a wafer and conveying die to a pickup location |
US25564 | 2001-12-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69937949D1 true DE69937949D1 (de) | 2008-02-21 |
DE69937949T2 DE69937949T2 (de) | 2008-12-24 |
Family
ID=21826796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69937949T Expired - Lifetime DE69937949T2 (de) | 1998-02-18 | 1999-02-17 | Verfahren und gerät zum abnehmen von clips von einem wafer und zum transportieren der clips zu einer aufnahmestation |
Country Status (6)
Country | Link |
---|---|
US (1) | US5976306A (de) |
EP (1) | EP1064152B1 (de) |
JP (1) | JP4781529B2 (de) |
AU (1) | AU2769699A (de) |
DE (1) | DE69937949T2 (de) |
WO (1) | WO1999042289A1 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6157870A (en) * | 1997-02-18 | 2000-12-05 | Zevatech Trading Ag | Apparatus supplying components to a placement machine with splice sensor |
DE59711263D1 (de) | 1997-10-30 | 2004-03-04 | Esec Trading Sa | Verfahren und Einrichtung für die Justierung des Bondkopfs einer Maschine für das Bonden von Halbleiterchips auf ein Trägermaterial |
US6173750B1 (en) * | 1998-02-18 | 2001-01-16 | Hover-Davis, Inc. | Method and apparatus for removing die from a wafer and conveying die to a pickup location |
US6122561A (en) * | 1998-09-01 | 2000-09-19 | Ciena Corporation | Precision continuous surface guided optical module carrier and method of using same |
US6554128B1 (en) | 1999-10-07 | 2003-04-29 | Delaware Capital Formation, Inc. | Die shuttle conveyor and nest therefor |
AU2001279280A1 (en) * | 2000-07-07 | 2002-01-21 | Hover-Davis, Inc. | Component source interchange gantry |
US6773543B2 (en) * | 2002-05-07 | 2004-08-10 | Delaware Capital Formation, Inc. | Method and apparatus for the multiplexed acquisition of a bare die from a wafer |
US7023347B2 (en) * | 2002-08-02 | 2006-04-04 | Symbol Technologies, Inc. | Method and system for forming a die frame and for transferring dies therewith |
US7306695B2 (en) * | 2003-04-10 | 2007-12-11 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for picking up semiconductor chip |
WO2004112096A2 (en) * | 2003-06-12 | 2004-12-23 | Symbol Technologies, Inc. | Method and system for high volume transfer of dies to substrates |
JP2005045023A (ja) * | 2003-07-22 | 2005-02-17 | Toshiba Corp | 半導体装置の製造方法および半導体製造装置 |
US7207430B2 (en) * | 2004-10-25 | 2007-04-24 | Ui Holding Company | Vacuum gripper for handling small components |
NL1029207C2 (nl) * | 2005-06-07 | 2006-12-08 | Assembleon Nv | Componentpositioneringsinrichting alsmede een werkwijze voor het positioneren van een component. |
DE102005061680B3 (de) * | 2005-12-21 | 2007-09-13 | Mühlbauer Ag | Einrichtung und Verfahren zur gleichzeitigen Übertragung einer Mehrzahl von elektronischen Bauteilen |
JP2007297167A (ja) * | 2006-04-28 | 2007-11-15 | Toyota Motor Corp | マグネットコンベア |
DE102007048410B4 (de) | 2007-10-09 | 2009-07-30 | Siemens Ag | Zuführvorrichtung für Bauelemente zu einem Bestückautomaten zur Bestückung von Substraten mit den Bauelementen |
DE102007048413B3 (de) * | 2007-10-09 | 2009-04-16 | Siemens Ag | Zuführvorrichtung vor Bauelemente zu einem Bestückautomaten zur Bestückung von Substraten mit Bauelementen |
US7819239B2 (en) * | 2008-12-11 | 2010-10-26 | Schenson Co., Ltd. | Feeder for an auto mounting device |
US20110182701A1 (en) * | 2010-01-28 | 2011-07-28 | Ui Holding Co. | Method and apparatus for transferring die from a wafer |
CN105704998B (zh) * | 2014-11-27 | 2019-02-22 | 英业达科技有限公司 | 取件置放方法 |
CN104701227B (zh) * | 2015-03-27 | 2017-12-29 | 江苏艾科瑞思封装自动化设备有限公司 | 用于集成电路封装设备的料片进给机构 |
CH714090B1 (de) * | 2016-07-13 | 2022-07-15 | Universal Instruments Corp | Modulares Die-Handhabungssystem. |
US10529600B2 (en) * | 2017-03-30 | 2020-01-07 | Intel Corporation | Decoupling systems |
CN109712917B (zh) * | 2018-12-29 | 2024-06-04 | 苏州矽微电子科技有限公司 | 一种wafer扩晶转移贴膜方法及其机构 |
CN111276435B (zh) * | 2020-03-19 | 2022-04-15 | 中国科学院苏州生物医学工程技术研究所 | 宽范围、均匀应变的柔性电子基底近圆式拉伸*** |
TWI800211B (zh) * | 2021-11-05 | 2023-04-21 | 斯託克精密科技股份有限公司 | 用於將電子元件自撓性承載基板移轉至撓性目標基板之裝置以及轉移電子元件之方法 |
CN116730005B (zh) * | 2023-07-10 | 2024-01-23 | 芯朋半导体科技(如东)有限公司 | 一种矩阵式巨量检测机构 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2241640A (en) * | 1938-12-08 | 1941-05-13 | Libbey Owens Ford Glass Co | Conveyer |
JPS5599795A (en) * | 1979-01-25 | 1980-07-30 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
SE8500193L (sv) * | 1984-01-19 | 1985-07-20 | Recycloplast Ag | Forfarande for att blanda hellbara material med ett instellbart blandningsforhallande som en del av ett forfarande for att bearbeta materialen jemte anordning for att utfora forfarandet |
US4876791A (en) * | 1986-04-22 | 1989-10-31 | Kulicke & Soffa Industries, Inc. | Apparatus for and methods of die bonding |
IT1201888B (it) * | 1986-07-29 | 1989-02-02 | Dario Toncelli | Nastro trasportatore con risalti inclinati in sensi opposti |
JP3228959B2 (ja) * | 1991-07-18 | 2001-11-12 | ローム株式会社 | ペレットのピックアップ装置 |
US5161666A (en) * | 1991-08-26 | 1992-11-10 | Hugh D. Eller | Conveyor belt cleaner |
JP2563550Y2 (ja) * | 1991-10-31 | 1998-02-25 | スズキ株式会社 | ベルトコンベア |
JP2536371B2 (ja) * | 1992-09-10 | 1996-09-18 | 東芝精機株式会社 | 半導体ペレットボンディング方法 |
JPH0697214A (ja) * | 1992-09-14 | 1994-04-08 | Hitachi Ltd | ピックアップ装置 |
JPH06338556A (ja) * | 1993-05-28 | 1994-12-06 | Naito Densei Kogyo Kk | 細長ペレットの抽出装置 |
JPH081925B2 (ja) * | 1993-10-29 | 1996-01-10 | 東芝精機株式会社 | ペレット突き上げ装置 |
JPH0837223A (ja) * | 1994-07-25 | 1996-02-06 | Rohm Co Ltd | 半導体チップのピックアップ装置 |
JPH08124994A (ja) * | 1994-10-19 | 1996-05-17 | Hitachi Ltd | ペレット分類装置 |
US5671530A (en) * | 1995-10-30 | 1997-09-30 | Delco Electronics Corporation | Flip-chip mounting assembly and method with vertical wafer feeder |
JP2000505598A (ja) * | 1996-02-29 | 2000-05-09 | アルファセム・アクチェンゲゼルシャフト | 部品を受け取り、位置付け、組み立てるための方法及び装置 |
-
1998
- 1998-02-18 US US09/025,564 patent/US5976306A/en not_active Expired - Lifetime
-
1999
- 1999-02-17 WO PCT/US1999/003385 patent/WO1999042289A1/en active IP Right Grant
- 1999-02-17 DE DE69937949T patent/DE69937949T2/de not_active Expired - Lifetime
- 1999-02-17 JP JP2000532273A patent/JP4781529B2/ja not_active Expired - Fee Related
- 1999-02-17 EP EP99908205A patent/EP1064152B1/de not_active Expired - Lifetime
- 1999-02-18 AU AU27696/99A patent/AU2769699A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1064152B1 (de) | 2008-01-09 |
WO1999042289A1 (en) | 1999-08-26 |
JP4781529B2 (ja) | 2011-09-28 |
JP2002503891A (ja) | 2002-02-05 |
AU2769699A (en) | 1999-09-06 |
EP1064152A4 (de) | 2005-10-05 |
US5976306A (en) | 1999-11-02 |
EP1064152A1 (de) | 2001-01-03 |
DE69937949T2 (de) | 2008-12-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |