DE69937949D1 - Verfahren und gerät zum abnehmen von clips von einem wafer und zum transportieren der clips zu einer aufnahmestation - Google Patents

Verfahren und gerät zum abnehmen von clips von einem wafer und zum transportieren der clips zu einer aufnahmestation

Info

Publication number
DE69937949D1
DE69937949D1 DE69937949T DE69937949T DE69937949D1 DE 69937949 D1 DE69937949 D1 DE 69937949D1 DE 69937949 T DE69937949 T DE 69937949T DE 69937949 T DE69937949 T DE 69937949T DE 69937949 D1 DE69937949 D1 DE 69937949D1
Authority
DE
Germany
Prior art keywords
clips
wafer
transporting
recording station
station
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69937949T
Other languages
English (en)
Other versions
DE69937949T2 (de
Inventor
Peter Davis
Dean Tarrant
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UI Holding Co
Original Assignee
UI Holding Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UI Holding Co filed Critical UI Holding Co
Publication of DE69937949D1 publication Critical patent/DE69937949D1/de
Application granted granted Critical
Publication of DE69937949T2 publication Critical patent/DE69937949T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1105—Delaminating process responsive to feed or shape at delamination
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1906—Delaminating means responsive to feed or shape at delamination
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49819—Disassembling with conveying of work or disassembled work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49822—Disassembling by applying force
    • Y10T29/49824—Disassembling by applying force to elastically deform work part or connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69937949T 1998-02-18 1999-02-17 Verfahren und gerät zum abnehmen von clips von einem wafer und zum transportieren der clips zu einer aufnahmestation Expired - Lifetime DE69937949T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/025,564 US5976306A (en) 1998-02-18 1998-02-18 Method and apparatus for removing die from an expanded wafer and conveying die to a pickup location
PCT/US1999/003385 WO1999042289A1 (en) 1998-02-18 1999-02-17 Method and apparatus for removing die from a wafer and conveying die to a pickup location
US25564 2001-12-18

Publications (2)

Publication Number Publication Date
DE69937949D1 true DE69937949D1 (de) 2008-02-21
DE69937949T2 DE69937949T2 (de) 2008-12-24

Family

ID=21826796

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69937949T Expired - Lifetime DE69937949T2 (de) 1998-02-18 1999-02-17 Verfahren und gerät zum abnehmen von clips von einem wafer und zum transportieren der clips zu einer aufnahmestation

Country Status (6)

Country Link
US (1) US5976306A (de)
EP (1) EP1064152B1 (de)
JP (1) JP4781529B2 (de)
AU (1) AU2769699A (de)
DE (1) DE69937949T2 (de)
WO (1) WO1999042289A1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6157870A (en) * 1997-02-18 2000-12-05 Zevatech Trading Ag Apparatus supplying components to a placement machine with splice sensor
DE59711263D1 (de) 1997-10-30 2004-03-04 Esec Trading Sa Verfahren und Einrichtung für die Justierung des Bondkopfs einer Maschine für das Bonden von Halbleiterchips auf ein Trägermaterial
US6173750B1 (en) * 1998-02-18 2001-01-16 Hover-Davis, Inc. Method and apparatus for removing die from a wafer and conveying die to a pickup location
US6122561A (en) * 1998-09-01 2000-09-19 Ciena Corporation Precision continuous surface guided optical module carrier and method of using same
US6554128B1 (en) 1999-10-07 2003-04-29 Delaware Capital Formation, Inc. Die shuttle conveyor and nest therefor
AU2001279280A1 (en) * 2000-07-07 2002-01-21 Hover-Davis, Inc. Component source interchange gantry
US6773543B2 (en) * 2002-05-07 2004-08-10 Delaware Capital Formation, Inc. Method and apparatus for the multiplexed acquisition of a bare die from a wafer
US7023347B2 (en) * 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
US7306695B2 (en) * 2003-04-10 2007-12-11 Matsushita Electric Industrial Co., Ltd. Apparatus and method for picking up semiconductor chip
WO2004112096A2 (en) * 2003-06-12 2004-12-23 Symbol Technologies, Inc. Method and system for high volume transfer of dies to substrates
JP2005045023A (ja) * 2003-07-22 2005-02-17 Toshiba Corp 半導体装置の製造方法および半導体製造装置
US7207430B2 (en) * 2004-10-25 2007-04-24 Ui Holding Company Vacuum gripper for handling small components
NL1029207C2 (nl) * 2005-06-07 2006-12-08 Assembleon Nv Componentpositioneringsinrichting alsmede een werkwijze voor het positioneren van een component.
DE102005061680B3 (de) * 2005-12-21 2007-09-13 Mühlbauer Ag Einrichtung und Verfahren zur gleichzeitigen Übertragung einer Mehrzahl von elektronischen Bauteilen
JP2007297167A (ja) * 2006-04-28 2007-11-15 Toyota Motor Corp マグネットコンベア
DE102007048410B4 (de) 2007-10-09 2009-07-30 Siemens Ag Zuführvorrichtung für Bauelemente zu einem Bestückautomaten zur Bestückung von Substraten mit den Bauelementen
DE102007048413B3 (de) * 2007-10-09 2009-04-16 Siemens Ag Zuführvorrichtung vor Bauelemente zu einem Bestückautomaten zur Bestückung von Substraten mit Bauelementen
US7819239B2 (en) * 2008-12-11 2010-10-26 Schenson Co., Ltd. Feeder for an auto mounting device
US20110182701A1 (en) * 2010-01-28 2011-07-28 Ui Holding Co. Method and apparatus for transferring die from a wafer
CN105704998B (zh) * 2014-11-27 2019-02-22 英业达科技有限公司 取件置放方法
CN104701227B (zh) * 2015-03-27 2017-12-29 江苏艾科瑞思封装自动化设备有限公司 用于集成电路封装设备的料片进给机构
CH714090B1 (de) * 2016-07-13 2022-07-15 Universal Instruments Corp Modulares Die-Handhabungssystem.
US10529600B2 (en) * 2017-03-30 2020-01-07 Intel Corporation Decoupling systems
CN109712917B (zh) * 2018-12-29 2024-06-04 苏州矽微电子科技有限公司 一种wafer扩晶转移贴膜方法及其机构
CN111276435B (zh) * 2020-03-19 2022-04-15 中国科学院苏州生物医学工程技术研究所 宽范围、均匀应变的柔性电子基底近圆式拉伸***
TWI800211B (zh) * 2021-11-05 2023-04-21 斯託克精密科技股份有限公司 用於將電子元件自撓性承載基板移轉至撓性目標基板之裝置以及轉移電子元件之方法
CN116730005B (zh) * 2023-07-10 2024-01-23 芯朋半导体科技(如东)有限公司 一种矩阵式巨量检测机构

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2241640A (en) * 1938-12-08 1941-05-13 Libbey Owens Ford Glass Co Conveyer
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Ind Co Ltd Device for mounting electronic part
SE8500193L (sv) * 1984-01-19 1985-07-20 Recycloplast Ag Forfarande for att blanda hellbara material med ett instellbart blandningsforhallande som en del av ett forfarande for att bearbeta materialen jemte anordning for att utfora forfarandet
US4876791A (en) * 1986-04-22 1989-10-31 Kulicke & Soffa Industries, Inc. Apparatus for and methods of die bonding
IT1201888B (it) * 1986-07-29 1989-02-02 Dario Toncelli Nastro trasportatore con risalti inclinati in sensi opposti
JP3228959B2 (ja) * 1991-07-18 2001-11-12 ローム株式会社 ペレットのピックアップ装置
US5161666A (en) * 1991-08-26 1992-11-10 Hugh D. Eller Conveyor belt cleaner
JP2563550Y2 (ja) * 1991-10-31 1998-02-25 スズキ株式会社 ベルトコンベア
JP2536371B2 (ja) * 1992-09-10 1996-09-18 東芝精機株式会社 半導体ペレットボンディング方法
JPH0697214A (ja) * 1992-09-14 1994-04-08 Hitachi Ltd ピックアップ装置
JPH06338556A (ja) * 1993-05-28 1994-12-06 Naito Densei Kogyo Kk 細長ペレットの抽出装置
JPH081925B2 (ja) * 1993-10-29 1996-01-10 東芝精機株式会社 ペレット突き上げ装置
JPH0837223A (ja) * 1994-07-25 1996-02-06 Rohm Co Ltd 半導体チップのピックアップ装置
JPH08124994A (ja) * 1994-10-19 1996-05-17 Hitachi Ltd ペレット分類装置
US5671530A (en) * 1995-10-30 1997-09-30 Delco Electronics Corporation Flip-chip mounting assembly and method with vertical wafer feeder
JP2000505598A (ja) * 1996-02-29 2000-05-09 アルファセム・アクチェンゲゼルシャフト 部品を受け取り、位置付け、組み立てるための方法及び装置

Also Published As

Publication number Publication date
EP1064152B1 (de) 2008-01-09
WO1999042289A1 (en) 1999-08-26
JP4781529B2 (ja) 2011-09-28
JP2002503891A (ja) 2002-02-05
AU2769699A (en) 1999-09-06
EP1064152A4 (de) 2005-10-05
US5976306A (en) 1999-11-02
EP1064152A1 (de) 2001-01-03
DE69937949T2 (de) 2008-12-24

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Legal Events

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8364 No opposition during term of opposition