DE69926896D1 - Elektrische komponente eingebettet in einer mehrschicht-leiterplattenanordnung - Google Patents
Elektrische komponente eingebettet in einer mehrschicht-leiterplattenanordnungInfo
- Publication number
- DE69926896D1 DE69926896D1 DE69926896T DE69926896T DE69926896D1 DE 69926896 D1 DE69926896 D1 DE 69926896D1 DE 69926896 T DE69926896 T DE 69926896T DE 69926896 T DE69926896 T DE 69926896T DE 69926896 D1 DE69926896 D1 DE 69926896D1
- Authority
- DE
- Germany
- Prior art keywords
- electrical component
- pcb assembly
- multilayer pcb
- component embedded
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9802157A SE513875C2 (sv) | 1998-06-15 | 1998-06-15 | Elektrisk komponent samt ett flerlagrigt kretskort |
SE9802157 | 1998-06-15 | ||
PCT/SE1999/001063 WO1999066518A1 (en) | 1998-06-15 | 1999-06-15 | Electric component |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69926896D1 true DE69926896D1 (de) | 2005-09-29 |
DE69926896T2 DE69926896T2 (de) | 2006-03-30 |
Family
ID=20411738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69926896T Expired - Lifetime DE69926896T2 (de) | 1998-06-15 | 1999-06-15 | Elektrische komponente eingebettet in einer mehrschicht-leiterplattenanordnung |
Country Status (6)
Country | Link |
---|---|
US (1) | US6421225B2 (de) |
EP (1) | EP1095385B1 (de) |
AU (1) | AU4813999A (de) |
DE (1) | DE69926896T2 (de) |
SE (1) | SE513875C2 (de) |
WO (1) | WO1999066518A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1990833A3 (de) | 2000-02-25 | 2010-09-29 | Ibiden Co., Ltd. | Mehrschichtige Leiterplatte und Herstellungsverfahren für mehrschichtige Leiterplatte |
CN1901181B (zh) | 2000-09-25 | 2012-09-05 | 揖斐电株式会社 | 半导体元件及其制造方法、多层印刷布线板及其制造方法 |
US7038143B2 (en) * | 2002-05-16 | 2006-05-02 | Mitsubishi Denki Kabushiki Kaisha | Wiring board, fabrication method of wiring board, and semiconductor device |
US6900708B2 (en) * | 2002-06-26 | 2005-05-31 | Georgia Tech Research Corporation | Integrated passive devices fabricated utilizing multi-layer, organic laminates |
US6987307B2 (en) * | 2002-06-26 | 2006-01-17 | Georgia Tech Research Corporation | Stand-alone organic-based passive devices |
US7260890B2 (en) * | 2002-06-26 | 2007-08-28 | Georgia Tech Research Corporation | Methods for fabricating three-dimensional all organic interconnect structures |
US7489914B2 (en) * | 2003-03-28 | 2009-02-10 | Georgia Tech Research Corporation | Multi-band RF transceiver with passive reuse in organic substrates |
US7054599B2 (en) * | 2003-05-08 | 2006-05-30 | Lockheed Martin Corporation | High density interconnect structure for use on software defined radio |
TWI314745B (en) * | 2004-02-02 | 2009-09-11 | Ind Tech Res Inst | Method and apparatus of non-symmetrical electrode of build-in capacitor |
US8345433B2 (en) * | 2004-07-08 | 2013-01-01 | Avx Corporation | Heterogeneous organic laminate stack ups for high frequency applications |
US20060011376A1 (en) * | 2004-07-16 | 2006-01-19 | General Electric Company | Multi-axial electrically conductive cable with multi-layered core and method of manufacture and use |
JP2007142109A (ja) * | 2005-11-17 | 2007-06-07 | Tdk Corp | 電子部品 |
US7439840B2 (en) | 2006-06-27 | 2008-10-21 | Jacket Micro Devices, Inc. | Methods and apparatuses for high-performing multi-layer inductors |
US7808434B2 (en) * | 2006-08-09 | 2010-10-05 | Avx Corporation | Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices |
US7989895B2 (en) | 2006-11-15 | 2011-08-02 | Avx Corporation | Integration using package stacking with multi-layer organic substrates |
US8325461B2 (en) * | 2008-08-08 | 2012-12-04 | Hamilton Sundstrand Corporation | Printed wiring board feed-through capacitor |
US10372213B2 (en) * | 2016-09-20 | 2019-08-06 | Facebook Technologies, Llc | Composite ribbon in a virtual reality device |
US10993333B2 (en) * | 2017-07-15 | 2021-04-27 | Sanmina Corporation | Methods of manufacturing ultra thin dielectric printed circuit boards with thin laminates |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL267988A (de) * | 1960-08-15 | 1900-01-01 | ||
US3886415A (en) * | 1968-04-01 | 1975-05-27 | Itek Corp | Capacitor with photo-conductive dielectric |
US3806775A (en) * | 1971-10-19 | 1974-04-23 | Du Pont | Polyolefin capacitor construction |
US3778689A (en) * | 1972-05-22 | 1973-12-11 | Hewlett Packard Co | Thin film capacitors and method for manufacture |
JPS6040383B2 (ja) * | 1978-07-05 | 1985-09-10 | 東レ株式会社 | ポリプロピレン複合二軸延伸フイルム |
DE2851557C2 (de) | 1978-11-29 | 1982-04-01 | Hoechst Ag, 6000 Frankfurt | Biaxial gestreckte Polypropylenverbundfolie zur Verwendung als Elektroisolierfolie |
JPS60214941A (ja) * | 1984-04-10 | 1985-10-28 | 株式会社 潤工社 | プリント基板 |
US5065253A (en) | 1987-12-25 | 1991-11-12 | Pioneer Electronic Corporation | Disk player with disk tilt or pickup position responsive noise reduction |
US5065284A (en) | 1988-08-01 | 1991-11-12 | Rogers Corporation | Multilayer printed wiring board |
JP3019541B2 (ja) * | 1990-11-22 | 2000-03-13 | 株式会社村田製作所 | コンデンサ内蔵型配線基板およびその製造方法 |
FR2684333B1 (fr) * | 1991-12-03 | 1999-07-16 | Bollore Technologies | Film plastique bicouche bi-etire. |
US5800575A (en) * | 1992-04-06 | 1998-09-01 | Zycon Corporation | In situ method of forming a bypass capacitor element internally within a capacitive PCB |
US5625528A (en) | 1992-10-21 | 1997-04-29 | Devoe; Daniel F. | Monolithic, buried-substrate, ceramic multiple capacitors isolated, one to the next, by dual-dielectric-constant, three-layer-laminate isolation layers |
US5625655A (en) | 1994-07-29 | 1997-04-29 | Combustion Engineering, Inc. | Fuel transfer tube quick operating remote closure device |
US5796587A (en) | 1996-06-12 | 1998-08-18 | International Business Machines Corporation | Printed circut board with embedded decoupling capacitance and method for producing same |
-
1998
- 1998-06-15 SE SE9802157A patent/SE513875C2/sv unknown
-
1999
- 1999-06-15 DE DE69926896T patent/DE69926896T2/de not_active Expired - Lifetime
- 1999-06-15 US US09/333,880 patent/US6421225B2/en not_active Expired - Lifetime
- 1999-06-15 AU AU48139/99A patent/AU4813999A/en not_active Abandoned
- 1999-06-15 EP EP99931703A patent/EP1095385B1/de not_active Expired - Lifetime
- 1999-06-15 WO PCT/SE1999/001063 patent/WO1999066518A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
WO1999066518A1 (en) | 1999-12-23 |
SE9802157L (sv) | 1999-12-16 |
SE513875C2 (sv) | 2000-11-20 |
AU4813999A (en) | 2000-01-05 |
SE9802157D0 (sv) | 1998-06-15 |
EP1095385B1 (de) | 2005-08-24 |
US20010011606A1 (en) | 2001-08-09 |
DE69926896T2 (de) | 2006-03-30 |
EP1095385A1 (de) | 2001-05-02 |
US6421225B2 (en) | 2002-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |