DE69906599D1 - Verfahren und Vorrichtung zur Laserbearbeitung - Google Patents

Verfahren und Vorrichtung zur Laserbearbeitung

Info

Publication number: DE69906599D1
Authority: DE; Germany
Prior art keywords: laser processing; laser; processing
Prior art date: 1998-01-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE69906599T

Other languages

English (en)

Other versions

DE69906599T2 (de

Inventor

Koji Sugioka

Jie Zhang

Katsumi Midorikawa

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

RIKEN Institute of Physical and Chemical Research

Original Assignee

RIKEN Institute of Physical and Chemical Research

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1998-01-21

Filing date

1999-01-18

Publication date

2003-05-15

1999-01-18 Application filed by RIKEN Institute of Physical and Chemical Research filed Critical RIKEN Institute of Physical and Chemical Research

2003-05-15 Application granted granted Critical

2003-05-15 Publication of DE69906599D1 publication Critical patent/DE69906599D1/de

2003-11-13 Publication of DE69906599T2 publication Critical patent/DE69906599T2/de

2019-01-19 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks

Landscapes

Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
Optics & Photonics (AREA)
Plasma & Fusion (AREA)
Mechanical Engineering (AREA)
Laser Beam Processing (AREA)
Lasers (AREA)
Micromachines (AREA)

DE69906599T 1998-01-21 1999-01-18 Verfahren und Vorrichtung zur Laserbearbeitung Expired - Fee Related DE69906599T2 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP02387998A JP3401425B2 (ja)	1998-01-21	1998-01-21	レーザー加工方法およびレーザー加工装置

Publications (2)

Publication Number	Publication Date
DE69906599D1 true DE69906599D1 (de)	2003-05-15
DE69906599T2 DE69906599T2 (de)	2003-11-13

Family

ID=12122745

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE69906599T Expired - Fee Related DE69906599T2 (de)	1998-01-21	1999-01-18	Verfahren und Vorrichtung zur Laserbearbeitung

Country Status (5)

Country	Link
US (1)	US6180915B1 (de)
EP (1)	EP0931620B1 (de)
JP (1)	JP3401425B2 (de)
CA (1)	CA2258457C (de)
DE (1)	DE69906599T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
SG86451A1 (en) *	1999-11-30	2002-02-19	Canon Kk	Laser etching method and apparatus therefor
SG122749A1 (en) *	2001-10-16	2006-06-29	Inst Data Storage	Method of laser marking and apparatus therefor
US8247731B2 (en) *	2002-02-25	2012-08-21	Board Of Regents Of The University Of Nebraska	Laser scribing and machining of materials
US20050109747A1 (en) *	2002-02-25	2005-05-26	Alexander Dennis R.	Laser scribing and machining of materials
DE10300134A1 (de) *	2003-01-07	2004-07-15	Robert Bosch Gmbh	Verfahren und Vorrichtung zum Laserbohren
US7049543B2 (en) *	2003-11-07	2006-05-23	The Regents Of The University Of California	Method of defining features on materials with a femtosecond laser
FI20060178L (fi) *	2006-02-23	2007-08-24	Picodeon Ltd Oy	Pinnoitusmenetelmä
US7608308B2 (en) *	2006-04-17	2009-10-27	Imra America, Inc.	P-type semiconductor zinc oxide films process for preparation thereof, and pulsed laser deposition method using transparent substrates
DE102011055364A1 (de)	2011-11-15	2013-05-23	Hochschule für Angewandte Wissenschaft und Kunst - Hildesheim/Holzminden/Göttingen	Verfahren zum Materialabtrag an Glasoberflächen
DE102014109791A1 (de)	2014-07-11	2016-01-14	Schott Ag	Verfahren zur Laserablation
DE102014015951A1 (de) *	2014-10-20	2016-04-21	4Jet Technologies Gmbh	Verfahren zum Bearbeiten eines elektrisch nicht leitenden oder halbleitenden Materials
US10906832B2 (en)	2017-08-11	2021-02-02	Corning Incorporated	Apparatuses and methods for synchronous multi-laser processing of transparent workpieces

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DD237817A1 (de) *	1982-08-05	1986-07-30	Ernst Heumann	Verfahren zur strukturierung von materialoberflaechen mittels laserstrahlung
US4689467A (en) *	1982-12-17	1987-08-25	Inoue-Japax Research Incorporated	Laser machining apparatus
JPS63238289A (ja) *	1987-03-26	1988-10-04	Mikio Takai	プラズマとレ−ザ−照射とを同時に用いる加工方法および加工装置
JPH04356388A (ja) *	1991-05-28	1992-12-10	Fujitsu Ltd	レーザアブレーション加工方法及び加工用マスク
JPH06155920A (ja) *	1992-11-19	1994-06-03	Miyachi Technos Kk	マーキング方法
US5558788A (en) *	1993-11-30	1996-09-24	Martin Marietta Energy Systems, Inc.	Dual beam optical system for pulsed laser ablation film deposition
US5801356A (en) *	1995-08-16	1998-09-01	Santa Barbara Research Center	Laser scribing on glass using Nd:YAG laser
JP2000502316A (ja) *	1996-09-19	2000-02-29	フィリップスエレクトロニクスネムローゼフェンノートシャップ	パターンを有する表面け書きを透明本体上に形成する方法
JP3392683B2 (ja) *	1997-02-10	2003-03-31	三菱重工業株式会社	レーザ加工ヘッド
JP3831046B2 (ja) *	1997-02-21	2006-10-11	株式会社安川電機	マーキング方法
KR100537771B1 (ko) *	1997-03-21	2005-12-19	가부시키가이샤 야스카와덴키	마킹방법 및 마킹재

1998
- 1998-01-21 JP JP02387998A patent/JP3401425B2/ja not_active Expired - Lifetime
1999
- 1999-01-13 CA CA002258457A patent/CA2258457C/en not_active Expired - Fee Related
- 1999-01-18 DE DE69906599T patent/DE69906599T2/de not_active Expired - Fee Related
- 1999-01-18 EP EP99100818A patent/EP0931620B1/de not_active Expired - Lifetime
- 1999-01-21 US US09/234,945 patent/US6180915B1/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
CA2258457A1 (en)	1999-07-21
CA2258457C (en)	2006-03-28
US6180915B1 (en)	2001-01-30
JPH11207478A (ja)	1999-08-03
EP0931620A1 (de)	1999-07-28
JP3401425B2 (ja)	2003-04-28
DE69906599T2 (de)	2003-11-13
EP0931620B1 (de)	2003-04-09

Similar Documents

Publication	Publication Date	Title
DE69931004D1 (de)	2006-06-01	Verfahren und Vorrichtung zur Datenverarbeitung
DE69737666D1 (de)	2007-06-06	Verfahren und Vorrichtung zur Dokument-Verarbeitung
DE69940804D1 (de)	2009-06-10	Verfahren und vorrichtung zur unterdrückung von abklingartefakten
DE69721632D1 (de)	2003-06-12	Verfahren und Vorrichtung zur Servletverarbeitung
DE69936687D1 (de)	2007-09-13	Vorrichtung und Verfahren zur Mehrfachbelichtung
DE50007073D1 (de)	2004-08-19	Verfahren und vorrichtung zur strahlformung
DE69822687D1 (de)	2004-05-06	Vorrichtung und Verfahren zur Zusammenfassung
DE69927328D1 (de)	2005-10-27	Vorrichtung und Verfahren zur Signalspitzenbegrenzung
DE69926195D1 (de)	2005-08-25	Vorrichtung und Verfahren zur Bildgebung
DE69624177D1 (de)	2002-11-14	Verfahren und Vorrichtung zur Datenverarbeitung
DE69912577D1 (de)	2003-12-11	Vorrichtung und verfahren zur optischen inspektion
DE69907878D1 (de)	2003-06-18	Verfahren und vorrichtung zur elektrokoagulation von flüssigkeiten
DE69737780D1 (de)	2007-07-19	Verfahren und Vorrichtung zur Bildverarbeitung
DE69903497D1 (de)	2002-11-21	Verfahren und Vorrichtung zur Unterdrückung von Resonanz
DE69938403D1 (de)	2008-05-08	Verfahren und Vorrichtung zur Routenberechnung
DE50100861D1 (de)	2003-12-04	Verfahren und Vorrichtung zur Laser-Mikrodissektion
DE69941111D1 (de)	2009-08-27	Verfahren und vorrichtung zur metallisierung
DE19983717T1 (de)	2001-10-04	Vorrichtung und Verfahren zur Ausrichtung
DE69834320D1 (de)	2006-06-01	Verfahren und Vorrichtung zur Folgeschätzung
DE69942295D1 (de)	2010-06-10	Vorrichtung und verfahren zur informationsverarbeitung
DE69904764D1 (de)	2003-02-13	Verfahren und Vorrichtung zur Mustererkennung
DE69715071D1 (de)	2002-10-10	Verfahren und Vorrichtung zur Sprachverarbeitung
DE50100784D1 (de)	2003-11-20	Verfahren und Vorrichtung zur Laser-Mikrodissektion
DE69942553D1 (de)	2010-08-12	Vorrichtung und Verfahren zur Zeitmessung
DE60010094D1 (de)	2004-05-27	Verfahren und vorrichtung zur pfadsuche

Legal Events

Date	Code	Title	Description
2004-05-06	8364	No opposition during term of opposition
2008-11-20	8339	Ceased/non-payment of the annual fee