DE69815699D1 - Laserbearbeitungsvorrichtung - Google Patents
LaserbearbeitungsvorrichtungInfo
- Publication number
- DE69815699D1 DE69815699D1 DE69815699T DE69815699T DE69815699D1 DE 69815699 D1 DE69815699 D1 DE 69815699D1 DE 69815699 T DE69815699 T DE 69815699T DE 69815699 T DE69815699 T DE 69815699T DE 69815699 D1 DE69815699 D1 DE 69815699D1
- Authority
- DE
- Germany
- Prior art keywords
- laser
- optics
- focusing
- processing device
- laser processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Laser Surgery Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1007068A NL1007068C2 (nl) | 1997-09-18 | 1997-09-18 | Laserbewerkingsapparaat. |
NL1007068 | 1997-09-18 | ||
PCT/NL1998/000543 WO1999014009A1 (en) | 1997-09-18 | 1998-09-18 | Laser processing device |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69815699D1 true DE69815699D1 (de) | 2003-07-24 |
DE69815699T2 DE69815699T2 (de) | 2004-04-29 |
Family
ID=19765699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69815699T Expired - Fee Related DE69815699T2 (de) | 1997-09-18 | 1998-09-18 | Laserbearbeitungsvorrichtung |
Country Status (7)
Country | Link |
---|---|
US (1) | US6437287B1 (de) |
EP (1) | EP1015164B1 (de) |
JP (1) | JP2001516647A (de) |
AT (1) | ATE243088T1 (de) |
DE (1) | DE69815699T2 (de) |
NL (1) | NL1007068C2 (de) |
WO (1) | WO1999014009A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040144760A1 (en) | 2002-05-17 | 2004-07-29 | Cahill Steven P. | Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein |
JP2005125339A (ja) * | 2003-10-21 | 2005-05-19 | Hitachi Via Mechanics Ltd | レーザ加工装置 |
CN100352593C (zh) * | 2004-06-02 | 2007-12-05 | 上海大众汽车有限公司 | 激光器的对焦设备 |
JP2006167728A (ja) * | 2004-12-13 | 2006-06-29 | Yamazaki Mazak Corp | レーザ加工機における集光レンズの汚れ検出方法及び装置 |
DE602006004331D1 (de) * | 2005-04-19 | 2009-01-29 | Koninkl Philips Electronics Nv | Vorrichtung zur strahlungslenkung auf eine schicht, gerät mit einer derartigen vorrichtung und verfahren unter verwendung eines derartigen geräts |
EP2465877A1 (de) | 2010-12-20 | 2012-06-20 | Ineos Commercial Services UK Limited | Verfahren |
US10290118B2 (en) * | 2015-08-06 | 2019-05-14 | Cognex Corporation | System and method for tying together machine vision coordinate spaces in a guided assembly environment |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4573467A (en) * | 1983-05-13 | 1986-03-04 | The United States Of America As Represented By The Department Of Health And Human Services | Optical coupling device for biomicroscope |
US4611115A (en) * | 1985-01-14 | 1986-09-09 | Richland Glass Company, Inc. | Laser etch monitoring system |
US4769523A (en) * | 1985-03-08 | 1988-09-06 | Nippon Kogaku K.K. | Laser processing apparatus |
US5382770A (en) * | 1993-01-14 | 1995-01-17 | Reliant Laser Corporation | Mirror-based laser-processing system with visual tracking and position control of a moving laser spot |
US5609780A (en) * | 1994-11-14 | 1997-03-11 | International Business Machines, Corporation | Laser system |
JP3162254B2 (ja) * | 1995-01-17 | 2001-04-25 | 三菱電機株式会社 | レーザ加工装置 |
US6040550A (en) * | 1996-10-28 | 2000-03-21 | Chang; Dale U. | Apparatus and method for laser welding the outer joints of metal bellows |
-
1997
- 1997-09-18 NL NL1007068A patent/NL1007068C2/nl not_active IP Right Cessation
-
1998
- 1998-09-18 WO PCT/NL1998/000543 patent/WO1999014009A1/en active IP Right Grant
- 1998-09-18 AT AT98944342T patent/ATE243088T1/de not_active IP Right Cessation
- 1998-09-18 DE DE69815699T patent/DE69815699T2/de not_active Expired - Fee Related
- 1998-09-18 US US09/486,912 patent/US6437287B1/en not_active Expired - Fee Related
- 1998-09-18 JP JP2000511607A patent/JP2001516647A/ja active Pending
- 1998-09-18 EP EP98944342A patent/EP1015164B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
NL1007068C2 (nl) | 1999-03-22 |
JP2001516647A (ja) | 2001-10-02 |
ATE243088T1 (de) | 2003-07-15 |
EP1015164A1 (de) | 2000-07-05 |
EP1015164B1 (de) | 2003-06-18 |
US6437287B1 (en) | 2002-08-20 |
DE69815699T2 (de) | 2004-04-29 |
WO1999014009A1 (en) | 1999-03-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |