DE69730775D1 - Logische Schaltung und zugehöriges Herstellungsverfahren - Google Patents
Logische Schaltung und zugehöriges HerstellungsverfahrenInfo
- Publication number
- DE69730775D1 DE69730775D1 DE69730775T DE69730775T DE69730775D1 DE 69730775 D1 DE69730775 D1 DE 69730775D1 DE 69730775 T DE69730775 T DE 69730775T DE 69730775 T DE69730775 T DE 69730775T DE 69730775 D1 DE69730775 D1 DE 69730775D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing process
- logical circuit
- associated manufacturing
- logical
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F7/00—Methods or arrangements for processing data by operating upon the order or content of the data handled
- G06F7/38—Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation
- G06F7/48—Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation using non-contact-making devices, e.g. tube, solid state device; using unspecified devices
- G06F7/50—Adding; Subtracting
- G06F7/501—Half or full adders, i.e. basic adder cells for one denomination
- G06F7/503—Half or full adders, i.e. basic adder cells for one denomination using carry switching, i.e. the incoming carry being connected directly, or only via an inverter, to the carry output under control of a carry propagate signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/08—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices
- H03K19/094—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors
- H03K19/0944—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors using MOSFET or insulated gate field-effect transistors, i.e. IGFET
- H03K19/0948—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors using MOSFET or insulated gate field-effect transistors, i.e. IGFET using CMOS or complementary insulated gate field-effect transistors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Computing Systems (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computational Mathematics (AREA)
- Mathematical Analysis (AREA)
- Pure & Applied Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Optimization (AREA)
- Logic Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15026896 | 1996-05-22 | ||
JP15026896 | 1996-05-22 | ||
JP23130696 | 1996-08-13 | ||
JP23130696A JPH1065507A (ja) | 1996-08-13 | 1996-08-13 | スイッチ回路および論理回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69730775D1 true DE69730775D1 (de) | 2004-10-28 |
DE69730775T2 DE69730775T2 (de) | 2005-09-29 |
Family
ID=26479925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69730775T Expired - Lifetime DE69730775T2 (de) | 1996-05-22 | 1997-05-21 | Logische Schaltung und zugehöriges Herstellungsverfahren |
Country Status (3)
Country | Link |
---|---|
US (2) | US6111427A (de) |
EP (1) | EP0809362B1 (de) |
DE (1) | DE69730775T2 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6111427A (en) * | 1996-05-22 | 2000-08-29 | Nippon Telegraph And Telephone Corporation | Logic circuit having different threshold voltage transistors and its fabrication method |
JP3777768B2 (ja) * | 1997-12-26 | 2006-05-24 | 株式会社日立製作所 | 半導体集積回路装置およびセルライブラリを記憶した記憶媒体および半導体集積回路の設計方法 |
US6693331B2 (en) * | 1999-11-18 | 2004-02-17 | Intel Corporation | Method of fabricating dual threshold voltage n-channel and p-channel MOSFETS with a single extra masked implant operation |
JP3416628B2 (ja) * | 2000-04-27 | 2003-06-16 | 松下電器産業株式会社 | 半導体集積回路装置 |
JP3523611B2 (ja) * | 2000-05-31 | 2004-04-26 | 日本電信電話株式会社 | 差動型論理回路 |
JP3912960B2 (ja) * | 2000-06-20 | 2007-05-09 | 株式会社東芝 | 半導体集積回路、論理演算回路およびフリップフロップ |
US6369606B1 (en) * | 2000-09-27 | 2002-04-09 | International Business Machines Corporation | Mixed threshold voltage CMOS logic device and method of manufacture therefor |
JP3614125B2 (ja) * | 2000-10-23 | 2005-01-26 | 三星電子株式会社 | Cpフリップフロップ |
US6918091B2 (en) * | 2000-11-09 | 2005-07-12 | Change Tools, Inc. | User definable interface system, method and computer program product |
US6668358B2 (en) * | 2001-10-01 | 2003-12-23 | International Business Machines Corporation | Dual threshold gate array or standard cell power saving library circuits |
US6586294B1 (en) * | 2002-01-02 | 2003-07-01 | Intel Corporation | Method of fabricating MOSFET transistors with multiple threshold voltages by halo compensation and masks |
US6981231B2 (en) * | 2002-02-22 | 2005-12-27 | Hewlett-Packard Development Company, L.P. | System and method to reduce leakage power in an electronic device |
US6933744B2 (en) * | 2002-06-11 | 2005-08-23 | The Regents Of The University Of Michigan | Low-leakage integrated circuits and dynamic logic circuits |
US6849492B2 (en) * | 2002-07-08 | 2005-02-01 | Micron Technology, Inc. | Method for forming standard voltage threshold and low voltage threshold MOSFET devices |
JP3916536B2 (ja) * | 2002-09-02 | 2007-05-16 | 沖電気工業株式会社 | Lsiデバイスの製造方法 |
JP4736313B2 (ja) | 2002-09-10 | 2011-07-27 | 日本電気株式会社 | 薄膜半導体装置 |
US7451413B1 (en) | 2003-01-03 | 2008-11-11 | Marvell International Ltd. | Methods of minimizing leakage current by analyzing post layout information and associated threshold voltage and leakage current |
US7188325B1 (en) * | 2004-10-04 | 2007-03-06 | Advanced Micro Devices, Inc. | Method for selecting transistor threshold voltages in an integrated circuit |
US20090108905A1 (en) * | 2007-10-24 | 2009-04-30 | National Chung Cheng University | Dynamic NP-swappable body bias circuit |
US8252649B2 (en) | 2008-12-22 | 2012-08-28 | Infineon Technologies Ag | Methods of fabricating semiconductor devices and structures thereof |
US8151224B1 (en) * | 2008-12-29 | 2012-04-03 | Altera Corporation | Method of designing integrated circuits including providing an option to select a mask layer set |
US10169500B2 (en) * | 2011-08-08 | 2019-01-01 | International Business Machines Corporation | Critical path delay prediction |
TWI637484B (zh) | 2013-12-26 | 2018-10-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
JP2022022804A (ja) | 2020-07-07 | 2022-02-07 | キオクシア株式会社 | 半導体装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4107548A (en) * | 1976-03-05 | 1978-08-15 | Hitachi, Ltd. | Ratioless type MIS logic circuit |
JPS5772429A (en) * | 1980-10-22 | 1982-05-06 | Toshiba Corp | Semiconductor integrated circuit device |
US4441039A (en) * | 1981-11-20 | 1984-04-03 | International Business Machines Corporation | Input buffer circuit for semiconductor memory |
US4714840A (en) * | 1982-12-30 | 1987-12-22 | Thomson Components - Mostek Corporation | MOS transistor circuits having matched channel width and length dimensions |
US4563599A (en) * | 1983-03-28 | 1986-01-07 | Motorola, Inc. | Circuit for address transition detection |
JPS6074817A (ja) * | 1983-09-30 | 1985-04-27 | Fujitsu Ltd | 集積回路 |
JP2574742B2 (ja) * | 1984-04-09 | 1997-01-22 | 三菱電機株式会社 | 半導体集積回路装置 |
JPH04263468A (ja) * | 1991-02-19 | 1992-09-18 | Fujitsu Ltd | 半導体装置の製造方法 |
JP3184265B2 (ja) * | 1991-10-17 | 2001-07-09 | 株式会社日立製作所 | 半導体集積回路装置およびその制御方法 |
US5486774A (en) * | 1991-11-26 | 1996-01-23 | Nippon Telegraph And Telephone Corporation | CMOS logic circuits having low and high-threshold voltage transistors |
KR0169157B1 (ko) * | 1993-11-29 | 1999-02-01 | 기다오까 다까시 | 반도체 회로 및 mos-dram |
JP3249293B2 (ja) * | 1994-05-30 | 2002-01-21 | 富士通株式会社 | 半導体集積回路 |
US5594371A (en) * | 1994-06-28 | 1997-01-14 | Nippon Telegraph And Telephone Corporation | Low voltage SOI (Silicon On Insulator) logic circuit |
JP2689950B2 (ja) * | 1995-04-13 | 1997-12-10 | 日本電気株式会社 | 高速低電力型デコード回路 |
EP0739097B1 (de) * | 1995-04-21 | 2004-04-07 | Nippon Telegraph And Telephone Corporation | MOSFET Schaltung und ihre Anwendung in einer CMOS Logikschaltung |
US6111427A (en) * | 1996-05-22 | 2000-08-29 | Nippon Telegraph And Telephone Corporation | Logic circuit having different threshold voltage transistors and its fabrication method |
-
1997
- 1997-05-21 US US08/861,319 patent/US6111427A/en not_active Expired - Lifetime
- 1997-05-21 EP EP97201509A patent/EP0809362B1/de not_active Expired - Lifetime
- 1997-05-21 DE DE69730775T patent/DE69730775T2/de not_active Expired - Lifetime
-
1999
- 1999-09-10 US US09/393,822 patent/US6426261B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0809362A3 (de) | 1999-07-21 |
DE69730775T2 (de) | 2005-09-29 |
EP0809362A2 (de) | 1997-11-26 |
EP0809362B1 (de) | 2004-09-22 |
US6111427A (en) | 2000-08-29 |
US6426261B1 (en) | 2002-07-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69730775D1 (de) | Logische Schaltung und zugehöriges Herstellungsverfahren | |
DE69718693D1 (de) | Elektronisches Bauteil und Herstellungsverfahren | |
DE69615437D1 (de) | Integrierte Schaltungsanordnung und Herstellungsverfahren | |
DE69929456D1 (de) | Nahfeldabtastkopf und herstellungsverfahren | |
DE69840246D1 (de) | Elektronisches Bauteil und Herstellungsverfahren | |
DE69935701D1 (de) | Schalterstruktur und Herstellverfahren | |
DE69525188D1 (de) | Hoch- und Niederspannungs-CMOS-Bauteil und Herstellungsverfahren | |
DE59710061D1 (de) | Piezoaktor mit neuartiger kontaktierung und herstellverfahren | |
DE69406723D1 (de) | Organopolysiloxan und Herstellungsverfahren | |
DE69531373D1 (de) | Induktivität und zugehöriges Herstellungsverfahren | |
DE69417346D1 (de) | Bildaufnehmer und Herstellungsverfahren | |
DE69838411D1 (de) | Flache bildanzeigetafel und herstellungsverfahren | |
BR9504561A (pt) | Processo de fabricaçao de restriçao e restriçao | |
DE69834561D1 (de) | Halbleiteranordnung und herstellungsverfahren dafür | |
DE69841064D1 (de) | Widerstand und Herstellungsverfahren dafür | |
DE69534938D1 (de) | Photovoltaisches Bauelement und Herstellungsverfahren | |
DE69509263D1 (de) | Infrarotszene projektanordnung geringer leistung und herstellungsverfahren | |
DE69418962D1 (de) | Vernetztes Silikonen-Pulver und Herstellungsverfahren davon | |
DE69808499D1 (de) | Widerstand und herstellungsverfahren | |
DE69808948D1 (de) | Stossfänger und herstellungsverfahren | |
DE69517843D1 (de) | Weiche Süssware und Herstellungsverfahren | |
SG73471A1 (en) | Integrated circuit and process for its manufacture | |
DE69522846D1 (de) | Verbesserte Speicheranordnung und Herstellungsverfahren | |
DE69811459D1 (de) | Chip Kügelchen und Herstellungsverfahren | |
DE69904731D1 (de) | Feinzerkleinerer und feinzerkleinerungsverfahren |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |