JPH08330266A
(ja)
*
|
1995-05-31 |
1996-12-13 |
Texas Instr Inc <Ti> |
半導体装置等の表面を浄化し、処理する方法
|
US6500605B1
(en)
|
1997-05-27 |
2002-12-31 |
Tokyo Electron Limited |
Removal of photoresist and residue from substrate using supercritical carbon dioxide process
|
US6306564B1
(en)
|
1997-05-27 |
2001-10-23 |
Tokyo Electron Limited |
Removal of resist or residue from semiconductors using supercritical carbon dioxide
|
US6846789B2
(en)
*
|
1998-03-30 |
2005-01-25 |
The Regents Of The University Of California |
Composition and method for removing photoresist materials from electronic components
|
WO1999049998A1
(en)
|
1998-03-30 |
1999-10-07 |
The Regents Of The University Of California |
Composition and method for removing photoresist materials from electronic components
|
US6187911B1
(en)
*
|
1998-05-08 |
2001-02-13 |
Idaho Research Foundation, Inc. |
Method for separating metal chelates from other materials based on solubilities in supercritical fluids
|
US6277753B1
(en)
|
1998-09-28 |
2001-08-21 |
Supercritical Systems Inc. |
Removal of CMP residue from semiconductors using supercritical carbon dioxide process
|
US7044143B2
(en)
*
|
1999-05-14 |
2006-05-16 |
Micell Technologies, Inc. |
Detergent injection systems and methods for carbon dioxide microelectronic substrate processing systems
|
US7097715B1
(en)
|
2000-10-11 |
2006-08-29 |
R. R. Street Co. Inc. |
Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent
|
US6558432B2
(en)
*
|
1999-10-15 |
2003-05-06 |
R. R. Street & Co., Inc. |
Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent
|
US6355072B1
(en)
|
1999-10-15 |
2002-03-12 |
R.R. Street & Co. Inc. |
Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent
|
US6755871B2
(en)
|
1999-10-15 |
2004-06-29 |
R.R. Street & Co. Inc. |
Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent
|
US6748960B1
(en)
|
1999-11-02 |
2004-06-15 |
Tokyo Electron Limited |
Apparatus for supercritical processing of multiple workpieces
|
AU2001255656A1
(en)
*
|
2000-04-25 |
2001-11-07 |
Tokyo Electron Limited |
Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module
|
AU2001290171A1
(en)
*
|
2000-07-26 |
2002-02-05 |
Tokyo Electron Limited |
High pressure processing chamber for semiconductor substrate
|
AU2001279136A1
(en)
*
|
2000-07-31 |
2002-02-13 |
The Deflex Corporation |
Near critical and supercritical ozone substrate treatment and apparatus for same
|
JP2002237481A
(ja)
*
|
2001-02-09 |
2002-08-23 |
Kobe Steel Ltd |
微細構造体の洗浄方法
|
US6613157B2
(en)
|
2001-02-15 |
2003-09-02 |
Micell Technologies, Inc. |
Methods for removing particles from microelectronic structures
|
US6641678B2
(en)
|
2001-02-15 |
2003-11-04 |
Micell Technologies, Inc. |
Methods for cleaning microelectronic structures with aqueous carbon dioxide systems
|
US6596093B2
(en)
|
2001-02-15 |
2003-07-22 |
Micell Technologies, Inc. |
Methods for cleaning microelectronic structures with cyclical phase modulation
|
US6602351B2
(en)
|
2001-02-15 |
2003-08-05 |
Micell Technologies, Inc. |
Methods for the control of contaminants following carbon dioxide cleaning of microelectronic structures
|
US6562146B1
(en)
*
|
2001-02-15 |
2003-05-13 |
Micell Technologies, Inc. |
Processes for cleaning and drying microelectronic structures using liquid or supercritical carbon dioxide
|
US6905555B2
(en)
|
2001-02-15 |
2005-06-14 |
Micell Technologies, Inc. |
Methods for transferring supercritical fluids in microelectronic and other industrial processes
|
IL158340A0
(en)
*
|
2001-04-10 |
2004-05-12 |
Supercritical Systems Inc |
High pressure processing chamber for semiconductor substrate including flow enhancing features
|
US6561220B2
(en)
*
|
2001-04-23 |
2003-05-13 |
International Business Machines, Corp. |
Apparatus and method for increasing throughput in fluid processing
|
US6946055B2
(en)
*
|
2001-08-22 |
2005-09-20 |
International Business Machines Corporation |
Method for recovering an organic solvent from a waste stream containing supercritical CO2
|
US6619304B2
(en)
|
2001-09-13 |
2003-09-16 |
Micell Technologies, Inc. |
Pressure chamber assembly including non-mechanical drive means
|
US6706641B2
(en)
|
2001-09-13 |
2004-03-16 |
Micell Technologies, Inc. |
Spray member and method for using the same
|
US6782900B2
(en)
|
2001-09-13 |
2004-08-31 |
Micell Technologies, Inc. |
Methods and apparatus for cleaning and/or treating a substrate using CO2
|
US6666928B2
(en)
|
2001-09-13 |
2003-12-23 |
Micell Technologies, Inc. |
Methods and apparatus for holding a substrate in a pressure chamber
|
US6763840B2
(en)
|
2001-09-14 |
2004-07-20 |
Micell Technologies, Inc. |
Method and apparatus for cleaning substrates using liquid carbon dioxide
|
MXPA04004247A
(es)
*
|
2001-11-06 |
2004-07-08 |
Procter & Gamble |
Cepillo dental de movimiento multiple.
|
JP2003224099A
(ja)
|
2002-01-30 |
2003-08-08 |
Sony Corp |
表面処理方法
|
US6924086B1
(en)
*
|
2002-02-15 |
2005-08-02 |
Tokyo Electron Limited |
Developing photoresist with supercritical fluid and developer
|
US6928746B2
(en)
*
|
2002-02-15 |
2005-08-16 |
Tokyo Electron Limited |
Drying resist with a solvent bath and supercritical CO2
|
US6953654B2
(en)
|
2002-03-14 |
2005-10-11 |
Tokyo Electron Limited |
Process and apparatus for removing a contaminant from a substrate
|
US7128840B2
(en)
|
2002-03-26 |
2006-10-31 |
Idaho Research Foundation, Inc. |
Ultrasound enhanced process for extracting metal species in supercritical fluids
|
US6764552B1
(en)
|
2002-04-18 |
2004-07-20 |
Novellus Systems, Inc. |
Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials
|
US20030217764A1
(en)
*
|
2002-05-23 |
2003-11-27 |
Kaoru Masuda |
Process and composition for removing residues from the microstructure of an object
|
US6846380B2
(en)
*
|
2002-06-13 |
2005-01-25 |
The Boc Group, Inc. |
Substrate processing apparatus and related systems and methods
|
US20040011386A1
(en)
*
|
2002-07-17 |
2004-01-22 |
Scp Global Technologies Inc. |
Composition and method for removing photoresist and/or resist residue using supercritical fluids
|
US20040050406A1
(en)
*
|
2002-07-17 |
2004-03-18 |
Akshey Sehgal |
Compositions and method for removing photoresist and/or resist residue at pressures ranging from ambient to supercritical
|
US6905556B1
(en)
|
2002-07-23 |
2005-06-14 |
Novellus Systems, Inc. |
Method and apparatus for using surfactants in supercritical fluid processing of wafers
|
US20080004194A1
(en)
*
|
2002-09-24 |
2008-01-03 |
Air Products And Chemicals, Inc. |
Processing of semiconductor components with dense processing fluids
|
US20080000505A1
(en)
*
|
2002-09-24 |
2008-01-03 |
Air Products And Chemicals, Inc. |
Processing of semiconductor components with dense processing fluids
|
US7282099B2
(en)
*
|
2002-09-24 |
2007-10-16 |
Air Products And Chemicals, Inc. |
Dense phase processing fluids for microelectronic component manufacture
|
US7267727B2
(en)
*
|
2002-09-24 |
2007-09-11 |
Air Products And Chemicals, Inc. |
Processing of semiconductor components with dense processing fluids and ultrasonic energy
|
US6953041B2
(en)
*
|
2002-10-09 |
2005-10-11 |
Micell Technologies, Inc. |
Compositions of transition metal species in dense phase carbon dioxide and methods of use thereof
|
US20040175948A1
(en)
*
|
2002-10-10 |
2004-09-09 |
The University Of North Carolina At Chapel Hill |
Metal chelation in carbon dioxide
|
US7485611B2
(en)
*
|
2002-10-31 |
2009-02-03 |
Advanced Technology Materials, Inc. |
Supercritical fluid-based cleaning compositions and methods
|
US7223352B2
(en)
*
|
2002-10-31 |
2007-05-29 |
Advanced Technology Materials, Inc. |
Supercritical carbon dioxide/chemical formulation for ashed and unashed aluminum post-etch residue removal
|
US7011716B2
(en)
*
|
2003-04-29 |
2006-03-14 |
Advanced Technology Materials, Inc. |
Compositions and methods for drying patterned wafers during manufacture of integrated circuitry products
|
JP2004158534A
(ja)
*
|
2002-11-05 |
2004-06-03 |
Kobe Steel Ltd |
微細構造体の洗浄方法
|
US6997197B2
(en)
*
|
2002-12-13 |
2006-02-14 |
International Business Machines Corporation |
Apparatus and method for rapid thermal control of a workpiece in liquid or dense phase fluid
|
US20040112409A1
(en)
*
|
2002-12-16 |
2004-06-17 |
Supercritical Sysems, Inc. |
Fluoride in supercritical fluid for photoresist and residue removal
|
US20040154647A1
(en)
*
|
2003-02-07 |
2004-08-12 |
Supercritical Systems, Inc. |
Method and apparatus of utilizing a coating for enhanced holding of a semiconductor substrate during high pressure processing
|
US6875709B2
(en)
*
|
2003-03-07 |
2005-04-05 |
Taiwan Semiconductor Manufacturing Comapny, Ltd. |
Application of a supercritical CO2 system for curing low k dielectric materials
|
US20040198066A1
(en)
*
|
2003-03-21 |
2004-10-07 |
Applied Materials, Inc. |
Using supercritical fluids and/or dense fluids in semiconductor applications
|
US20050029492A1
(en)
*
|
2003-08-05 |
2005-02-10 |
Hoshang Subawalla |
Processing of semiconductor substrates with dense fluids comprising acetylenic diols and/or alcohols
|
WO2005038898A1
(en)
*
|
2003-10-14 |
2005-04-28 |
Ekc Technology, Inc. |
Removal of post etch residues and copper contamination from low-k dielectrics using supercritical co2 with diketone additives
|
US7741012B1
(en)
|
2004-03-01 |
2010-06-22 |
Advanced Micro Devices, Inc. |
Method for removal of immersion lithography medium in immersion lithography processes
|
US20050241672A1
(en)
*
|
2004-04-28 |
2005-11-03 |
Texas Instruments Incorporated |
Extraction of impurities in a semiconductor process with a supercritical fluid
|
US7250374B2
(en)
*
|
2004-06-30 |
2007-07-31 |
Tokyo Electron Limited |
System and method for processing a substrate using supercritical carbon dioxide processing
|
US7195676B2
(en)
*
|
2004-07-13 |
2007-03-27 |
Air Products And Chemicals, Inc. |
Method for removal of flux and other residue in dense fluid systems
|
US7307019B2
(en)
*
|
2004-09-29 |
2007-12-11 |
Tokyo Electron Limited |
Method for supercritical carbon dioxide processing of fluoro-carbon films
|
US20060065288A1
(en)
*
|
2004-09-30 |
2006-03-30 |
Darko Babic |
Supercritical fluid processing system having a coating on internal members and a method of using
|
US20060081273A1
(en)
*
|
2004-10-20 |
2006-04-20 |
Mcdermott Wayne T |
Dense fluid compositions and processes using same for article treatment and residue removal
|
US20060102204A1
(en)
*
|
2004-11-12 |
2006-05-18 |
Tokyo Electron Limited |
Method for removing a residue from a substrate using supercritical carbon dioxide processing
|
US20060102208A1
(en)
*
|
2004-11-12 |
2006-05-18 |
Tokyo Electron Limited |
System for removing a residue from a substrate using supercritical carbon dioxide processing
|
US20060102590A1
(en)
*
|
2004-11-12 |
2006-05-18 |
Tokyo Electron Limited |
Method for treating a substrate with a high pressure fluid using a preoxide-based process chemistry
|
US7491036B2
(en)
*
|
2004-11-12 |
2009-02-17 |
Tokyo Electron Limited |
Method and system for cooling a pump
|
US20060135047A1
(en)
*
|
2004-12-22 |
2006-06-22 |
Alexei Sheydayi |
Method and apparatus for clamping a substrate in a high pressure processing system
|
US7140393B2
(en)
*
|
2004-12-22 |
2006-11-28 |
Tokyo Electron Limited |
Non-contact shuttle valve for flow diversion in high pressure systems
|
US7434590B2
(en)
*
|
2004-12-22 |
2008-10-14 |
Tokyo Electron Limited |
Method and apparatus for clamping a substrate in a high pressure processing system
|
US7291565B2
(en)
*
|
2005-02-15 |
2007-11-06 |
Tokyo Electron Limited |
Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid
|
US20060180572A1
(en)
*
|
2005-02-15 |
2006-08-17 |
Tokyo Electron Limited |
Removal of post etch residue for a substrate with open metal surfaces
|
US20060180174A1
(en)
*
|
2005-02-15 |
2006-08-17 |
Tokyo Electron Limited |
Method and system for treating a substrate with a high pressure fluid using a peroxide-based process chemistry in conjunction with an initiator
|
US7435447B2
(en)
*
|
2005-02-15 |
2008-10-14 |
Tokyo Electron Limited |
Method and system for determining flow conditions in a high pressure processing system
|
US20060255012A1
(en)
*
|
2005-05-10 |
2006-11-16 |
Gunilla Jacobson |
Removal of particles from substrate surfaces using supercritical processing
|
US7789971B2
(en)
*
|
2005-05-13 |
2010-09-07 |
Tokyo Electron Limited |
Treatment of substrate using functionalizing agent in supercritical carbon dioxide
|
US7524383B2
(en)
*
|
2005-05-25 |
2009-04-28 |
Tokyo Electron Limited |
Method and system for passivating a processing chamber
|
US20070012337A1
(en)
*
|
2005-07-15 |
2007-01-18 |
Tokyo Electron Limited |
In-line metrology for supercritical fluid processing
|
JP4963815B2
(ja)
*
|
2005-09-07 |
2012-06-27 |
ソニー株式会社 |
洗浄方法および半導体装置の製造方法
|
JP2007251081A
(ja)
*
|
2006-03-20 |
2007-09-27 |
Dainippon Screen Mfg Co Ltd |
基板処理方法
|
US10144874B2
(en)
*
|
2013-03-15 |
2018-12-04 |
Terrapower, Llc |
Method and system for performing thermochemical conversion of a carbonaceous feedstock to a reaction product
|
CN110899248A
(zh)
*
|
2019-06-21 |
2020-03-24 |
杭州杭氧股份有限公司 |
一种利用超临界流体批量清洗超高纯气体钢瓶的***及其方法
|