DE69703395D1 - Projection apparatus for scanning exposure and method of manufacturing an apparatus using the same - Google Patents

Projection apparatus for scanning exposure and method of manufacturing an apparatus using the same

Info

Publication number
DE69703395D1
DE69703395D1 DE69703395T DE69703395T DE69703395D1 DE 69703395 D1 DE69703395 D1 DE 69703395D1 DE 69703395 T DE69703395 T DE 69703395T DE 69703395 T DE69703395 T DE 69703395T DE 69703395 D1 DE69703395 D1 DE 69703395D1
Authority
DE
Germany
Prior art keywords
manufacturing
same
scanning exposure
projection apparatus
projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69703395T
Other languages
German (de)
Other versions
DE69703395T2 (en
Inventor
Kazuhiko Mishima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP02162596A external-priority patent/JP3514401B2/en
Priority claimed from JP35224296A external-priority patent/JP3495868B2/en
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69703395D1 publication Critical patent/DE69703395D1/en
Publication of DE69703395T2 publication Critical patent/DE69703395T2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE69703395T 1996-01-16 1997-01-14 Scanning exposure projection apparatus and method of manufacturing a device using the same Expired - Lifetime DE69703395T2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP02162596A JP3514401B2 (en) 1996-01-16 1996-01-16 Scanning exposure apparatus and method, and semiconductor device manufacturing method
JP35224296A JP3495868B2 (en) 1996-12-11 1996-12-11 Scanning projection exposure apparatus and device manufacturing method using the same

Publications (2)

Publication Number Publication Date
DE69703395D1 true DE69703395D1 (en) 2000-12-07
DE69703395T2 DE69703395T2 (en) 2001-03-29

Family

ID=26358715

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69703395T Expired - Lifetime DE69703395T2 (en) 1996-01-16 1997-01-14 Scanning exposure projection apparatus and method of manufacturing a device using the same

Country Status (4)

Country Link
US (2) US6335784B2 (en)
EP (2) EP0785472B1 (en)
KR (1) KR100223228B1 (en)
DE (1) DE69703395T2 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001119006A (en) * 1999-10-19 2001-04-27 Sony Corp Imaging device and manufacturing method therefor
JP2002043214A (en) * 2000-07-26 2002-02-08 Toshiba Corp Method for scanning exposure
JP4046961B2 (en) * 2001-09-03 2008-02-13 キヤノン株式会社 Position detection method, position detection apparatus, exposure apparatus, and exposure method
JP2003092248A (en) 2001-09-17 2003-03-28 Canon Inc Position detection apparatus and positioning apparatus and their methods, projection aligner, and manufacturing method of device
JP2005045164A (en) * 2003-07-25 2005-02-17 Toshiba Corp Automatic focusing device
US6968288B2 (en) * 2003-08-04 2005-11-22 International Business Machines Corporation Method for detection of photolithographic defocus
JP2005166785A (en) * 2003-12-01 2005-06-23 Canon Inc Device and method for detecting position and aligner
US7256866B2 (en) * 2004-10-12 2007-08-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006216865A (en) * 2005-02-04 2006-08-17 Canon Inc Method and device for discrimination, exposure device and device manufacturing method
US8577119B2 (en) * 2006-02-24 2013-11-05 Hitachi High-Technologies Corporation Wafer surface observing method and apparatus
JP2009192271A (en) * 2008-02-12 2009-08-27 Canon Inc Position detection method, exposure apparatus, and device manufacturing method
JP5147618B2 (en) * 2008-09-25 2013-02-20 キヤノン株式会社 Evaluation method and exposure apparatus
JP5406510B2 (en) * 2008-11-18 2014-02-05 キヤノン株式会社 Scanning exposure apparatus and device manufacturing method
NL2005414A (en) * 2009-10-28 2011-05-02 Asml Netherlands Bv Lithographic apparatus and patterning device.
NL2007634A (en) 2010-12-13 2012-06-15 Asml Netherlands Bv Lithographic apparatus and method.
US9411223B2 (en) * 2012-09-10 2016-08-09 Globalfoundries Inc. On-product focus offset metrology for use in semiconductor chip manufacturing
US9411249B2 (en) 2013-09-23 2016-08-09 Globalfoundries Inc. Differential dose and focus monitor
JP2014143429A (en) * 2014-03-07 2014-08-07 Canon Inc Exposure device, exposure method, and device manufacturing method
CN105527796B (en) * 2014-09-28 2018-03-13 上海微电子装备（集团）股份有限公司 Planer-type equipment and control method
CN105800919B (en) * 2014-12-31 2018-06-26 上海微电子装备（集团）股份有限公司 A kind of laser glass packaging system and calibration method
CN106271122B (en) * 2015-05-29 2019-01-18 上海微电子装备（集团）股份有限公司 A kind of vertical control device and method of laser package equipment
US9899183B1 (en) * 2016-07-28 2018-02-20 Globalfoundries Inc. Structure and method to measure focus-dependent pattern shift in integrated circuit imaging
KR20240034696A (en) * 2021-07-21 2024-03-14 오르보테크 엘티디. Height measurement through lens

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5416562A (en) * 1992-03-06 1995-05-16 Nikon Corporation Method of detecting a position and apparatus therefor
JPH06168867A (en) * 1992-11-30 1994-06-14 Nikon Corp Aligner and exposure method
JP3336649B2 (en) 1992-12-25 2002-10-21 株式会社ニコン Exposure apparatus, exposure method, device manufacturing method including the exposure method, and device manufactured by the device manufacturing method
JP3301153B2 (en) * 1993-04-06 2002-07-15 株式会社ニコン Projection exposure apparatus, exposure method, and element manufacturing method
JP3211491B2 (en) * 1993-06-07 2001-09-25 キヤノン株式会社 Projection exposure apparatus and semiconductor manufacturing method and apparatus using the same
US5640227A (en) 1993-12-06 1997-06-17 Nikon Corporation Exposure apparatus and exposure method for minimizing defocusing of the transferred pattern
JP3360401B2 (en) 1994-03-28 2002-12-24 株式会社ニコン Projection exposure equipment
JPH07221012A (en) 1993-12-06 1995-08-18 Nikon Corp Aligner
US6118515A (en) * 1993-12-08 2000-09-12 Nikon Corporation Scanning exposure method
JP3368091B2 (en) * 1994-04-22 2003-01-20 キヤノン株式会社 Projection exposure apparatus and device manufacturing method
US5841520A (en) * 1995-08-09 1998-11-24 Nikon Corporatioin Exposure apparatus and method that use mark patterns to determine image formation characteristics of the apparatus prior to exposure
JP3918200B2 (en) * 1995-11-16 2007-05-23 株式会社ニコン Lithographic apparatus manufacturing method and lithographic apparatus

Also Published As

Publication number Publication date
KR970059840A (en) 1997-08-12
DE69703395T2 (en) 2001-03-29
US6335784B2 (en) 2002-01-01
EP0785472B1 (en) 2000-11-02
EP1001313A1 (en) 2000-05-17
US20010012098A1 (en) 2001-08-09
US20020048006A1 (en) 2002-04-25
EP0785472A2 (en) 1997-07-23
EP0785472A3 (en) 1998-01-21
KR100223228B1 (en) 1999-10-15

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Legal Events

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