DE69617254D1 - Laservorrichtung - Google Patents

Laservorrichtung

Info

Publication number
DE69617254D1
DE69617254D1 DE69617254T DE69617254T DE69617254D1 DE 69617254 D1 DE69617254 D1 DE 69617254D1 DE 69617254 T DE69617254 T DE 69617254T DE 69617254 T DE69617254 T DE 69617254T DE 69617254 D1 DE69617254 D1 DE 69617254D1
Authority
DE
Germany
Prior art keywords
laser device
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69617254T
Other languages
English (en)
Other versions
DE69617254T2 (de
Inventor
Hakaru Mizoguchi
Osamu Wakabayashi
Yukio Kobayashi
Yoshiho Amada
Tatsuo Mimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Komatsu Ltd
Original Assignee
Komatsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP24968395A external-priority patent/JP3413510B2/ja
Priority claimed from JP05778396A external-priority patent/JP3864287B2/ja
Application filed by Komatsu Ltd filed Critical Komatsu Ltd
Application granted granted Critical
Publication of DE69617254D1 publication Critical patent/DE69617254D1/de
Publication of DE69617254T2 publication Critical patent/DE69617254T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70041—Production of exposure light, i.e. light sources by pulsed sources, e.g. multiplexing, pulse duration, interval control or intensity control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70025—Production of exposure light, i.e. light sources by lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/13—Stabilisation of laser output parameters, e.g. frequency or amplitude
    • H01S3/131—Stabilisation of laser output parameters, e.g. frequency or amplitude by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
    • H01S3/134—Stabilisation of laser output parameters, e.g. frequency or amplitude by controlling the active medium, e.g. by controlling the processes or apparatus for excitation in gas lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
    • H01S3/22—Gases
    • H01S3/223—Gases the active gas being polyatomic, i.e. containing two or more atoms
    • H01S3/225—Gases the active gas being polyatomic, i.e. containing two or more atoms comprising an excimer or exciplex

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Lasers (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laser Beam Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE69617254T 1995-09-27 1996-09-27 Laservorrichtung Expired - Fee Related DE69617254T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP24968395A JP3413510B2 (ja) 1995-09-27 1995-09-27 レーザ装置
JP05778396A JP3864287B2 (ja) 1996-03-14 1996-03-14 レーザ装置
PCT/JP1996/002820 WO1997011810A1 (fr) 1995-09-27 1996-09-27 Appareil laser

Publications (2)

Publication Number Publication Date
DE69617254D1 true DE69617254D1 (de) 2002-01-03
DE69617254T2 DE69617254T2 (de) 2002-07-04

Family

ID=26398854

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69617254T Expired - Fee Related DE69617254T2 (de) 1995-09-27 1996-09-27 Laservorrichtung

Country Status (6)

Country Link
US (1) US6008497A (de)
EP (1) EP0854003B1 (de)
KR (1) KR19980702629A (de)
DE (1) DE69617254T2 (de)
TW (1) TW343396B (de)
WO (1) WO1997011810A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3830591B2 (ja) * 1996-11-05 2006-10-04 株式会社小松製作所 レーザ装置
US6727731B1 (en) * 1999-03-12 2004-04-27 Lambda Physik Ag Energy control for an excimer or molecular fluorine laser
DE19983950T1 (de) * 1999-04-27 2002-08-01 Mitsubishi Electric Corp Verfahren zum Steuern der Arbeitsbedingungen einer Laserarbeitsmaschine und ein computerlesbares Speichermedium
WO2001061514A1 (en) * 2000-02-16 2001-08-23 Cymer, Inc. Process monitoring system for lithography lasers
US6408260B1 (en) * 2000-02-16 2002-06-18 Cymer, Inc. Laser lithography quality alarm system
US6618403B2 (en) 2000-03-16 2003-09-09 Lambda Physik Ag Method and apparatus for compensation of beam property drifts detected by measurement systems outside of an excimer laser
US6697695B1 (en) * 2000-04-25 2004-02-24 Komatsu Ltd. Laser device management system
US7095497B2 (en) * 2001-06-27 2006-08-22 Canon Kabushiki Kaisha Beam splitting apparatus, transmittance measurement apparatus, and exposure apparatus
US20060096956A1 (en) * 2001-10-19 2006-05-11 Mitsubishi Denki Kabushiki Kaisha Method of controlling working conditions of a laser working machine and a computer-readable storage medium
US6914920B2 (en) 2002-02-26 2005-07-05 Xtreme Technologies Gmbh Method for energy stabilization of gas discharged pumped in selected impulse following driven beam sources
DE10329360B4 (de) * 2002-07-01 2008-08-28 Canon K.K. Doppelbrechungsmessgerät, Spannungsentfernungseinrichtung, Polarimeter und Belichtungsgerät
US6998567B2 (en) * 2003-01-31 2006-02-14 Trimedyne, Inc. Generation and application of efficient solid-state laser pulse trains
US8518030B2 (en) * 2006-03-10 2013-08-27 Amo Manufacturing Usa, Llc Output energy control for lasers
JP4917382B2 (ja) * 2006-08-09 2012-04-18 株式会社ディスコ レーザー光線照射装置およびレーザー加工機
JP5371838B2 (ja) 2010-03-10 2013-12-18 株式会社フジクラ ファイバレーザ装置
KR20140124374A (ko) * 2012-02-10 2014-10-24 아사히 가라스 가부시키가이샤 기판을 드릴링하는 디바이스 및 기판을 드릴링하는 방법
WO2014030645A1 (ja) 2012-08-23 2014-02-27 ギガフォトン株式会社 光源装置及びデータ処理方法
TWI523357B (zh) * 2013-03-19 2016-02-21 Sumitomo Heavy Industries Laser processing device and laser processing method
WO2014208111A1 (ja) 2013-06-27 2014-12-31 ギガフォトン株式会社 光ビーム計測装置、レーザ装置及び光ビーム分離装置
JP6845255B2 (ja) * 2016-12-05 2021-03-17 ギガフォトン株式会社 レーザ装置
US20180207748A1 (en) * 2017-01-23 2018-07-26 Lumentum Operations Llc Machining processes using a random trigger feature for an ultrashort pulse laser
CN114077163B (zh) * 2020-08-14 2023-03-31 长鑫存储技术有限公司 光罩传送装置及曝光***

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4302782A (en) * 1977-03-10 1981-11-24 Xerox Corporation Reproduction scanning system having intermediate storage between input and output scanning stations
JP3580430B2 (ja) * 1991-12-18 2004-10-20 株式会社ニコン 露光システム及び露光方法
JP2738796B2 (ja) * 1992-06-08 1998-04-08 三菱電機株式会社 パルスレーザ装置
JP2779566B2 (ja) * 1992-07-17 1998-07-23 株式会社小松製作所 エキシマレーザ装置の制御装置
JP2631080B2 (ja) * 1993-10-05 1997-07-16 株式会社小松製作所 レーザ装置の出力制御装置

Also Published As

Publication number Publication date
EP0854003A1 (de) 1998-07-22
US6008497A (en) 1999-12-28
TW343396B (en) 1998-10-21
WO1997011810A1 (fr) 1997-04-03
EP0854003B1 (de) 2001-11-21
DE69617254T2 (de) 2002-07-04
KR19980702629A (ko) 1998-08-05
EP0854003A4 (de) 1998-12-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee