DE69612258D1 - Niedrigschmelzende Weichlotlegierung enthaltende Gegenstände - Google Patents

Niedrigschmelzende Weichlotlegierung enthaltende Gegenstände

Info

Publication number
DE69612258D1
DE69612258D1 DE69612258T DE69612258T DE69612258D1 DE 69612258 D1 DE69612258 D1 DE 69612258D1 DE 69612258 T DE69612258 T DE 69612258T DE 69612258 T DE69612258 T DE 69612258T DE 69612258 D1 DE69612258 D1 DE 69612258D1
Authority
DE
Germany
Prior art keywords
melting point
low melting
solder alloy
containing low
soft solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69612258T
Other languages
English (en)
Other versions
DE69612258T2 (de
Inventor
Mark Thomas Mccormack
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of DE69612258D1 publication Critical patent/DE69612258D1/de
Application granted granted Critical
Publication of DE69612258T2 publication Critical patent/DE69612258T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE1996612258 1995-10-30 1996-10-22 Niedrigschmelzende Weichlotlegierung enthaltende Gegenstände Expired - Lifetime DE69612258T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US55014595A 1995-10-30 1995-10-30

Publications (2)

Publication Number Publication Date
DE69612258D1 true DE69612258D1 (de) 2001-05-03
DE69612258T2 DE69612258T2 (de) 2001-11-15

Family

ID=24195933

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1996612258 Expired - Lifetime DE69612258T2 (de) 1995-10-30 1996-10-22 Niedrigschmelzende Weichlotlegierung enthaltende Gegenstände

Country Status (4)

Country Link
EP (1) EP0770449B1 (de)
JP (1) JP3305596B2 (de)
DE (1) DE69612258T2 (de)
MX (1) MX9605015A (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050199323A1 (en) * 2004-03-15 2005-09-15 Nielson Daniel B. Reactive material enhanced munition compositions and projectiles containing same
US7977420B2 (en) 2000-02-23 2011-07-12 Alliant Techsystems Inc. Reactive material compositions, shot shells including reactive materials, and a method of producing same
USRE45899E1 (en) 2000-02-23 2016-02-23 Orbital Atk, Inc. Low temperature, extrudable, high density reactive materials
FR2867469A1 (fr) * 2004-03-15 2005-09-16 Alliant Techsystems Inc Compositions reactives contenant un metal, et leur procede de production
EP2116807A2 (de) 2005-10-04 2009-11-11 Alliant Techsystems Inc. Mit reaktivem Material erweiterte Projektile und zugehörige Verfahren
CN105870238B (zh) * 2015-01-23 2018-05-08 比亚迪股份有限公司 一种光伏焊带和一种光伏组件
CN105127611A (zh) * 2015-09-28 2015-12-09 苏州龙腾万里化工科技有限公司 一种低温锡膏

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR939104A (fr) * 1944-03-11 1948-11-04 Philips Nv Soudure douce
FR2496525A1 (fr) * 1980-12-18 1982-06-25 Alliages Etain Derives Procede d'elaboration de soudure mate, notamment destinee a l'electronique ainsi que soudure obtenue par la mise en oeuvre de ce procede
DE3730764C1 (de) * 1987-09-12 1988-07-14 Demetron Verwendung von Legierungen aus Zinn und/oder Blei als Weichlote zum Aufbringen von Halbleitern auf metallische Traeger
SU1500455A1 (ru) * 1987-11-24 1989-08-15 Институт Электросварки Им.Е.О.Патона Припой дл низкотемпературной пайки
JPH0636446A (ja) * 1992-07-20 1994-02-10 Csk Corp プリペイドカード検査装置及び検査方式
JPH07336043A (ja) * 1994-04-15 1995-12-22 Hitachi Ltd はんだ、はんだ接続方法および電子部品の実装構造体

Also Published As

Publication number Publication date
JP3305596B2 (ja) 2002-07-22
DE69612258T2 (de) 2001-11-15
JPH09122968A (ja) 1997-05-13
MX9605015A (es) 1997-04-30
EP0770449A1 (de) 1997-05-02
EP0770449B1 (de) 2001-03-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition