DE69602996D1 - Temperaturgeregelter Halbleiterlasergerät und Temperaturregelungsverfahren - Google Patents
Temperaturgeregelter Halbleiterlasergerät und TemperaturregelungsverfahrenInfo
- Publication number
- DE69602996D1 DE69602996D1 DE69602996T DE69602996T DE69602996D1 DE 69602996 D1 DE69602996 D1 DE 69602996D1 DE 69602996 T DE69602996 T DE 69602996T DE 69602996 T DE69602996 T DE 69602996T DE 69602996 D1 DE69602996 D1 DE 69602996D1
- Authority
- DE
- Germany
- Prior art keywords
- control method
- semiconductor laser
- laser device
- temperature
- controlled semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/645—Heat extraction or cooling elements the elements being electrically controlled, e.g. Peltier elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7210888A JP2697700B2 (ja) | 1995-08-18 | 1995-08-18 | 温度制御型半導体レーザ装置およびその温度制御方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69602996D1 true DE69602996D1 (de) | 1999-07-29 |
DE69602996T2 DE69602996T2 (de) | 2000-02-24 |
Family
ID=16596760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69602996T Expired - Fee Related DE69602996T2 (de) | 1995-08-18 | 1996-08-09 | Temperaturgeregelter Halbleiterlasergerät und Temperaturregelungsverfahren |
Country Status (4)
Country | Link |
---|---|
US (1) | US5875204A (de) |
EP (1) | EP0762567B1 (de) |
JP (1) | JP2697700B2 (de) |
DE (1) | DE69602996T2 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11121871A (ja) * | 1997-10-15 | 1999-04-30 | Fujitsu Ltd | ペルチェ素子を有するモジュール |
JP2000022263A (ja) * | 1998-06-29 | 2000-01-21 | Murata Mfg Co Ltd | 半導体レーザ駆動回路および半導体レーザ装置 |
JP3470614B2 (ja) * | 1998-09-30 | 2003-11-25 | 住友電気工業株式会社 | 発光素子モジュール |
US6385222B1 (en) | 1998-11-19 | 2002-05-07 | The Furukawa Electric Co., Ltd. | Semiconductor laser module, and method for driving the semiconductor laser module |
US6301279B1 (en) * | 1999-04-16 | 2001-10-09 | Princeton Lightwave Inc. | Semiconductor diode lasers with thermal sensor control of the active region temperature |
CA2335529A1 (en) | 1999-04-20 | 2000-10-26 | Yuichiro Irie | Laser diode module |
US6996145B2 (en) | 1999-11-01 | 2006-02-07 | The Furukawa Electric Co., Ltd. | Semiconductor laser module, and method for driving the semiconductor laser module |
EP1168537A1 (de) * | 2000-06-22 | 2002-01-02 | The Furukawa Electric Co., Ltd. | Halbleiterlasermodul und Verfahren zur Ansteuerung eines Halbleiterlasermodules |
US6546030B2 (en) * | 2000-06-29 | 2003-04-08 | Fuji Photo Film Co., Ltd. | Semiconductor laser unit employing an inorganic adhesive |
DE10117020C2 (de) * | 2001-04-05 | 2003-05-08 | Unique M O D E Ag | Optisches oder optoelektronisches Modul |
DE102004047682A1 (de) * | 2004-09-30 | 2006-04-06 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | LED-Array |
DE102009003936B4 (de) * | 2009-01-05 | 2011-02-24 | Siemens Aktiengesellschaft | Licht emittierendes Bauelement mit einer Konverterkeramik und einer Kühleinrichtung |
CN103606546B (zh) * | 2013-11-28 | 2017-06-20 | 华为技术有限公司 | 光器件 |
CN104767103B (zh) | 2015-03-30 | 2017-12-19 | 青岛海信宽带多媒体技术有限公司 | 一种激光器用连接结构及激光器组件 |
CN104836619B (zh) | 2015-03-30 | 2017-08-29 | 青岛海信宽带多媒体技术有限公司 | 一种光器件 |
CN110625256B (zh) * | 2019-10-18 | 2021-06-15 | 中南大学 | 蝶形激光器光纤耦合与焊接装置 |
CN111551519A (zh) * | 2020-05-19 | 2020-08-18 | 武汉奥博奥科技有限公司 | 一种氧气检测垂直腔面发射激光器 |
CN115692218A (zh) * | 2021-07-21 | 2023-02-03 | 华为技术有限公司 | 一种光发射组件、光发射组件的封装方法和相关设备 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59152681A (ja) * | 1983-02-21 | 1984-08-31 | Hitachi Ltd | 光通信装置 |
JPH0728077B2 (ja) * | 1986-04-16 | 1995-03-29 | 株式会社トプコン | 半導体レ−ザ−の発振周波数・発振出力安定化装置 |
JPH01122183A (ja) * | 1987-11-06 | 1989-05-15 | Hitachi Ltd | 半導体レーザ装置 |
US5068865A (en) * | 1988-06-09 | 1991-11-26 | Nec Corporation | Semiconductor laser module |
US5216544A (en) * | 1988-08-26 | 1993-06-01 | Fuji Photo Film Co., Ltd. | Beam-combining laser beam source device |
JP3035852B2 (ja) * | 1990-07-18 | 2000-04-24 | 富士通株式会社 | 半導体レーザモジュール |
JPH04112591A (ja) * | 1990-09-03 | 1992-04-14 | Fujitsu Ltd | 半導体レーザモジュール |
US5266803A (en) * | 1991-03-03 | 1993-11-30 | Bio-Rad Labratories, Inc. | Fiber optic storage phosphor imaging plate scanner |
US5399877A (en) * | 1991-06-03 | 1995-03-21 | The United States Of America As Represented By The Administrator Of The National Aeronautice And Space Administration | Radiation sensitive area detection device and method |
US5267252A (en) * | 1991-08-30 | 1993-11-30 | Hoya Corporation | Solid-state laser device comprising a temperature-controlled thermal conductive support |
US5181214A (en) * | 1991-11-18 | 1993-01-19 | Harmonic Lightwaves, Inc. | Temperature stable solid-state laser package |
AU659270B2 (en) * | 1992-02-20 | 1995-05-11 | Sony Corporation | Laser light beam generating apparatus |
JPH07142803A (ja) * | 1993-11-12 | 1995-06-02 | Fuji Photo Film Co Ltd | レーザーダイオードポンピング固体レーザー |
-
1995
- 1995-08-18 JP JP7210888A patent/JP2697700B2/ja not_active Expired - Fee Related
-
1996
- 1996-08-08 US US08/694,159 patent/US5875204A/en not_active Expired - Fee Related
- 1996-08-09 EP EP96112889A patent/EP0762567B1/de not_active Expired - Lifetime
- 1996-08-09 DE DE69602996T patent/DE69602996T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5875204A (en) | 1999-02-23 |
DE69602996T2 (de) | 2000-02-24 |
EP0762567B1 (de) | 1999-06-23 |
JPH0964450A (ja) | 1997-03-07 |
JP2697700B2 (ja) | 1998-01-14 |
EP0762567A1 (de) | 1997-03-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |