DE69530490D1 - Wärmeableiter für elektronische Anordnungen - Google Patents

Wärmeableiter für elektronische Anordnungen

Info

Publication number
DE69530490D1
DE69530490D1 DE69530490T DE69530490T DE69530490D1 DE 69530490 D1 DE69530490 D1 DE 69530490D1 DE 69530490 T DE69530490 T DE 69530490T DE 69530490 T DE69530490 T DE 69530490T DE 69530490 D1 DE69530490 D1 DE 69530490D1
Authority
DE
Germany
Prior art keywords
heat sink
electronic arrangements
arrangements
electronic
sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69530490T
Other languages
English (en)
Inventor
Renato Poinelli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
STMicroelectronics SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SRL filed Critical STMicroelectronics SRL
Application granted granted Critical
Publication of DE69530490D1 publication Critical patent/DE69530490D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69530490T 1995-11-30 1995-11-30 Wärmeableiter für elektronische Anordnungen Expired - Lifetime DE69530490D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP95830499A EP0777270B1 (de) 1995-11-30 1995-11-30 Wärmeableiter für elektronische Anordnungen

Publications (1)

Publication Number Publication Date
DE69530490D1 true DE69530490D1 (de) 2003-05-28

Family

ID=8222068

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69530490T Expired - Lifetime DE69530490D1 (de) 1995-11-30 1995-11-30 Wärmeableiter für elektronische Anordnungen

Country Status (2)

Country Link
EP (1) EP0777270B1 (de)
DE (1) DE69530490D1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1341230A1 (de) * 2002-02-27 2003-09-03 Spark Electronic S.R.L. Wärmesenke für integrierte Schaltkreise
US6639803B1 (en) 2002-07-11 2003-10-28 International Business Machines Corporation Compliant heat sink device/mounting system interconnect and a method of implementing same
DE102005012216B4 (de) * 2005-03-15 2008-11-13 Infineon Technologies Ag Oberflächenmontiertes Halbleiterbauteil mit Kühlkörper und Montageverfahren
TWI401017B (zh) * 2010-05-25 2013-07-01 Sunonwealth Electr Mach Ind Co 散熱模組之結合方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8531565D0 (en) * 1985-12-21 1986-02-05 Marston Palmer Ltd Heat sink
JPH0249457A (ja) * 1988-08-10 1990-02-19 Mitsubishi Electric Corp 半導体装置
EP0484180A1 (de) * 1990-11-01 1992-05-06 Fujitsu Limited Verkapselte Halbleiteranordnung mit optimierter Wärmeabführung
US5295043A (en) * 1992-02-03 1994-03-15 Tandon Corporation Clip-on heat sink and method of cooling a computer chip package
DE69304304T2 (de) * 1993-04-05 1997-01-02 Sgs Thomson Microelectronics Kombination einer elektronischen Halbleiteranordnung und einer Wärmesenke
US5367433A (en) * 1993-09-27 1994-11-22 Blomquist Michael L Package clip on heat sink
DE9409045U1 (de) * 1994-06-03 1994-09-01 Fischer Elektronik GmbH & Co. KG, 58511 Lüdenscheid Kühlkörper für Mikroprozessoren
DE9417497U1 (de) * 1994-06-03 1995-01-26 Fischer Elektronik GmbH & Co. KG, 58511 Lüdenscheid Kühlkörper für Mikroprozessoren
DE29500423U1 (de) * 1995-01-12 1995-03-02 Lin, Jen-Cheng, Taipeh/T'ai-pei Aufbau einer CPU-Wärmeabstrahlvorrichtung

Also Published As

Publication number Publication date
EP0777270A1 (de) 1997-06-04
EP0777270B1 (de) 2003-04-23

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Legal Events

Date Code Title Description
8332 No legal effect for de