DE69500415D1 - Laserätzverfahren - Google Patents
LaserätzverfahrenInfo
- Publication number
- DE69500415D1 DE69500415D1 DE69500415T DE69500415T DE69500415D1 DE 69500415 D1 DE69500415 D1 DE 69500415D1 DE 69500415 T DE69500415 T DE 69500415T DE 69500415 T DE69500415 T DE 69500415T DE 69500415 D1 DE69500415 D1 DE 69500415D1
- Authority
- DE
- Germany
- Prior art keywords
- etching process
- laser etching
- laser
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP94200436 | 1994-02-22 | ||
PCT/IB1995/000059 WO1995022881A1 (en) | 1994-02-22 | 1995-01-27 | Laser etching method |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69500415D1 true DE69500415D1 (de) | 1997-08-14 |
DE69500415T2 DE69500415T2 (de) | 1998-02-05 |
Family
ID=8216656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69500415T Expired - Fee Related DE69500415T2 (de) | 1994-02-22 | 1995-01-27 | Laserätzverfahren |
Country Status (5)
Country | Link |
---|---|
US (1) | US6617541B1 (de) |
EP (1) | EP0699375B1 (de) |
JP (1) | JP3633622B2 (de) |
DE (1) | DE69500415T2 (de) |
WO (1) | WO1995022881A1 (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6236442B1 (en) * | 1998-09-03 | 2001-05-22 | Eastman Kodak Company | Method of making liquid crystal display having patterned conductive images |
US6662439B1 (en) | 1999-10-04 | 2003-12-16 | Roche Diagnostics Corporation | Laser defined features for patterned laminates and electrodes |
US6645359B1 (en) | 2000-10-06 | 2003-11-11 | Roche Diagnostics Corporation | Biosensor |
US20050103624A1 (en) | 1999-10-04 | 2005-05-19 | Bhullar Raghbir S. | Biosensor and method of making |
US7073246B2 (en) | 1999-10-04 | 2006-07-11 | Roche Diagnostics Operations, Inc. | Method of making a biosensor |
US6762124B2 (en) | 2001-02-14 | 2004-07-13 | Avery Dennison Corporation | Method for patterning a multilayered conductor/substrate structure |
US20020110673A1 (en) * | 2001-02-14 | 2002-08-15 | Ramin Heydarpour | Multilayered electrode/substrate structures and display devices incorporating the same |
US6727970B2 (en) | 2001-06-25 | 2004-04-27 | Avery Dennison Corporation | Method of making a hybrid display device having a rigid substrate and a flexible substrate |
US6856086B2 (en) | 2001-06-25 | 2005-02-15 | Avery Dennison Corporation | Hybrid display device |
US6814844B2 (en) * | 2001-08-29 | 2004-11-09 | Roche Diagnostics Corporation | Biosensor with code pattern |
ITMI20011889A1 (it) * | 2001-09-10 | 2003-03-10 | Elmiva S A S Di Walter Mantega | Procedimento contro la falsificazione e la contraffazione di documenti di valore in particolare banconote |
US6866758B2 (en) | 2002-03-21 | 2005-03-15 | Roche Diagnostics Corporation | Biosensor |
US6811815B2 (en) | 2002-06-14 | 2004-11-02 | Avery Dennison Corporation | Method for roll-to-roll deposition of optically transparent and high conductivity metallic thin films |
ES2675787T3 (es) | 2003-06-20 | 2018-07-12 | F. Hoffmann-La Roche Ag | Método y reactivo para producir tiras reactivas estrechas y homogéneas |
US7655152B2 (en) * | 2004-04-26 | 2010-02-02 | Hewlett-Packard Development Company, L.P. | Etching |
KR100606441B1 (ko) * | 2004-04-30 | 2006-08-01 | 엘지.필립스 엘시디 주식회사 | 클리체 제조방법 및 이를 이용한 패턴 형성방법 |
KR20070085381A (ko) * | 2004-12-21 | 2007-08-27 | 아사히 가라스 가부시키가이샤 | 투명 도전막 부착 기판과 그 패터닝 방법 |
US8234804B1 (en) | 2005-05-31 | 2012-08-07 | Janet Rush | Laser etched article with illuminable housing |
US20070210420A1 (en) * | 2006-03-11 | 2007-09-13 | Nelson Curt L | Laser delamination of thin metal film using sacrificial polymer layer |
US20080083706A1 (en) * | 2006-10-05 | 2008-04-10 | Mu-Gahat Enterprises, Llc | Reverse side film laser circuit etching |
US7633035B2 (en) * | 2006-10-05 | 2009-12-15 | Mu-Gahat Holdings Inc. | Reverse side film laser circuit etching |
US20090061112A1 (en) * | 2007-08-27 | 2009-03-05 | Mu-Gahat Enterprises, Llc | Laser circuit etching by subtractive deposition |
US20090061251A1 (en) * | 2007-08-27 | 2009-03-05 | Mu-Gahat Enterprises, Llc | Laser circuit etching by additive deposition |
US7943022B2 (en) | 2007-09-04 | 2011-05-17 | Lifescan, Inc. | Analyte test strip with improved reagent deposition |
JP5039999B2 (ja) * | 2007-11-08 | 2012-10-03 | スタンレー電気株式会社 | 液晶表示装置の製造方法 |
CN101572215B (zh) * | 2008-04-28 | 2011-04-27 | 财团法人工业技术研究院 | 图案化金属层及薄膜晶体管的制作方法 |
DE102008041059A1 (de) * | 2008-08-06 | 2010-02-04 | Q-Cells Ag | Verfahren zur Herstellung einer strukturiert prozessierten oder strukturiert beschichteten Substratoberfläche |
KR101475299B1 (ko) * | 2008-08-20 | 2014-12-23 | 삼성디스플레이 주식회사 | 액정 표시 장치 및 그의 제조 방법 |
US8257603B2 (en) * | 2008-08-29 | 2012-09-04 | Corning Incorporated | Laser patterning of glass bodies |
US8524139B2 (en) * | 2009-08-10 | 2013-09-03 | FEI Compay | Gas-assisted laser ablation |
JP5931067B2 (ja) | 2010-09-06 | 2016-06-08 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 基板シート |
WO2013026463A1 (en) * | 2011-08-19 | 2013-02-28 | Universita' Degli Studi Di Padova | Laser scribing process |
CN104465462B (zh) * | 2014-12-16 | 2017-06-23 | 桂林电子科技大学 | 一种激光刻蚀用于磁控溅射薄膜图案化的制作方法 |
EP3047932B1 (de) * | 2015-01-21 | 2018-12-26 | Agie Charmilles New Technologies SA | Laserablationsverfahren zum Gravieren einer Oberfläche mit Patch-Optimierung, mit entsprechenden Software und Bearbeitungsmaschine |
DE102018123363B4 (de) * | 2018-09-24 | 2021-01-07 | Bystronic Laser Ag | Verfahren zur Kollisionsvermeidung und Laserbearbeitungsmaschine |
DE102018125620A1 (de) * | 2018-10-16 | 2020-04-16 | Schuler Pressen Gmbh | Verfahren und Vorrichtung zum Schneiden einer Blechplatine aus einem kontinuierlich geförderten Blechband |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3935117A (en) * | 1970-08-25 | 1976-01-27 | Fuji Photo Film Co., Ltd. | Photosensitive etching composition |
US4081653A (en) * | 1976-12-27 | 1978-03-28 | Western Electric Co., Inc. | Removal of thin films from substrates by laser induced explosion |
EP0042632A1 (de) * | 1980-06-20 | 1981-12-30 | Agfa-Gevaert N.V. | Aufzeichnungsmaterial und Verfahren zur Herstellung von Metallbildern |
FR2488711B1 (fr) * | 1980-08-13 | 1985-06-28 | Thomson Csf | Procede thermo-optique d'inscription d'information et support d'information destine a la mise en oeuvre de ce procede |
JPS5748721A (en) * | 1980-09-08 | 1982-03-20 | Nippon Kogaku Kk <Nikon> | Shutter controller of camera |
US4643532A (en) * | 1985-06-24 | 1987-02-17 | At&T Bell Laboratories | Field-assisted bonding method and articles produced thereby |
JPS62267094A (ja) * | 1986-05-14 | 1987-11-19 | Hitachi Ltd | レ−ザ加工方法 |
US5187601A (en) * | 1988-03-07 | 1993-02-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for making a high contrast liquid crystal display including laser scribing opaque and transparent conductive strips simultaneously |
US4849363A (en) * | 1988-03-18 | 1989-07-18 | Digital Equipment Corporation | Integrated circuit having laser-alterable metallization layer |
JP2673460B2 (ja) * | 1990-02-26 | 1997-11-05 | キヤノン株式会社 | 液晶表示素子 |
JPH04142517A (ja) * | 1990-10-04 | 1992-05-15 | Miura Insatsu Kk | 透明電極の製造方法 |
EP0536431B1 (de) * | 1991-10-07 | 1994-11-30 | Siemens Aktiengesellschaft | Laserbearbeitungsverfahren für einen Dünnschichtaufbau |
US5235154A (en) * | 1992-04-28 | 1993-08-10 | International Business Machines Corporation | Laser removal of metal interconnects |
KR100294194B1 (ko) * | 1993-02-05 | 2001-09-17 | 김순택 | 액정표시소자 |
-
1995
- 1995-01-27 DE DE69500415T patent/DE69500415T2/de not_active Expired - Fee Related
- 1995-01-27 EP EP95905735A patent/EP0699375B1/de not_active Expired - Lifetime
- 1995-01-27 JP JP52168995A patent/JP3633622B2/ja not_active Expired - Fee Related
- 1995-01-27 WO PCT/IB1995/000059 patent/WO1995022881A1/en active IP Right Grant
- 1995-02-21 US US08/391,745 patent/US6617541B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP3633622B2 (ja) | 2005-03-30 |
EP0699375A1 (de) | 1996-03-06 |
DE69500415T2 (de) | 1998-02-05 |
US6617541B1 (en) | 2003-09-09 |
WO1995022881A1 (en) | 1995-08-24 |
JPH08512147A (ja) | 1996-12-17 |
EP0699375B1 (de) | 1997-07-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N |
|
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |