DE69500373D1 - Reinigungsverfahren - Google Patents

Reinigungsverfahren

Info

Publication number
DE69500373D1
DE69500373D1 DE69500373T DE69500373T DE69500373D1 DE 69500373 D1 DE69500373 D1 DE 69500373D1 DE 69500373 T DE69500373 T DE 69500373T DE 69500373 T DE69500373 T DE 69500373T DE 69500373 D1 DE69500373 D1 DE 69500373D1
Authority
DE
Germany
Prior art keywords
cleaning process
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69500373T
Other languages
English (en)
Other versions
DE69500373T2 (de
Inventor
Ching-Ping Wong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of DE69500373D1 publication Critical patent/DE69500373D1/de
Application granted granted Critical
Publication of DE69500373T2 publication Critical patent/DE69500373T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/024—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing hydrocarbons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Detergent Compositions (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE69500373T 1994-03-31 1995-03-21 Reinigungsverfahren Expired - Fee Related DE69500373T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US22047894A 1994-03-31 1994-03-31

Publications (2)

Publication Number Publication Date
DE69500373D1 true DE69500373D1 (de) 1997-07-31
DE69500373T2 DE69500373T2 (de) 1997-10-23

Family

ID=22823695

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69500373T Expired - Fee Related DE69500373T2 (de) 1994-03-31 1995-03-21 Reinigungsverfahren

Country Status (4)

Country Link
US (1) US5863351A (de)
EP (1) EP0675675B1 (de)
JP (1) JPH07321081A (de)
DE (1) DE69500373T2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5849680A (en) * 1996-10-31 1998-12-15 Lucent Technologies Inc. Cleaning with limonene, BHT, and acetylacetonate
JP2002198636A (ja) * 2000-12-27 2002-07-12 Ge Toshiba Silicones Co Ltd 洗浄方法
US20050045205A1 (en) * 2003-08-29 2005-03-03 Stach Steven R. Apparatus and method for cleaning printed circuit boards
US20100059084A1 (en) * 2008-09-10 2010-03-11 Austin American Technology Corporation Cleaning and testing ionic cleanliness of electronic assemblies

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3080433A (en) * 1960-06-17 1963-03-05 Standard Oil Co Drying process
US4368126A (en) * 1979-04-23 1983-01-11 Mobil Oil Corporation Method of removing moisture from hydraulic systems
DE3146553A1 (de) * 1980-11-28 1982-09-09 Coal Industry (Patents) Ltd., London "verfahren zur behandlung wasserhaltiger organischer loesungsmittel"
US4726818A (en) * 1984-12-20 1988-02-23 Union Carbide Corporation Bulk removal of water from organic liquids
US4640719A (en) * 1985-07-01 1987-02-03 Petroleum Fermentations N.V. Method for printed circuit board and/or printed wiring board cleaning
US5328518A (en) * 1991-12-06 1994-07-12 Golden Technologies Company, Inc. Method for separating components of liquids in industrial process

Also Published As

Publication number Publication date
EP0675675A1 (de) 1995-10-04
JPH07321081A (ja) 1995-12-08
EP0675675B1 (de) 1997-06-25
DE69500373T2 (de) 1997-10-23
US5863351A (en) 1999-01-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee