DE69424535T2 - Trommelseite-behandelte metallfolie und laminat zur verwendung in leiterplatten und verfahren zur herstellung - Google Patents
Trommelseite-behandelte metallfolie und laminat zur verwendung in leiterplatten und verfahren zur herstellungInfo
- Publication number
- DE69424535T2 DE69424535T2 DE69424535T DE69424535T DE69424535T2 DE 69424535 T2 DE69424535 T2 DE 69424535T2 DE 69424535 T DE69424535 T DE 69424535T DE 69424535 T DE69424535 T DE 69424535T DE 69424535 T2 DE69424535 T2 DE 69424535T2
- Authority
- DE
- Germany
- Prior art keywords
- laminate
- foil
- drum
- printed circuit
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US2762093A | 1993-03-05 | 1993-03-05 | |
US17675094A | 1994-01-03 | 1994-01-03 | |
PCT/US1994/002309 WO1994021097A2 (en) | 1993-03-05 | 1994-03-02 | Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69424535D1 DE69424535D1 (de) | 2000-06-21 |
DE69424535T2 true DE69424535T2 (de) | 2001-01-18 |
Family
ID=26702704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69424535T Expired - Lifetime DE69424535T2 (de) | 1993-03-05 | 1994-03-02 | Trommelseite-behandelte metallfolie und laminat zur verwendung in leiterplatten und verfahren zur herstellung |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP0687405B1 (de) |
JP (1) | JPH08511654A (de) |
KR (1) | KR960701581A (de) |
AT (1) | ATE193176T1 (de) |
AU (1) | AU6941394A (de) |
CA (1) | CA2157587C (de) |
DE (1) | DE69424535T2 (de) |
SG (1) | SG52528A1 (de) |
WO (1) | WO1994021097A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10048243A1 (de) * | 2000-09-29 | 2002-04-18 | Bosch Gmbh Robert | Substrat mit geglätteter Oberfläche und Verfahren zu seiner Herstellung |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5779870A (en) * | 1993-03-05 | 1998-07-14 | Polyclad Laminates, Inc. | Method of manufacturing laminates and printed circuit boards |
US5679230A (en) * | 1995-08-21 | 1997-10-21 | Oak-Mitsui, Inc. | Copper foil for printed circuit boards |
US6584820B1 (en) | 1999-09-23 | 2003-07-01 | Polyclad Laminates, Inc. | Surface enhanced metal press plates for use in manufacture of laminates and multilayer materials and method of making same |
US7148566B2 (en) * | 2001-03-26 | 2006-12-12 | International Business Machines Corporation | Method and structure for an organic package with improved BGA life |
JP4379854B2 (ja) | 2001-10-30 | 2009-12-09 | 日鉱金属株式会社 | 表面処理銅箔 |
CN104502715B (zh) * | 2014-12-31 | 2017-07-04 | 广州兴森快捷电路科技有限公司 | 阻抗板的阻抗测试方法 |
CN109479377A (zh) * | 2016-05-18 | 2019-03-15 | 伊索拉美国有限公司 | 电路板的制造方法 |
CN110312370A (zh) * | 2019-06-11 | 2019-10-08 | 江西弘高科技有限公司 | 一种印制线路板内存条的制作方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3585010A (en) * | 1968-10-03 | 1971-06-15 | Clevite Corp | Printed circuit board and method of making same |
AU579517B2 (en) * | 1986-06-20 | 1988-11-24 | Gould Inc. | Double matte finish copper foil |
US4997516A (en) * | 1989-07-10 | 1991-03-05 | Edward Adler | Method for improving adherence of copper foil to resinous substrates |
US5153050A (en) * | 1991-08-27 | 1992-10-06 | Johnston James A | Component of printed circuit boards |
JPH0766933B2 (ja) * | 1991-09-18 | 1995-07-19 | 三井金属鉱業株式会社 | Tabテープの製造方法 |
-
1994
- 1994-03-02 CA CA002157587A patent/CA2157587C/en not_active Expired - Lifetime
- 1994-03-02 DE DE69424535T patent/DE69424535T2/de not_active Expired - Lifetime
- 1994-03-02 KR KR1019950703752A patent/KR960701581A/ko not_active Application Discontinuation
- 1994-03-02 AU AU69413/94A patent/AU6941394A/en not_active Abandoned
- 1994-03-02 WO PCT/US1994/002309 patent/WO1994021097A2/en active IP Right Grant
- 1994-03-02 EP EP94917880A patent/EP0687405B1/de not_active Expired - Lifetime
- 1994-03-02 AT AT94917880T patent/ATE193176T1/de not_active IP Right Cessation
- 1994-03-02 SG SG1996005539A patent/SG52528A1/en unknown
- 1994-03-02 JP JP6520164A patent/JPH08511654A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10048243A1 (de) * | 2000-09-29 | 2002-04-18 | Bosch Gmbh Robert | Substrat mit geglätteter Oberfläche und Verfahren zu seiner Herstellung |
Also Published As
Publication number | Publication date |
---|---|
EP0687405B1 (de) | 2000-05-17 |
DE69424535D1 (de) | 2000-06-21 |
WO1994021097A2 (en) | 1994-09-15 |
ATE193176T1 (de) | 2000-06-15 |
JPH08511654A (ja) | 1996-12-03 |
KR960701581A (ko) | 1996-02-24 |
EP0687405A1 (de) | 1995-12-20 |
AU6941394A (en) | 1994-09-26 |
WO1994021097A3 (en) | 1994-10-27 |
CA2157587A1 (en) | 1994-09-15 |
SG52528A1 (en) | 1998-09-28 |
CA2157587C (en) | 2004-12-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee | ||
8370 | Indication related to discontinuation of the patent is to be deleted |