DE69423581D1 - Poliergerät - Google Patents
PoliergerätInfo
- Publication number
- DE69423581D1 DE69423581D1 DE69423581T DE69423581T DE69423581D1 DE 69423581 D1 DE69423581 D1 DE 69423581D1 DE 69423581 T DE69423581 T DE 69423581T DE 69423581 T DE69423581 T DE 69423581T DE 69423581 D1 DE69423581 D1 DE 69423581D1
- Authority
- DE
- Germany
- Prior art keywords
- polisher
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34283093 | 1993-12-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69423581D1 true DE69423581D1 (de) | 2000-04-27 |
DE69423581T2 DE69423581T2 (de) | 2000-11-09 |
Family
ID=18356824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69423581T Expired - Fee Related DE69423581T2 (de) | 1993-12-14 | 1994-12-14 | Poliergerät |
Country Status (4)
Country | Link |
---|---|
US (1) | US5653623A (de) |
EP (1) | EP0658400B1 (de) |
KR (1) | KR100324571B1 (de) |
DE (1) | DE69423581T2 (de) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100440417B1 (ko) * | 1995-10-23 | 2004-10-22 | 텍사스 인스트루먼츠 인코포레이티드 | 화학-기계적연마응용을위해패드컨디셔너와웨이퍼캐리어를통합시키는장치 |
KR100445139B1 (ko) * | 1996-01-23 | 2004-11-17 | 가부시키 가이샤 에바라 세이사꾸쇼 | 폴리싱장치 |
KR100456803B1 (ko) * | 1996-02-05 | 2005-05-09 | 가부시키 가이샤 에바라 세이사꾸쇼 | 폴리싱장치 |
JPH09234663A (ja) * | 1996-02-28 | 1997-09-09 | Oki Electric Ind Co Ltd | ウエハ研磨方法及びその装置 |
US6012966A (en) * | 1996-05-10 | 2000-01-11 | Canon Kabushiki Kaisha | Precision polishing apparatus with detecting means |
US5904611A (en) * | 1996-05-10 | 1999-05-18 | Canon Kabushiki Kaisha | Precision polishing apparatus |
EP0810064B1 (de) * | 1996-05-30 | 2002-09-25 | Ebara Corporation | Poliervorrichtung mit Verriegelungsfunktion |
DE69734868T2 (de) * | 1996-07-25 | 2006-08-03 | Dupont Air Products Nanomaterials L.L.C., Tempe | Zusammensetzung und verfahren zum chemisch-mechanischen polieren |
US5857899A (en) * | 1997-04-04 | 1999-01-12 | Ontrak Systems, Inc. | Wafer polishing head with pad dressing element |
US8092707B2 (en) | 1997-04-30 | 2012-01-10 | 3M Innovative Properties Company | Compositions and methods for modifying a surface suited for semiconductor fabrication |
US6036582A (en) * | 1997-06-06 | 2000-03-14 | Ebara Corporation | Polishing apparatus |
JP3741523B2 (ja) * | 1997-07-30 | 2006-02-01 | 株式会社荏原製作所 | 研磨装置 |
US6332835B1 (en) * | 1997-11-20 | 2001-12-25 | Canon Kabushiki Kaisha | Polishing apparatus with transfer arm for moving polished object without drying it |
US6042455A (en) * | 1997-12-11 | 2000-03-28 | Ebara Corporation | Polishing apparatus |
US6572730B1 (en) * | 2000-03-31 | 2003-06-03 | Applied Materials, Inc. | System and method for chemical mechanical planarization |
US6616512B2 (en) * | 2000-07-28 | 2003-09-09 | Ebara Corporation | Substrate cleaning apparatus and substrate polishing apparatus with substrate cleaning apparatus |
DE10145921A1 (de) * | 2001-09-18 | 2003-04-03 | Volkswagen Ag | Vorrichtung zum Bearbeiten eines Werkstücks |
JP2007111283A (ja) * | 2005-10-21 | 2007-05-10 | Timothy Tamio Nemoto | 歯冠研磨装置 |
JP2008229830A (ja) * | 2007-03-23 | 2008-10-02 | Showa Denko Kk | 円盤状基板の製造方法 |
US7988535B2 (en) * | 2008-04-18 | 2011-08-02 | Applied Materials, Inc. | Platen exhaust for chemical mechanical polishing system |
US20130115862A1 (en) * | 2011-11-09 | 2013-05-09 | Applied Materials, Inc. | Chemical mechanical polishing platform architecture |
US10279311B2 (en) * | 2012-08-21 | 2019-05-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for operating chemical mechanical polishing process |
US10576604B2 (en) * | 2014-04-30 | 2020-03-03 | Ebara Corporation | Substrate polishing apparatus |
US20180136094A1 (en) | 2014-11-12 | 2018-05-17 | Illinois Tool Works Inc. | Planar grinder |
KR101759877B1 (ko) * | 2015-12-24 | 2017-07-20 | 주식회사 엘지실트론 | 웨이퍼 연마챔버 및 이를 포함하는 웨이퍼 연마시스템 |
CN108890469A (zh) * | 2018-07-23 | 2018-11-27 | 安庆牛力模具股份有限公司 | 一种用于加工六角切边模具的柔性抛光设备 |
CN110893577B (zh) * | 2019-11-28 | 2020-11-20 | 诸暨市仲达智能科技有限公司 | 一种用于铝制车身喷漆前抛光的设备 |
CN112207702B (zh) * | 2020-12-07 | 2021-03-30 | 湖南高福星智能科技有限公司 | 一种带吸尘装置的抛光机床 |
KR102598124B1 (ko) * | 2021-06-28 | 2023-11-07 | 주식회사 디엠에스 | 기판 세정장치 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1106635A (fr) * | 1954-04-14 | 1955-12-21 | Polisseuse pour carreaux en marbre ou en terre cuite et similaires | |
US3905273A (en) * | 1974-07-22 | 1975-09-16 | Shyodu Precision Instr Company | Machine tool assembly |
US4514936A (en) * | 1983-10-19 | 1985-05-07 | Hurtado Ruben G | Lathe dust enclosure |
US4680893A (en) * | 1985-09-23 | 1987-07-21 | Motorola, Inc. | Apparatus for polishing semiconductor wafers |
US5010692A (en) * | 1987-12-22 | 1991-04-30 | Sintobrator, Ltd. | Polishing device |
JPH0756879B2 (ja) * | 1988-03-31 | 1995-06-14 | 日鉄セミコンダクター株式会社 | 半導体の無塵化製造装置 |
US4974370A (en) * | 1988-12-07 | 1990-12-04 | General Signal Corp. | Lapping and polishing machine |
DE3908329A1 (de) * | 1989-03-10 | 1990-09-20 | Siemens Ag | Fertigungseinrichtung in reinraumtechnologie |
JP2770087B2 (ja) * | 1991-09-17 | 1998-06-25 | 不二越機械工業株式会社 | ウェーハの研磨方法及びその研磨用トップリング |
US5131192A (en) * | 1991-11-18 | 1992-07-21 | Cheng Mau Nan | Dust arrester for a sanding machine |
US5329732A (en) * | 1992-06-15 | 1994-07-19 | Speedfam Corporation | Wafer polishing method and apparatus |
JP2598661Y2 (ja) * | 1992-07-16 | 1999-08-16 | 信越半導体株式会社 | 回転割出式ウエーハ面取部研磨装置 |
-
1994
- 1994-12-13 US US08/357,176 patent/US5653623A/en not_active Expired - Lifetime
- 1994-12-14 DE DE69423581T patent/DE69423581T2/de not_active Expired - Fee Related
- 1994-12-14 EP EP94119775A patent/EP0658400B1/de not_active Expired - Lifetime
- 1994-12-14 KR KR1019940034056A patent/KR100324571B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR950021195A (ko) | 1995-07-26 |
KR100324571B1 (ko) | 2002-07-02 |
DE69423581T2 (de) | 2000-11-09 |
EP0658400B1 (de) | 2000-03-22 |
EP0658400A1 (de) | 1995-06-21 |
US5653623A (en) | 1997-08-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |