DE69420761D1 - Verfahren und Lösung zur Elekroplattierung einer dichten reflektierender Schicht aus Zinn oder Zinn-Blei Legierung - Google Patents
Verfahren und Lösung zur Elekroplattierung einer dichten reflektierender Schicht aus Zinn oder Zinn-Blei LegierungInfo
- Publication number
- DE69420761D1 DE69420761D1 DE69420761T DE69420761T DE69420761D1 DE 69420761 D1 DE69420761 D1 DE 69420761D1 DE 69420761 T DE69420761 T DE 69420761T DE 69420761 T DE69420761 T DE 69420761T DE 69420761 D1 DE69420761 D1 DE 69420761D1
- Authority
- DE
- Germany
- Prior art keywords
- tin
- electroplating
- solution
- reflective layer
- lead alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/019,729 US5326453A (en) | 1993-02-19 | 1993-02-19 | Method and solution for electrodeposition of a dense, reflective tin or tin-lead alloy |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69420761D1 true DE69420761D1 (de) | 1999-10-28 |
DE69420761T2 DE69420761T2 (de) | 2000-04-27 |
Family
ID=21794714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69420761T Expired - Lifetime DE69420761T2 (de) | 1993-02-19 | 1994-02-15 | Verfahren und Lösung zur Elekroplattierung einer dichten reflektierender Schicht aus Zinn oder Zinn-Blei Legierung |
Country Status (7)
Country | Link |
---|---|
US (1) | US5326453A (de) |
EP (1) | EP0613965B1 (de) |
JP (1) | JP3223691B2 (de) |
KR (1) | KR100310666B1 (de) |
CN (1) | CN1052269C (de) |
DE (1) | DE69420761T2 (de) |
MY (1) | MY110953A (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5337352B2 (ja) * | 2007-04-24 | 2013-11-06 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 錫または錫合金電気めっき液 |
JP4632186B2 (ja) * | 2007-08-01 | 2011-02-16 | 太陽化学工業株式会社 | 電子部品用錫電解めっき液、電子部品の錫電解めっき方法及び錫電解めっき電子部品 |
US9604316B2 (en) | 2014-09-23 | 2017-03-28 | Globalfoundries Inc. | Tin-based solder composition with low void characteristic |
WO2021193696A1 (ja) * | 2020-03-27 | 2021-09-30 | 三菱マテリアル株式会社 | 電解めっき液及び電解めっき方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3850765A (en) * | 1973-05-21 | 1974-11-26 | Oxy Metal Finishing Corp | Bright solder plating |
US4994155A (en) * | 1988-12-09 | 1991-02-19 | Learonal, Inc. | High speed tin, lead or tin/lead alloy electroplating |
US4844780A (en) * | 1988-02-17 | 1989-07-04 | Maclee Chemical Company, Inc. | Brightener and aqueous plating bath for tin and/or lead |
US4923576A (en) * | 1988-07-06 | 1990-05-08 | Technic, Inc. | Additives for electroplating compositions and methods for their use |
US4981564A (en) * | 1988-07-06 | 1991-01-01 | Technic Inc. | Additives for electroplating compositions and methods for their use |
US5110423A (en) * | 1990-05-25 | 1992-05-05 | Technic Inc. | Bath for electroplating bright tin or tin-lead alloys and method thereof |
US5061351A (en) * | 1990-07-23 | 1991-10-29 | Enthone-Omi, Inc. | Bright tin electrodeposition composition |
-
1993
- 1993-02-19 US US08/019,729 patent/US5326453A/en not_active Expired - Lifetime
-
1994
- 1994-02-15 DE DE69420761T patent/DE69420761T2/de not_active Expired - Lifetime
- 1994-02-15 EP EP94301085A patent/EP0613965B1/de not_active Expired - Lifetime
- 1994-02-16 JP JP04060294A patent/JP3223691B2/ja not_active Expired - Lifetime
- 1994-02-16 MY MYPI94000347A patent/MY110953A/en unknown
- 1994-02-18 CN CN94101385A patent/CN1052269C/zh not_active Expired - Lifetime
- 1994-02-18 KR KR1019940002904A patent/KR100310666B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0613965A1 (de) | 1994-09-07 |
DE69420761T2 (de) | 2000-04-27 |
CN1052269C (zh) | 2000-05-10 |
JPH06240489A (ja) | 1994-08-30 |
CN1092479A (zh) | 1994-09-21 |
MY110953A (en) | 1999-07-31 |
KR100310666B1 (ko) | 2002-07-02 |
KR940019888A (ko) | 1994-09-15 |
US5326453A (en) | 1994-07-05 |
EP0613965B1 (de) | 1999-09-22 |
JP3223691B2 (ja) | 2001-10-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Free format text: SCHUMACHER & WILLSAU, PATENTANWALTSSOZIETAET, 80335 MUENCHEN |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: FREESCALE SEMICONDUCTOR, INC., AUSTIN, TEX., US Owner name: TECHNIC, INC., CRANSTON, R.I., US |