DE69417637T2 - Magnetronzerstäubungs-Anlage sowie -Systeme - Google Patents
Magnetronzerstäubungs-Anlage sowie -SystemeInfo
- Publication number
- DE69417637T2 DE69417637T2 DE69417637T DE69417637T DE69417637T2 DE 69417637 T2 DE69417637 T2 DE 69417637T2 DE 69417637 T DE69417637 T DE 69417637T DE 69417637 T DE69417637 T DE 69417637T DE 69417637 T2 DE69417637 T2 DE 69417637T2
- Authority
- DE
- Germany
- Prior art keywords
- systems
- magnetron sputtering
- sputtering system
- magnetron
- sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3438—Electrodes other than cathode
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8613693A | 1993-07-01 | 1993-07-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69417637D1 DE69417637D1 (de) | 1999-05-12 |
DE69417637T2 true DE69417637T2 (de) | 1999-09-09 |
Family
ID=22196512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69417637T Expired - Fee Related DE69417637T2 (de) | 1993-07-01 | 1994-06-21 | Magnetronzerstäubungs-Anlage sowie -Systeme |
Country Status (9)
Country | Link |
---|---|
US (2) | US5487821A (de) |
EP (1) | EP0632142B1 (de) |
JP (1) | JP2586881B2 (de) |
CN (1) | CN1101082A (de) |
CA (1) | CA2123479C (de) |
DE (1) | DE69417637T2 (de) |
ES (1) | ES2129587T3 (de) |
RU (1) | RU94022474A (de) |
TW (1) | TW320739B (de) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5616225A (en) * | 1994-03-23 | 1997-04-01 | The Boc Group, Inc. | Use of multiple anodes in a magnetron for improving the uniformity of its plasma |
US6342134B1 (en) * | 2000-02-11 | 2002-01-29 | Agere Systems Guardian Corp. | Method for producing piezoelectric films with rotating magnetron sputtering system |
US6440280B1 (en) | 2000-06-28 | 2002-08-27 | Sola International, Inc. | Multi-anode device and methods for sputter deposition |
US6597447B1 (en) | 2001-07-31 | 2003-07-22 | Advanced Micro Devices, Inc. | Method and apparatus for periodic correction of metrology data |
US6736948B2 (en) * | 2002-01-18 | 2004-05-18 | Von Ardenne Anlagentechnik Gmbh | Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation |
WO2004005574A2 (en) * | 2002-07-02 | 2004-01-15 | Academy Precision Materials A Division Of Academy Corporation | Rotary target and method for onsite mechanical assembly of rotary target |
CA2509952A1 (en) * | 2002-12-18 | 2004-11-25 | Cardinal Cg Company | Plasma-enhanced film deposition |
US20040200418A1 (en) * | 2003-01-03 | 2004-10-14 | Klaus Hartig | Plasma spray systems and methods of uniformly coating rotary cylindrical targets |
US20040129561A1 (en) * | 2003-01-07 | 2004-07-08 | Von Ardenne Anlagentechnik Gmbh | Cylindrical magnetron magnetic array mid span support |
US20050051422A1 (en) * | 2003-02-21 | 2005-03-10 | Rietzel James G. | Cylindrical magnetron with self cleaning target |
US7014741B2 (en) * | 2003-02-21 | 2006-03-21 | Von Ardenne Anlagentechnik Gmbh | Cylindrical magnetron with self cleaning target |
US20050276381A1 (en) * | 2003-07-02 | 2005-12-15 | Academy Corporation | Rotary target locking ring assembly |
US20050224343A1 (en) * | 2004-04-08 | 2005-10-13 | Richard Newcomb | Power coupling for high-power sputtering |
US7491453B2 (en) * | 2004-07-14 | 2009-02-17 | The Penn State Research Foundation | Bio-electrochemically assisted microbial reactor that generates hydrogen gas and methods of generating hydrogen gas |
US8962165B2 (en) * | 2006-05-02 | 2015-02-24 | The Penn State Research Foundation | Materials and configurations for scalable microbial fuel cells |
US20080292912A1 (en) * | 2006-05-02 | 2008-11-27 | The Penn State Research Foundation | Electrodes and methods for microbial fuel cells |
US8277984B2 (en) * | 2006-05-02 | 2012-10-02 | The Penn State Research Foundation | Substrate-enhanced microbial fuel cells |
US7922878B2 (en) * | 2004-07-14 | 2011-04-12 | The Penn State Research Foundation | Electrohydrogenic reactor for hydrogen gas production |
US8500973B2 (en) * | 2004-08-20 | 2013-08-06 | Jds Uniphase Corporation | Anode for sputter coating |
US7879209B2 (en) | 2004-08-20 | 2011-02-01 | Jds Uniphase Corporation | Cathode for sputter coating |
US20060049041A1 (en) * | 2004-08-20 | 2006-03-09 | Jds Uniphase Corporation | Anode for sputter coating |
US20060065524A1 (en) * | 2004-09-30 | 2006-03-30 | Richard Newcomb | Non-bonded rotatable targets for sputtering |
US20060096855A1 (en) * | 2004-11-05 | 2006-05-11 | Richard Newcomb | Cathode arrangement for atomizing a rotatable target pipe |
US20060278519A1 (en) * | 2005-06-10 | 2006-12-14 | Leszek Malaszewski | Adaptable fixation for cylindrical magnetrons |
US20060278521A1 (en) * | 2005-06-14 | 2006-12-14 | Stowell Michael W | System and method for controlling ion density and energy using modulated power signals |
US20060278524A1 (en) * | 2005-06-14 | 2006-12-14 | Stowell Michael W | System and method for modulating power signals to control sputtering |
US20070095281A1 (en) * | 2005-11-01 | 2007-05-03 | Stowell Michael W | System and method for power function ramping of microwave liner discharge sources |
US7842355B2 (en) * | 2005-11-01 | 2010-11-30 | Applied Materials, Inc. | System and method for modulation of power and power related functions of PECVD discharge sources to achieve new film properties |
US9117637B2 (en) * | 2005-11-04 | 2015-08-25 | Von Ardenne Gmbh | Redundant anode sputtering method and assembly |
KR100712818B1 (ko) * | 2005-12-16 | 2007-04-30 | 동부일렉트로닉스 주식회사 | 구리 배선 형성 방법 |
US7626135B2 (en) * | 2006-05-10 | 2009-12-01 | Sub-One Technology, Inc. | Electrode systems and methods of using electrodes |
BRPI0923775A2 (pt) * | 2008-12-30 | 2019-09-24 | Penn State Res Found | aparelho usando celula microbial combustivel ou de eletrolise e método de fabricação |
EP2325350A1 (de) * | 2009-11-24 | 2011-05-25 | Applied Materials, Inc. | Anodenstab für ein Sputtersystem |
US9546426B2 (en) | 2013-03-07 | 2017-01-17 | The Penn State Research Foundation | Methods for hydrogen gas production |
US9546429B1 (en) | 2013-04-12 | 2017-01-17 | Microrganic Technologies Inc | Multi-strand electrode and method of making |
US10580611B2 (en) * | 2014-08-21 | 2020-03-03 | Raytheon Company | Rapid 3D prototyping and fabricating of slow-wave structures, including electromagnetic meta-material structures, for millimeter-wavelength and terahertz-frequency high-power vacuum electronic devices |
US10811236B2 (en) | 2014-10-29 | 2020-10-20 | General Plasma, Inc. | Magnetic anode for sputter magnetron cathode |
JP2018517846A (ja) * | 2015-06-05 | 2018-07-05 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | スパッタ堆積源、スパッタリング装置およびそれらを動作させる方法 |
KR102651759B1 (ko) * | 2016-10-11 | 2024-03-29 | 삼성디스플레이 주식회사 | 증착장치 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE222900C (de) * | ||||
US3514391A (en) * | 1967-05-05 | 1970-05-26 | Nat Res Corp | Sputtering apparatus with finned anode |
US3594301A (en) * | 1968-11-22 | 1971-07-20 | Gen Electric | Sputter coating apparatus |
US3616449A (en) * | 1970-03-30 | 1971-10-26 | Bendix Corp | Sputtering anode |
US3767559A (en) * | 1970-06-24 | 1973-10-23 | Eastman Kodak Co | Sputtering apparatus with accordion pleated anode means |
US4166018A (en) * | 1974-01-31 | 1979-08-28 | Airco, Inc. | Sputtering process and apparatus |
US4046659A (en) * | 1974-05-10 | 1977-09-06 | Airco, Inc. | Method for coating a substrate |
US4356073A (en) * | 1981-02-12 | 1982-10-26 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
US4466877A (en) * | 1983-10-11 | 1984-08-21 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
US4478702A (en) * | 1984-01-17 | 1984-10-23 | Ppg Industries, Inc. | Anode for magnetic sputtering apparatus |
DE3427587A1 (de) * | 1984-07-26 | 1986-02-06 | Leybold-Heraeus GmbH, 5000 Köln | Zerstaeubungseinrichtung fuer katodenzerstaeubungsanlagen |
US4888199A (en) * | 1987-07-15 | 1989-12-19 | The Boc Group, Inc. | Plasma thin film deposition process |
US4849087A (en) * | 1988-02-11 | 1989-07-18 | Southwall Technologies | Apparatus for obtaining transverse uniformity during thin film deposition on extended substrate |
US5047131A (en) * | 1989-11-08 | 1991-09-10 | The Boc Group, Inc. | Method for coating substrates with silicon based compounds |
US5106474A (en) * | 1990-11-21 | 1992-04-21 | Viratec Thin Films, Inc. | Anode structures for magnetron sputtering apparatus |
US5171411A (en) * | 1991-05-21 | 1992-12-15 | The Boc Group, Inc. | Rotating cylindrical magnetron structure with self supporting zinc alloy target |
US5393575A (en) * | 1992-03-03 | 1995-02-28 | Esterlis; Moisei | Method for carrying out surface processes |
-
1994
- 1994-05-12 CA CA002123479A patent/CA2123479C/en not_active Expired - Fee Related
- 1994-05-19 TW TW083104556A patent/TW320739B/zh active
- 1994-06-16 JP JP6134015A patent/JP2586881B2/ja not_active Expired - Lifetime
- 1994-06-21 EP EP94304508A patent/EP0632142B1/de not_active Expired - Lifetime
- 1994-06-21 ES ES94304508T patent/ES2129587T3/es not_active Expired - Lifetime
- 1994-06-21 DE DE69417637T patent/DE69417637T2/de not_active Expired - Fee Related
- 1994-06-24 RU RU94022474/02A patent/RU94022474A/ru unknown
- 1994-07-01 CN CN94106702.5A patent/CN1101082A/zh active Pending
-
1995
- 1995-04-18 US US08/425,671 patent/US5487821A/en not_active Expired - Fee Related
-
1996
- 1996-01-23 US US08/589,920 patent/US5683558A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0632142A1 (de) | 1995-01-04 |
TW320739B (de) | 1997-11-21 |
DE69417637D1 (de) | 1999-05-12 |
US5487821A (en) | 1996-01-30 |
JPH0718436A (ja) | 1995-01-20 |
US5683558A (en) | 1997-11-04 |
CA2123479A1 (en) | 1995-01-02 |
CA2123479C (en) | 1999-07-06 |
CN1101082A (zh) | 1995-04-05 |
EP0632142B1 (de) | 1999-04-07 |
RU94022474A (ru) | 1996-04-10 |
ES2129587T3 (es) | 1999-06-16 |
JP2586881B2 (ja) | 1997-03-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |