DE69413980D1 - Laminatherstellungsverfahren - Google Patents
LaminatherstellungsverfahrenInfo
- Publication number
- DE69413980D1 DE69413980D1 DE69413980T DE69413980T DE69413980D1 DE 69413980 D1 DE69413980 D1 DE 69413980D1 DE 69413980 T DE69413980 T DE 69413980T DE 69413980 T DE69413980 T DE 69413980T DE 69413980 D1 DE69413980 D1 DE 69413980D1
- Authority
- DE
- Germany
- Prior art keywords
- production process
- laminate production
- laminate
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/162—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
- B32B37/065—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method resulting in the laminate being partially bonded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
- B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
- B32B38/105—Removing layers, or parts of layers, mechanically or chemically on edges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/10—Fibres of continuous length
- B32B2305/18—Fabrics, textiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/65—Dust free, e.g. clean room
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
- Y10T156/1028—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina by bending, drawing or stretch forming sheet to assume shape of configured lamina while in contact therewith
- Y10T156/103—Encasing or enveloping the configured lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/239—Complete cover or casing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB939314440A GB9314440D0 (en) | 1993-07-13 | 1993-07-13 | Method of laminate manufacture |
PCT/GB1994/001519 WO1995002509A1 (en) | 1993-07-13 | 1994-07-13 | Method of laminate manufacture |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69413980D1 true DE69413980D1 (de) | 1998-11-19 |
DE69413980T2 DE69413980T2 (de) | 1999-07-01 |
Family
ID=10738723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69413980T Expired - Fee Related DE69413980T2 (de) | 1993-07-13 | 1994-07-13 | Laminatherstellungsverfahren |
Country Status (6)
Country | Link |
---|---|
US (1) | US5688350A (de) |
EP (1) | EP0708707B1 (de) |
AU (1) | AU7131094A (de) |
DE (1) | DE69413980T2 (de) |
GB (2) | GB9314440D0 (de) |
WO (1) | WO1995002509A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6299053B1 (en) | 1998-08-19 | 2001-10-09 | Kulicke & Soffa Holdings, Inc. | Isolated flip chip or BGA to minimize interconnect stress due to thermal mismatch |
ES2190757B1 (es) * | 2001-12-28 | 2005-07-16 | Chemplate Materials, S.L. | Procedimiento para la soldadura de las capas constitutivas de un circuito impreso multicapa y maquina para el mismo. |
US6892781B2 (en) * | 2002-05-28 | 2005-05-17 | International Business Machines Corporation | Method and apparatus for application of pressure to a workpiece by thermal expansion |
US20040253473A1 (en) * | 2003-06-13 | 2004-12-16 | Michael Weekes | Metal foil composite structure for producing clad laminate |
FR3054408B1 (fr) | 2016-07-27 | 2019-07-12 | Allflex Europe | Partie femelle d'un dispositif d'identification animale comprenant un element de blocage de la partie male dans la partie femelle |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5222380B2 (de) * | 1973-05-30 | 1977-06-17 | ||
GB2157228B (en) * | 1983-09-14 | 1987-01-21 | Hurst G L | Method of edge bonding sheets and resulting assemblies |
GB8519334D0 (en) * | 1985-07-31 | 1985-09-04 | Teknek Electronics Ltd | Treating sheet articles |
JPS6377732A (ja) * | 1986-09-22 | 1988-04-07 | Hitachi Ltd | 多層プリント板の成形方法 |
US4963221A (en) * | 1986-09-29 | 1990-10-16 | Kabushiki Kaisha Meiki Seisakusho | Hot press including cam rod penetrating top platen |
JPH0193316A (ja) * | 1987-10-06 | 1989-04-12 | Matsushita Electric Works Ltd | 多段プレス装置 |
JPH0794078B2 (ja) * | 1989-11-15 | 1995-10-11 | 松下電工株式会社 | プリント配線基板用多段真空プレス装置 |
DE4021341A1 (de) * | 1990-07-04 | 1992-01-16 | Hymmen Theodor Gmbh | Verfahren und vorrichtung zum kontinuierlichen oder diskontinuierlichen herstellen von ebenen, plattenfoermigen mehrschichtigen werkstoffen, laminaten o. dgl. |
JP2937138B2 (ja) * | 1996-09-13 | 1999-08-23 | 日本電気株式会社 | 通信装置の簡易アンテナ脱着構造 |
-
1993
- 1993-07-13 GB GB939314440A patent/GB9314440D0/en active Pending
-
1994
- 1994-07-13 DE DE69413980T patent/DE69413980T2/de not_active Expired - Fee Related
- 1994-07-13 EP EP94920562A patent/EP0708707B1/de not_active Expired - Lifetime
- 1994-07-13 US US08/583,115 patent/US5688350A/en not_active Expired - Fee Related
- 1994-07-13 AU AU71310/94A patent/AU7131094A/en not_active Abandoned
- 1994-07-13 GB GB9600581A patent/GB2294661B/en not_active Expired - Fee Related
- 1994-07-13 WO PCT/GB1994/001519 patent/WO1995002509A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
GB2294661A (en) | 1996-05-08 |
GB9314440D0 (en) | 1993-08-25 |
GB9600581D0 (en) | 1996-03-20 |
US5688350A (en) | 1997-11-18 |
DE69413980T2 (de) | 1999-07-01 |
GB2294661B (en) | 1997-04-02 |
EP0708707B1 (de) | 1998-10-14 |
AU7131094A (en) | 1995-02-13 |
EP0708707A1 (de) | 1996-05-01 |
WO1995002509A1 (en) | 1995-01-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |