DE69405003T2 - Integrierter elektronischer sensor für physikalische grössen und herstellungsverfahren dafür - Google Patents
Integrierter elektronischer sensor für physikalische grössen und herstellungsverfahren dafürInfo
- Publication number
- DE69405003T2 DE69405003T2 DE69405003T DE69405003T DE69405003T2 DE 69405003 T2 DE69405003 T2 DE 69405003T2 DE 69405003 T DE69405003 T DE 69405003T DE 69405003 T DE69405003 T DE 69405003T DE 69405003 T2 DE69405003 T2 DE 69405003T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- method therefor
- integrated electronic
- electronic sensor
- physical sizes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0817—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for pivoting movement of the mass, e.g. in-plane pendulum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9311672A FR2710741B1 (fr) | 1993-09-30 | 1993-09-30 | Capteur électronique destiné à la caractérisation de grandeurs physiques et procédé de réalisation d'un tel capteur. |
PCT/FR1994/001141 WO1995009367A1 (fr) | 1993-09-30 | 1994-09-29 | Capteur electronique integre destine a la caracterisation de grandeurs physiques et procede de realisation d'un tel capteur |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69405003D1 DE69405003D1 (de) | 1997-09-18 |
DE69405003T2 true DE69405003T2 (de) | 1998-02-26 |
Family
ID=9451426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69405003T Expired - Fee Related DE69405003T2 (de) | 1993-09-30 | 1994-09-29 | Integrierter elektronischer sensor für physikalische grössen und herstellungsverfahren dafür |
Country Status (6)
Country | Link |
---|---|
US (1) | US5734106A (de) |
EP (1) | EP0721588B1 (de) |
JP (1) | JPH09503298A (de) |
DE (1) | DE69405003T2 (de) |
FR (1) | FR2710741B1 (de) |
WO (1) | WO1995009367A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018219524A1 (de) * | 2018-11-15 | 2020-05-20 | Robert Bosch Gmbh | Verfahren zur Herstellung eines mikroelektromechanischen Sensors und mikroelektromechanischer Sensor |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0660119B1 (de) * | 1993-12-27 | 2003-04-02 | Hitachi, Ltd. | Beschleunigungsmessaufnehmer |
AUPN261895A0 (en) * | 1995-04-28 | 1995-05-18 | Australian National University, The | Preparation and use of sulfated oligosaccharides |
DE19616014B4 (de) * | 1996-04-23 | 2006-04-20 | Robert Bosch Gmbh | Verfahren zur Herstellung von mikromechanische Strukturen aufweisenden Halbleiterbauelementen |
JPH1090299A (ja) * | 1996-09-12 | 1998-04-10 | Mitsubishi Electric Corp | 静電容量式加速度センサ |
JP3576727B2 (ja) * | 1996-12-10 | 2004-10-13 | 株式会社デンソー | 表面実装型パッケージ |
JP3644205B2 (ja) * | 1997-08-08 | 2005-04-27 | 株式会社デンソー | 半導体装置及びその製造方法 |
IL122947A (en) * | 1998-01-15 | 2001-03-19 | Armament Dev Authority State O | Micro-electro-opto-mechanical inertial sensor with integrative optical sensing |
WO2000042666A1 (en) * | 1999-01-13 | 2000-07-20 | Mitsubishi Denki Kabushiki Kaisha | Inertia force sensor and method for producing inertia force sensor |
JP4151164B2 (ja) * | 1999-03-19 | 2008-09-17 | 株式会社デンソー | 半導体装置の製造方法 |
JP2001235485A (ja) * | 2000-02-25 | 2001-08-31 | Mitsubishi Electric Corp | 加速度センサ |
DE10038099A1 (de) * | 2000-08-04 | 2002-02-21 | Bosch Gmbh Robert | Mikromechanisches Bauelement |
US20040016995A1 (en) * | 2002-07-25 | 2004-01-29 | Kuo Shun Meen | MEMS control chip integration |
JP2004271312A (ja) * | 2003-03-07 | 2004-09-30 | Denso Corp | 容量型半導体センサ装置 |
US20050132803A1 (en) * | 2003-12-23 | 2005-06-23 | Baldwin David J. | Low cost integrated MEMS hybrid |
US7640807B2 (en) * | 2004-07-21 | 2010-01-05 | Hokuriku Electric Industry Co., Ltd. | Semiconductor Sensor |
CN101300913B (zh) * | 2004-11-12 | 2012-01-25 | 阿纳洛格装置公司 | 带间隔、带凸块部件结构 |
JP2007078641A (ja) * | 2005-09-16 | 2007-03-29 | Hitachi Metals Ltd | 変位検出装置 |
JP2008051658A (ja) * | 2006-08-24 | 2008-03-06 | Mitsumi Electric Co Ltd | Ic一体型加速度センサ及びその製造方法 |
CN103221777B (zh) * | 2010-11-18 | 2016-02-24 | 松下知识产权经营株式会社 | 惯性力传感器 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4930043A (en) * | 1989-02-28 | 1990-05-29 | United Technologies | Closed-loop capacitive accelerometer with spring constraint |
US5164328A (en) * | 1990-06-25 | 1992-11-17 | Motorola, Inc. | Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip |
US5355283A (en) * | 1993-04-14 | 1994-10-11 | Amkor Electronics, Inc. | Ball grid array with via interconnection |
-
1993
- 1993-09-30 FR FR9311672A patent/FR2710741B1/fr not_active Expired - Fee Related
-
1994
- 1994-09-29 JP JP7510153A patent/JPH09503298A/ja active Pending
- 1994-09-29 US US08/605,044 patent/US5734106A/en not_active Expired - Fee Related
- 1994-09-29 DE DE69405003T patent/DE69405003T2/de not_active Expired - Fee Related
- 1994-09-29 WO PCT/FR1994/001141 patent/WO1995009367A1/fr active IP Right Grant
- 1994-09-29 EP EP94928932A patent/EP0721588B1/de not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018219524A1 (de) * | 2018-11-15 | 2020-05-20 | Robert Bosch Gmbh | Verfahren zur Herstellung eines mikroelektromechanischen Sensors und mikroelektromechanischer Sensor |
US11958740B2 (en) | 2018-11-15 | 2024-04-16 | Robert Bosch Gmbh | Method for producing a microelectromechanical sensor and microelectromechanical sensor |
Also Published As
Publication number | Publication date |
---|---|
FR2710741B1 (fr) | 1995-10-27 |
US5734106A (en) | 1998-03-31 |
EP0721588A1 (de) | 1996-07-17 |
FR2710741A1 (fr) | 1995-04-07 |
DE69405003D1 (de) | 1997-09-18 |
WO1995009367A1 (fr) | 1995-04-06 |
JPH09503298A (ja) | 1997-03-31 |
EP0721588B1 (de) | 1997-08-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |