DE69331873D1 - Flüssigkristallapparat - Google Patents

Flüssigkristallapparat

Info

Publication number
DE69331873D1
DE69331873D1 DE69331873T DE69331873T DE69331873D1 DE 69331873 D1 DE69331873 D1 DE 69331873D1 DE 69331873 T DE69331873 T DE 69331873T DE 69331873 T DE69331873 T DE 69331873T DE 69331873 D1 DE69331873 D1 DE 69331873D1
Authority
DE
Germany
Prior art keywords
liquid crystal
crystal apparatus
liquid
crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69331873T
Other languages
English (en)
Other versions
DE69331873T2 (de
Inventor
Hideo Mori
Hisao Tajima
Hiroshi Takabayashi
Toshiaki Itazawa
Masanori Takahashi
Kenji Niibori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP35931392A external-priority patent/JPH06202136A/ja
Priority claimed from JP35931692A external-priority patent/JPH06202137A/ja
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69331873D1 publication Critical patent/DE69331873D1/de
Application granted granted Critical
Publication of DE69331873T2 publication Critical patent/DE69331873T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09281—Layout details of a single conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
DE69331873T 1992-12-26 1993-12-22 Flüssigkristallapparat Expired - Fee Related DE69331873T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP35931392A JPH06202136A (ja) 1992-12-26 1992-12-26 液晶装置
JP35931692A JPH06202137A (ja) 1992-12-26 1992-12-26 液晶装置

Publications (2)

Publication Number Publication Date
DE69331873D1 true DE69331873D1 (de) 2002-06-06
DE69331873T2 DE69331873T2 (de) 2002-11-14

Family

ID=26580948

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69331873T Expired - Fee Related DE69331873T2 (de) 1992-12-26 1993-12-22 Flüssigkristallapparat

Country Status (3)

Country Link
US (2) US5517208A (de)
EP (1) EP0604893B1 (de)
DE (1) DE69331873T2 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5808707A (en) * 1995-03-01 1998-09-15 Canon Kabushiki Kaisha Display apparatus
US5936850A (en) * 1995-03-03 1999-08-10 Canon Kabushiki Kaisha Circuit board connection structure and method, and liquid crystal device including the connection structure
JP3098392B2 (ja) * 1995-03-03 2000-10-16 シャープ株式会社 実装基板及びそれを用いた液晶モジュール
JP3139601B2 (ja) * 1995-03-08 2001-03-05 キヤノン株式会社 液晶表示装置
US6683594B1 (en) * 1995-04-20 2004-01-27 Canon Kabushiki Kaisha Display apparatus and assembly of its driving circuit
JPH08314390A (ja) * 1995-05-16 1996-11-29 Nec Shizuoka Ltd 個別呼出用受信機のリフレクタ保持構造
US6281891B1 (en) 1995-06-02 2001-08-28 Xerox Corporation Display with array and multiplexer on substrate and with attached digital-to-analog converter integrated circuit having many outputs
US6738123B1 (en) 1996-03-15 2004-05-18 Canon Kabushiki Kaisha Drive circuit connection structure including a substrate, circuit board, and semiconductor device, and display apparatus including the connection structure
JPH113041A (ja) * 1997-06-13 1999-01-06 Pioneer Electron Corp 表示パネルの取付装置
US5888076A (en) * 1997-06-13 1999-03-30 Japan Aviation Elecronics Industry, Limited LCD panel connector for use in connection between an LCD panel and a circuit board
JP3043710B2 (ja) 1997-08-04 2000-05-22 キヤノン株式会社 パネルを支持する支持構造、およびパネルと該パネルを支持する支持構造を有するパネル装置、および該パネル装置を用いた画像形成装置
US6731260B2 (en) * 1997-10-13 2004-05-04 Sanyo Electric Co., Ltd. Display device
JP3943682B2 (ja) * 1997-11-17 2007-07-11 株式会社東芝 平面表示装置
JP3659810B2 (ja) * 1998-08-05 2005-06-15 パイオニア株式会社 二次元表示装置の駆動モジュール取付構造
JP3535799B2 (ja) 2000-03-30 2004-06-07 キヤノン株式会社 液晶表示装置およびその駆動方法
JP3486599B2 (ja) 2000-03-31 2004-01-13 キヤノン株式会社 液晶素子の駆動方法
US6677664B2 (en) * 2000-04-25 2004-01-13 Fujitsu Hitachi Plasma Display Limited Display driver integrated circuit and flexible wiring board using a flat panel display metal chassis
JP4310039B2 (ja) * 2000-09-29 2009-08-05 エーユー オプトロニクス コーポレイション Ｉｃの放熱構造および表示装置
JP2003216057A (ja) * 2001-11-14 2003-07-30 Canon Inc 画像表示装置
JP2003298232A (ja) * 2002-04-02 2003-10-17 Sony Corp 多層配線基板の製造方法および多層配線基板
US6991349B2 (en) * 2002-12-30 2006-01-31 Chunghwa Picture Tubes, Ltd. Fixing apparatus for light source conductive wire of backlight module
KR100637149B1 (ko) * 2004-02-20 2006-10-20 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100615214B1 (ko) * 2004-03-29 2006-08-25 삼성에스디아이 주식회사 평판 디스플레이 장치
JP4490767B2 (ja) * 2004-08-27 2010-06-30 富士通株式会社 電子装置、および表示パネルの固定構造
KR100759550B1 (ko) * 2005-01-20 2007-09-18 삼성에스디아이 주식회사 디스플레이 모듈
EP1873580A4 (de) * 2005-04-19 2009-05-20 Fujitsu Ltd Flüssigkristallanzeigeeinrichtung und orientierungsverarbeitungsverfahren
US7742142B2 (en) * 2005-08-09 2010-06-22 Chunghwa Picture Tubes, Ltd. Display and tape carrier package structure
KR20080005732A (ko) * 2006-07-10 2008-01-15 삼성에스디아이 주식회사 디스플레이 장치 및 섀시 베이스와 보스의 결합 방법
KR100983574B1 (ko) 2007-02-15 2010-09-27 엘지디스플레이 주식회사 액정표시장치
TWI377399B (en) * 2008-12-30 2012-11-21 Au Optronics Corp Display panel apparatus
EP2546563A1 (de) * 2010-04-21 2013-01-16 Sharp Kabushiki Kaisha Beleuchtungsvorrichtung, anzeigevorrichtung sowie fernsehempfangsvorrichtung
KR20140038164A (ko) * 2012-09-20 2014-03-28 삼성디스플레이 주식회사 액정 표시 장치
TWI495074B (zh) * 2012-11-30 2015-08-01 Ind Tech Res Inst 減能結構
KR20150021368A (ko) * 2013-08-20 2015-03-02 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
CN111836460B (zh) * 2020-07-21 2022-09-06 昆山大洋电路板有限公司 一种线路板及其制备方法

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Publication number Priority date Publication date Assignee Title
US4418239A (en) * 1981-08-24 1983-11-29 Oak Industries Inc. Flexible connector with interconnection between conductive traces
JPS58116272U (ja) * 1982-01-30 1983-08-08 日本メクトロン株式会社 可撓性回路基板
JPS6059429U (ja) * 1983-09-30 1985-04-25 アルプス電気株式会社 スイツチ装置
JPS60159731A (ja) * 1984-01-30 1985-08-21 Sharp Corp 液晶表示体
JPH0817268B2 (ja) * 1984-04-25 1996-02-21 ソニー株式会社 プリント配線端子装置
US4621962A (en) * 1984-11-09 1986-11-11 Rozniecki Edward J Adjustment structure
JPS63313128A (ja) * 1987-06-17 1988-12-21 Hitachi Ltd 液晶表示装置
US5025348A (en) * 1987-11-20 1991-06-18 Casio Computer Co., Ltd. Bonding structure of an electronic device and a method for manufacturing the same
JPH01279105A (ja) * 1988-05-02 1989-11-09 Komatsu Ltd 部品の締結装置
JPH02264223A (ja) * 1989-04-05 1990-10-29 Matsushita Electric Ind Co Ltd 強誘電性液晶表示装置
JP2862900B2 (ja) * 1989-05-22 1999-03-03 シチズン時計株式会社 Ｌｃｄ表示器
EP0408773B1 (de) * 1989-07-15 1993-07-07 Firma Carl Freudenberg Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten oder Leiterplatten-Innenlagen
JPH03177884A (ja) * 1989-12-06 1991-08-01 Hitachi Ltd 液晶表示装置
JPH0427929A (ja) * 1990-05-23 1992-01-30 Matsushita Electric Ind Co Ltd 投射型画像表示装置
KR940006185Y1 (ko) * 1990-06-07 1994-09-10 가시오 게이상기 가부시끼가이샤 Ic 모듈
JPH0446376A (ja) * 1990-06-14 1992-02-17 Canon Inc 定着装置
JPH04298717A (ja) * 1991-02-04 1992-10-22 Mitsubishi Electric Corp 電子部品の端子結合構造
JPH04282618A (ja) * 1991-03-11 1992-10-07 Rohm Co Ltd 液晶表示装置
US5099393A (en) * 1991-03-25 1992-03-24 International Business Machines Corporation Electronic package for high density applications
US5631756A (en) * 1994-02-18 1997-05-20 Canon Kabushiki Kaisha Display apparatus with corner holding plates

Also Published As

Publication number Publication date
EP0604893A3 (de) 1995-01-18
EP0604893A2 (de) 1994-07-06
EP0604893B1 (de) 2002-05-02
US5517208A (en) 1996-05-14
DE69331873T2 (de) 2002-11-14
US5719752A (en) 1998-02-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee