DE69320092D1 - Durch Licht gesteigerte Diffusion-Strukturierung von organischen Polymer-Substraten - Google Patents

Durch Licht gesteigerte Diffusion-Strukturierung von organischen Polymer-Substraten

Info

Publication number
DE69320092D1
DE69320092D1 DE69320092T DE69320092T DE69320092D1 DE 69320092 D1 DE69320092 D1 DE 69320092D1 DE 69320092 T DE69320092 T DE 69320092T DE 69320092 T DE69320092 T DE 69320092T DE 69320092 D1 DE69320092 D1 DE 69320092D1
Authority
DE
Germany
Prior art keywords
structuring
diffusion
light
organic polymer
polymer substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69320092T
Other languages
English (en)
Other versions
DE69320092T2 (de
Inventor
William John Nebe
John Kirk Holzapfel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE69320092D1 publication Critical patent/DE69320092D1/de
Application granted granted Critical
Publication of DE69320092T2 publication Critical patent/DE69320092T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Formation Of Insulating Films (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DE69320092T 1992-05-07 1993-04-19 Durch Licht gesteigerte Diffusion-Strukturierung von organischen Polymer-Substraten Expired - Fee Related DE69320092T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/880,090 US5260163A (en) 1992-05-07 1992-05-07 Photoenhanced diffusion patterning for organic polymer films

Publications (2)

Publication Number Publication Date
DE69320092D1 true DE69320092D1 (de) 1998-09-10
DE69320092T2 DE69320092T2 (de) 1999-01-07

Family

ID=25375504

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69320092T Expired - Fee Related DE69320092T2 (de) 1992-05-07 1993-04-19 Durch Licht gesteigerte Diffusion-Strukturierung von organischen Polymer-Substraten

Country Status (8)

Country Link
US (1) US5260163A (de)
EP (1) EP0568853B1 (de)
JP (1) JP2597453B2 (de)
KR (1) KR960016320B1 (de)
CN (1) CN1090767C (de)
DE (1) DE69320092T2 (de)
MY (1) MY108761A (de)
TW (1) TW214628B (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5411628A (en) * 1993-10-21 1995-05-02 E. I. Du Pont De Nemours And Company Diffusion patterning process and screen therefor
JP3463362B2 (ja) * 1993-12-28 2003-11-05 カシオ計算機株式会社 電界発光素子の製造方法および電界発光素子
US5624782A (en) * 1994-04-14 1997-04-29 E. I. Du Pont De Nemours And Company Method of manufacturing thick-film resistor elements
US5495803A (en) * 1994-07-25 1996-03-05 Gerber Scientific Products, Inc. Method of forming a photomask for a printing plate with an ink jet
EP0742585A1 (de) * 1995-05-08 1996-11-13 E.I. Du Pont De Nemours And Company Verfahren und Zusammensetzung zur Diffusionsmusterung eines Bandes auf einem Substrat
EP0747911A1 (de) * 1995-06-06 1996-12-11 E.I. Du Pont De Nemours And Company Verfahren zur Herstellung eines Dickschichtwiderstandes
DE69607569T3 (de) * 1995-06-12 2004-11-04 Toray Industries, Inc. Benutzung einer fotoempfindlichen paste, verfahren zur herstellung einer plasmaanzeigetafel, sowie plasmaanzeigetafel, welche nach diesem verfahren herstellbar ist
US6197480B1 (en) 1995-06-12 2001-03-06 Toray Industries, Inc. Photosensitive paste, a plasma display, and a method for the production thereof
US5851732A (en) * 1997-03-06 1998-12-22 E. I. Du Pont De Nemours And Company Plasma display panel device fabrication utilizing black electrode between substrate and conductor electrode
AU6575098A (en) * 1997-03-25 1998-10-20 E.I. Du Pont De Nemours And Company Field emitter cathode backplate structures for display panels
US6328914B1 (en) * 1999-01-29 2001-12-11 Delphi Technologies, Inc. Thick-film paste with insoluble additive
US6235452B1 (en) 1999-08-05 2001-05-22 International Business Machines Corporation Detection of a gaseous substance emanating from a layer of polymeric composition
US6162490A (en) * 1999-09-07 2000-12-19 Iomega Corporation Method for applying an emissive material to a substrate
US20060208621A1 (en) * 1999-09-21 2006-09-21 Amey Daniel I Jr Field emitter cathode backplate structures for display panels
US20030011300A1 (en) * 2001-07-12 2003-01-16 Ponnusamy Palanisamy Passivating organic light emitting devices
JP2003107697A (ja) * 2001-09-28 2003-04-09 Fuji Photo Film Co Ltd 感光性転写材料、フォトマスク材料、フォトマスクおよびフォトマスクの製造方法
US20060027307A1 (en) * 2004-08-03 2006-02-09 Bidwell Larry A Method of application of a dielectric sheet and photosensitive dielectric composition(s) and tape(s) used therein
US20070085208A1 (en) * 2005-10-13 2007-04-19 Feng-Yu Hsu Interconnect structure
US20090123741A1 (en) * 2006-05-10 2009-05-14 Jivan Gulabrai Bhatt Lithographic Printing Plates and Processes for Making them
US7615483B2 (en) * 2006-12-22 2009-11-10 Palo Alto Research Center Incorporated Printed metal mask for UV, e-beam, ion-beam and X-ray patterning
US20080233280A1 (en) * 2007-03-22 2008-09-25 Graciela Beatriz Blanchet Method to form a pattern of functional material on a substrate by treating a surface of a stamp
KR101206250B1 (ko) * 2009-10-13 2012-11-28 주식회사 엘지화학 식각 마스크 패턴 형성용 페이스트 및 이의 스크린 인쇄법을 이용한 실리콘 태양전지의 제조방법
JPWO2011132744A1 (ja) * 2010-04-23 2013-07-18 シャープ株式会社 半導体装置の製造方法
CN103186037A (zh) * 2011-12-30 2013-07-03 中芯国际集成电路制造(上海)有限公司 一种制造半导体器件的光刻工艺方法
JPWO2015041007A1 (ja) * 2013-09-20 2017-03-02 並木精密宝石株式会社 基板とその製造方法、及び発光素子とその製造方法、及びその基板又は発光素子を有する装置
JP2018110137A (ja) * 2015-03-19 2018-07-12 アダマンド並木精密宝石株式会社 基板とその製造方法、及び発光素子とその製造方法、及びその基板又は発光素子を有する装置
WO2020214238A1 (en) * 2019-04-16 2020-10-22 Applied Materials, Inc. Method of thin film deposition in trenches
US11629402B2 (en) 2019-04-16 2023-04-18 Applied Materials, Inc. Atomic layer deposition on optical structures

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4003312A (en) * 1974-12-16 1977-01-18 Xerox Corporation Preparing waterless lithographic printing masters by ink jet printing
EP0001138A1 (de) * 1977-08-23 1979-03-21 Howard A. Fromson Verfahren zur Herstellung von lithographischen Druckplatten
JPS6050356B2 (ja) * 1980-11-29 1985-11-08 大日本インキ化学工業株式会社 連続パタ−ンメツキ用レジスト塗膜の形成方法
US4429027A (en) * 1981-05-21 1984-01-31 E. I. Du Pont De Nemours & Co. Photoimaging process
US4613560A (en) * 1984-12-28 1986-09-23 E. I. Du Pont De Nemours And Company Photosensitive ceramic coating composition
JPS6254253A (ja) * 1985-08-01 1987-03-09 Sanyo Kokusaku Pulp Co Ltd レリ−フ形成方法
US5032216A (en) * 1989-10-20 1991-07-16 E. I. Du Pont De Nemours And Company Non-photographic method for patterning organic polymer films

Also Published As

Publication number Publication date
KR960016320B1 (en) 1996-12-09
JP2597453B2 (ja) 1997-04-09
JPH0653135A (ja) 1994-02-25
EP0568853A1 (de) 1993-11-10
TW214628B (en) 1993-10-11
US5260163A (en) 1993-11-09
MY108761A (en) 1996-11-30
DE69320092T2 (de) 1999-01-07
CN1079827A (zh) 1993-12-22
CN1090767C (zh) 2002-09-11
EP0568853B1 (de) 1998-08-05
KR930023768A (ko) 1993-12-21

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee