DE69320092D1 - Durch Licht gesteigerte Diffusion-Strukturierung von organischen Polymer-Substraten - Google Patents
Durch Licht gesteigerte Diffusion-Strukturierung von organischen Polymer-SubstratenInfo
- Publication number
- DE69320092D1 DE69320092D1 DE69320092T DE69320092T DE69320092D1 DE 69320092 D1 DE69320092 D1 DE 69320092D1 DE 69320092 T DE69320092 T DE 69320092T DE 69320092 T DE69320092 T DE 69320092T DE 69320092 D1 DE69320092 D1 DE 69320092D1
- Authority
- DE
- Germany
- Prior art keywords
- structuring
- diffusion
- light
- organic polymer
- polymer substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Formation Of Insulating Films (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/880,090 US5260163A (en) | 1992-05-07 | 1992-05-07 | Photoenhanced diffusion patterning for organic polymer films |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69320092D1 true DE69320092D1 (de) | 1998-09-10 |
DE69320092T2 DE69320092T2 (de) | 1999-01-07 |
Family
ID=25375504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69320092T Expired - Fee Related DE69320092T2 (de) | 1992-05-07 | 1993-04-19 | Durch Licht gesteigerte Diffusion-Strukturierung von organischen Polymer-Substraten |
Country Status (8)
Country | Link |
---|---|
US (1) | US5260163A (de) |
EP (1) | EP0568853B1 (de) |
JP (1) | JP2597453B2 (de) |
KR (1) | KR960016320B1 (de) |
CN (1) | CN1090767C (de) |
DE (1) | DE69320092T2 (de) |
MY (1) | MY108761A (de) |
TW (1) | TW214628B (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5411628A (en) * | 1993-10-21 | 1995-05-02 | E. I. Du Pont De Nemours And Company | Diffusion patterning process and screen therefor |
JP3463362B2 (ja) * | 1993-12-28 | 2003-11-05 | カシオ計算機株式会社 | 電界発光素子の製造方法および電界発光素子 |
US5624782A (en) * | 1994-04-14 | 1997-04-29 | E. I. Du Pont De Nemours And Company | Method of manufacturing thick-film resistor elements |
US5495803A (en) * | 1994-07-25 | 1996-03-05 | Gerber Scientific Products, Inc. | Method of forming a photomask for a printing plate with an ink jet |
EP0742585A1 (de) * | 1995-05-08 | 1996-11-13 | E.I. Du Pont De Nemours And Company | Verfahren und Zusammensetzung zur Diffusionsmusterung eines Bandes auf einem Substrat |
EP0747911A1 (de) * | 1995-06-06 | 1996-12-11 | E.I. Du Pont De Nemours And Company | Verfahren zur Herstellung eines Dickschichtwiderstandes |
DE69607569T3 (de) * | 1995-06-12 | 2004-11-04 | Toray Industries, Inc. | Benutzung einer fotoempfindlichen paste, verfahren zur herstellung einer plasmaanzeigetafel, sowie plasmaanzeigetafel, welche nach diesem verfahren herstellbar ist |
US6197480B1 (en) | 1995-06-12 | 2001-03-06 | Toray Industries, Inc. | Photosensitive paste, a plasma display, and a method for the production thereof |
US5851732A (en) * | 1997-03-06 | 1998-12-22 | E. I. Du Pont De Nemours And Company | Plasma display panel device fabrication utilizing black electrode between substrate and conductor electrode |
AU6575098A (en) * | 1997-03-25 | 1998-10-20 | E.I. Du Pont De Nemours And Company | Field emitter cathode backplate structures for display panels |
US6328914B1 (en) * | 1999-01-29 | 2001-12-11 | Delphi Technologies, Inc. | Thick-film paste with insoluble additive |
US6235452B1 (en) | 1999-08-05 | 2001-05-22 | International Business Machines Corporation | Detection of a gaseous substance emanating from a layer of polymeric composition |
US6162490A (en) * | 1999-09-07 | 2000-12-19 | Iomega Corporation | Method for applying an emissive material to a substrate |
US20060208621A1 (en) * | 1999-09-21 | 2006-09-21 | Amey Daniel I Jr | Field emitter cathode backplate structures for display panels |
US20030011300A1 (en) * | 2001-07-12 | 2003-01-16 | Ponnusamy Palanisamy | Passivating organic light emitting devices |
JP2003107697A (ja) * | 2001-09-28 | 2003-04-09 | Fuji Photo Film Co Ltd | 感光性転写材料、フォトマスク材料、フォトマスクおよびフォトマスクの製造方法 |
US20060027307A1 (en) * | 2004-08-03 | 2006-02-09 | Bidwell Larry A | Method of application of a dielectric sheet and photosensitive dielectric composition(s) and tape(s) used therein |
US20070085208A1 (en) * | 2005-10-13 | 2007-04-19 | Feng-Yu Hsu | Interconnect structure |
US20090123741A1 (en) * | 2006-05-10 | 2009-05-14 | Jivan Gulabrai Bhatt | Lithographic Printing Plates and Processes for Making them |
US7615483B2 (en) * | 2006-12-22 | 2009-11-10 | Palo Alto Research Center Incorporated | Printed metal mask for UV, e-beam, ion-beam and X-ray patterning |
US20080233280A1 (en) * | 2007-03-22 | 2008-09-25 | Graciela Beatriz Blanchet | Method to form a pattern of functional material on a substrate by treating a surface of a stamp |
KR101206250B1 (ko) * | 2009-10-13 | 2012-11-28 | 주식회사 엘지화학 | 식각 마스크 패턴 형성용 페이스트 및 이의 스크린 인쇄법을 이용한 실리콘 태양전지의 제조방법 |
JPWO2011132744A1 (ja) * | 2010-04-23 | 2013-07-18 | シャープ株式会社 | 半導体装置の製造方法 |
CN103186037A (zh) * | 2011-12-30 | 2013-07-03 | 中芯国际集成电路制造(上海)有限公司 | 一种制造半导体器件的光刻工艺方法 |
JPWO2015041007A1 (ja) * | 2013-09-20 | 2017-03-02 | 並木精密宝石株式会社 | 基板とその製造方法、及び発光素子とその製造方法、及びその基板又は発光素子を有する装置 |
JP2018110137A (ja) * | 2015-03-19 | 2018-07-12 | アダマンド並木精密宝石株式会社 | 基板とその製造方法、及び発光素子とその製造方法、及びその基板又は発光素子を有する装置 |
WO2020214238A1 (en) * | 2019-04-16 | 2020-10-22 | Applied Materials, Inc. | Method of thin film deposition in trenches |
US11629402B2 (en) | 2019-04-16 | 2023-04-18 | Applied Materials, Inc. | Atomic layer deposition on optical structures |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4003312A (en) * | 1974-12-16 | 1977-01-18 | Xerox Corporation | Preparing waterless lithographic printing masters by ink jet printing |
EP0001138A1 (de) * | 1977-08-23 | 1979-03-21 | Howard A. Fromson | Verfahren zur Herstellung von lithographischen Druckplatten |
JPS6050356B2 (ja) * | 1980-11-29 | 1985-11-08 | 大日本インキ化学工業株式会社 | 連続パタ−ンメツキ用レジスト塗膜の形成方法 |
US4429027A (en) * | 1981-05-21 | 1984-01-31 | E. I. Du Pont De Nemours & Co. | Photoimaging process |
US4613560A (en) * | 1984-12-28 | 1986-09-23 | E. I. Du Pont De Nemours And Company | Photosensitive ceramic coating composition |
JPS6254253A (ja) * | 1985-08-01 | 1987-03-09 | Sanyo Kokusaku Pulp Co Ltd | レリ−フ形成方法 |
US5032216A (en) * | 1989-10-20 | 1991-07-16 | E. I. Du Pont De Nemours And Company | Non-photographic method for patterning organic polymer films |
-
1992
- 1992-05-07 US US07/880,090 patent/US5260163A/en not_active Expired - Lifetime
-
1993
- 1993-04-19 DE DE69320092T patent/DE69320092T2/de not_active Expired - Fee Related
- 1993-04-19 EP EP93106292A patent/EP0568853B1/de not_active Expired - Lifetime
- 1993-04-20 TW TW082103008A patent/TW214628B/zh not_active IP Right Cessation
- 1993-05-05 MY MYPI93000835A patent/MY108761A/en unknown
- 1993-05-06 KR KR93007720A patent/KR960016320B1/ko not_active IP Right Cessation
- 1993-05-07 CN CN93104958A patent/CN1090767C/zh not_active Expired - Fee Related
- 1993-05-07 JP JP5107069A patent/JP2597453B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR960016320B1 (en) | 1996-12-09 |
JP2597453B2 (ja) | 1997-04-09 |
JPH0653135A (ja) | 1994-02-25 |
EP0568853A1 (de) | 1993-11-10 |
TW214628B (en) | 1993-10-11 |
US5260163A (en) | 1993-11-09 |
MY108761A (en) | 1996-11-30 |
DE69320092T2 (de) | 1999-01-07 |
CN1079827A (zh) | 1993-12-22 |
CN1090767C (zh) | 2002-09-11 |
EP0568853B1 (de) | 1998-08-05 |
KR930023768A (ko) | 1993-12-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |